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公开(公告)号:US20250142994A1
公开(公告)日:2025-05-01
申请号:US18750406
申请日:2024-06-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Juhyeon BAEK , Dongchan Kim , Beomsuk Lee , Byoungho Kwon , Changkyu Lee , Hwiyoung Jeon
IPC: H01L27/146
Abstract: An image sensor includes unit pixels respectively including photodiodes in a substrate having frontside and backside surfaces, a sensor array area including at least one isolation structure configured to isolate the unit pixels from each other and vertically penetrating the substrate, and a capacitor area arranged adjacent to the sensor array area in a horizontal direction parallel to the backside surface of the substrate and including at least one capacitor on the frontside surface of the substrate and at least one dummy isolation structure located adjacent to the at least one capacitor to vertically penetrate the substrate, wherein one end surface of each of the at least one capacitor and the at least one dummy isolation structure is coplanar with the backside surface of the substrate, and the at least one isolation structure and the at least one dummy isolation structure include a same material.
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公开(公告)号:US12074189B2
公开(公告)日:2024-08-27
申请号:US17947702
申请日:2022-09-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sangsu Park , Kwansik Kim , Sangchun Park , Beomsuk Lee , Taeyon Lee
IPC: H01L27/146 , H01L31/032 , H04N25/13 , H04N25/616 , H04N25/617 , H10K30/65
CPC classification number: H01L27/14643 , H01L27/14609 , H01L27/14625 , H01L27/1463 , H01L27/14638 , H01L27/14665 , H04N25/13 , H04N25/617 , H10K30/65 , H01L27/14621 , H01L27/1464 , H01L31/0323 , H04N25/616
Abstract: An image sensor includes pixel regions separated by an isolation region and receiving incident light, color filters respectively disposed on a surface of the semiconductor substrate corresponding to the pixel regions, a cover insulating layer disposed on the surface of the semiconductor substrate and covering the color filters, first transparent electrodes disposed on the cover insulating layer and spaced apart to respectively overlap the color filters, an isolation pattern disposed on the cover insulating layer between the first transparent electrodes and having a trench spaced apart from the first transparent electrodes, a drain electrode disposed in the trench of the isolation pattern, and an organic photoelectric layer and a second transparent electrode sequentially disposed on the first transparent electrodes and the isolation pattern.
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13.
公开(公告)号:US20240234462A9
公开(公告)日:2024-07-11
申请号:US18204974
申请日:2023-06-02
Applicant: Samsung Electronics Co., Ltd.
Inventor: Minkwan Kim , Inyong Park , Jinsun Pyo , Beomsuk Lee , Sungeun Lee , In Sung Joe
IPC: H01L27/146 , G02B3/00
CPC classification number: H01L27/14627 , G02B3/0043 , H01L27/14621 , H01L27/1463 , H01L27/14634 , H01L27/14645 , H01L27/14685 , G02B1/14
Abstract: Image sensors and fabrication methods thereof. For example, the image sensor may include a first substrate having a first surface and a second surface that are opposite to each other, a plurality of pixels provided in the first substrate and arranged in pixel groups, each pixel group including four pixels arranged in two columns and two rows, a pixel separation structure in the first substrate and including a pixel group separation part that separates each pixel group from adjacent pixel groups and a pixel separation part that separates the pixels in each pixel group from each other, and a plurality of microlenses on the first surface and respectively overlapping the plurality of pixel groups. Each of the microlenses includes a central part that has a first curvature and an edge part that has a second curvature. The first curvature is less than the second curvature.
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公开(公告)号:US20230054728A1
公开(公告)日:2023-02-23
申请号:US17737226
申请日:2022-05-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sangchun Park , Sungbong Park , Beomsuk Lee
IPC: H01L27/146
Abstract: An image sensor includes pixels arranged parallel to an upper surface of a substrate and a pixel isolation film disposed between the pixels. Each pixel includes a floating diffusion region doped with impurities of a first conductivity type, a transfer gate structure adjacent to the floating diffusion region, and a transistor. The transfer gate structure includes a transfer gate electrode layer, a transfer gate insulating layer, and a transfer gate spacer adjacent to the transfer gate insulating layer in a first direction parallel to the upper surface of the substrate, and a portion of the transfer gate spacer is disposed between the floating diffusion region and the transfer gate electrode layer. In each pixel, a floating diffusion contact connected to the floating diffusion region is disposed more adjacent in the first direction to the pixel isolation film than to the transfer gate structure.
