公开(公告)号：US20230038110A1

公开(公告)日：2023-02-09

申请号：US17858921

申请日：2022-07-06

申请人： SAMSUNG SDI CO., LTD. ,  SAMSUNG ELECTRONICS CO., LTD.

发明人： Minyoung LEE ,  Hyungrang MOON ,  Ryunmin HEO ,  Minsoo KIM ,  Youngkwon KIM ,  Jaehyun KIM ,  Changsoo WOO ,  Jung Min CHOI ,  Moohyun KOH ,  Jungah KIM ,  Sungan DO ,  Sang Won BAE ,  Hoon HAN ,  SukKoo HONG

IPC分类号： G03F7/16 ,  G03F7/11

摘要： A composition for removing edge beads from a metal-containing resist, and a method of forming patterns including step of removing edge beads using the same are provided. The composition for removing edge beads from a metal-containing resist includes an organic solvent, and a heptagonal ring compound substituted with at least one hydroxyl group (—OH). The heptagonal ring compound has at least two double bonds in the ring.

公开(公告)号：US20230037563A1

公开(公告)日：2023-02-09

申请号：US17858924

申请日：2022-07-06

申请人： SAMSUNG SDI CO., LTD. ,  SAMSUNG ELECTRONICS CO., LTD.

发明人： Ryunmin HEO ,  Hyungrang MOON ,  Minyoung LEE ,  Minsoo KIM ,  Youngkwon KIM ,  Jaehyun KIM ,  Changsoo WOO ,  Jung Min CHOI ,  Moohyun KOH ,  Jungah KIM ,  Sungan DO ,  Sang Won BAE ,  Hoon HAN ,  SukKoo HONG

IPC分类号： G03F7/32

摘要： A metal-containing photoresist developer composition, and a method of forming patterns including a step of developing using the same are provided. The metal-containing photoresist developer composition includes an organic solvent, and a heptagonal ring compound substituted with at least one hydroxy group (—OH). The heptagonal ring compound has at least two double bonds in the ring.

公开(公告)号：US20240231222A1

公开(公告)日：2024-07-11

申请号：US18212913

申请日：2023-06-22

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Kyungoh KIM ,  Sunghyun HAN ,  SukKoo HONG ,  Moo Hyun KOH ,  Haeng Deog KOH ,  Yoonhyun KWAK ,  Jaemyoung KIM

IPC分类号： G03F7/004 ,  C07F7/22 ,  H01L21/027

CPC分类号： G03F7/0042 ,  C07F7/2224 ,  H01L21/0275 ,  H01L21/0276

摘要： Provided is a photoresist composition including an organometallic compound including: a central metal; a first ligand compound; and a second ligand compound, wherein the first ligand compound bonds with the central metal, the second ligand compound does not bond with the central metal, and the first or second ligand compound includes a halogen element. The photoresist composition may improve photosensitivity while securing stability.