Embedded device including MRAM device

    公开(公告)号:US12239026B2

    公开(公告)日:2025-02-25

    申请号:US17748127

    申请日:2022-05-19

    Inventor: Jaehoon Kim

    Abstract: An embedded device includes a substrate including a magnetic random access memory (MRAM) region, the MRAM region having a cell block region, magnetic tunnel junction (MTJ) modules in the cell block region, each of the MTJ modules including a MTJ pattern, an insulating interlayer structure covering the MTJ modules, and magnetic field shielding structures in the insulating interlayer structure and adjacent to an outside of the cell block region, each of the magnetic field shielding structures extending in a vertical direction to face at least from an upper end of the MTJ pattern to a lower end of the MTJ pattern, and each of the magnetic field shielding structures including a ferromagnetic material.

    Semiconductor memory device
    15.
    发明授权

    公开(公告)号:US11700723B2

    公开(公告)日:2023-07-11

    申请号:US17193739

    申请日:2021-03-05

    CPC classification number: H10B12/30 H10B12/03 H10B12/05

    Abstract: A semiconductor memory device, including a first semiconductor pattern, and a second semiconductor pattern separated from the first semiconductor pattern in a vertical direction; a first bit line electrically connected to a first source/drain region of the first semiconductor pattern, and a second bit line electrically connected to a first source/drain region of the second semiconductor pattern; a word line structure in contact with the first semiconductor pattern and the second semiconductor pattern; and a first data storage element electrically connected to a second source/drain region of the first semiconductor pattern, and a second data storage element electrically connected to a second source/drain region of the second semiconductor pattern, wherein the first semiconductor pattern and the second semiconductor pattern are monocrystalline, and wherein a crystal orientation of the first semiconductor pattern is different from a crystal orientation of the second semiconductor pattern.

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