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公开(公告)号:US11574948B2
公开(公告)日:2023-02-07
申请号:US16711301
申请日:2019-12-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Changhwa Kim , Kwansik Kim , Dongchan Kim , Sang-Su Park , Beomsuk Lee , Taeyon Lee , Hajin Lim
IPC: H01L27/146 , H01L51/44 , H01L29/786
Abstract: An image sensor and a method of fabricating the image sensor, the image sensor including a semiconductor substrate having a first floating diffusion region, a molding pattern over the first floating diffusion region and including an opening, a first photoelectric conversion part at a surface of the semiconductor substrate, and a first transfer transistor connecting the first photoelectric conversion part to the first floating diffusion region. The first transfer transistor includes a channel pattern in the opening and a first transfer gate electrode. The channel pattern includes an oxide semiconductor. The channel pattern also includes a sidewall portion that covers a side surface of the opening, and a center portion that extends from the sidewall portion to a region over the first transfer gate electrode.
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16.
公开(公告)号:US11569298B2
公开(公告)日:2023-01-31
申请号:US17034316
申请日:2020-09-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sangchun Park , Kwansik Kim , Hongki Kim , Sangsu Park , Beomsuk Lee , Taeyon Lee , Gwideok Ryan Lee
IPC: H01L27/30 , H01L27/146 , H01L51/44
Abstract: An image sensor includes a first substrate having a first surface and a second surface opposite to the first surface. The first substrate includes an active pixel region having a plurality of active pixels. A plurality of lower electrode structures is disposed on the second surface of the first substrate and corresponds to the plurality of active pixels. An upper electrode is disposed on the plurality of lower electrode structures. An organic photoelectric conversion layer is disposed between the plurality of lower electrode structures and the upper electrode. A second substrate is disposed on the first surface of the first substrate. A driving circuit configured to drive the plurality of active pixels is disposed on the second substrate. The plurality of lower electrode structures includes a first barrier layer, a reflective layer disposed on the first barrier layer and a second barrier layer disposed on the reflective layer.
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公开(公告)号:US10361239B2
公开(公告)日:2019-07-23
申请号:US15696132
申请日:2017-09-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kwang-Min Lee , GwideokRyan Lee , Seokjin Kwon , Beomsuk Lee , Taeyon Lee , Dongmo Im
IPC: H01L27/146 , H04N9/04 , H04N9/07
Abstract: An image sensor having active, peripheral and dummy regions is provided as follows. A dummy through electrode is disposed in the substrate. An active through electrode is disposed in the substrate. An insulation structure in which a color filter is embedded is disposed on the substrate. A dummy bottom electrode is disposed on the insulation structure and connected electrically to the dummy through electrode. An active bottom electrode is disposed on the insulation structure and connected electrically to the active through electrode. A photoelectric conversion layer is disposed on the insulation structure. A top electrode is disposed on the photoelectric conversion layer and the dummy bottom electrode. The top electrode is connected electrically to the dummy bottom electrode. The photoelectric conversion layer is interposed between the top electrode and the active bottom electrode which are separated from each other.
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公开(公告)号:US20180190707A1
公开(公告)日:2018-07-05
申请号:US15813843
申请日:2017-11-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kwang-Min Lee , Seokjin Kwon , Hyeyun Park , Beomsuk Lee , Dongmo Im
IPC: H01L27/146 , H04N5/374
CPC classification number: H01L27/14645 , H01L27/14612 , H01L27/14621 , H01L27/14627 , H01L27/14636 , H01L27/14689 , H04N5/374
Abstract: An image sensor includes a substrate having a first surface and a second surface opposite to each other, a first floating diffusion region provided in the substrate and being adjacent to the first surface, a through-electrode provided in the substrate and electrically connected to the first floating diffusion region, an insulating structure, a bottom electrode, a photoelectric conversion layer, and a top electrode sequentially stacked on the second surface, a color filter buried in the insulating structure, and a top contact plug penetrating the insulating structure to connect the bottom electrode to the through-electrode.
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