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公开(公告)号:US11467697B2
公开(公告)日:2022-10-11
申请号:US17171218
申请日:2021-02-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hongki Kim , Jonghwan Kim , Jungsoo Kim , Chijeong Choi , Seungnyun Kim
Abstract: One embodiment provide an electronic device including: a housing including a touch area; a touch IC; a sensor circuit configured to generate a first signal in response to detecting a movement of the electronic device; a sensor hub; and a processor. The touch IC is configured to: when a contact on the touch area is detected, transmit a second signal to the sensor hub; and after transmitting the second signal to the sensor hub, transmit a third signal for identifying an event corresponding to the contact to the sensor hub. The sensor hub is configured to: when the first signal is received within a first interval starting from a time point at which the second signal is received, invalidate the first signal; and when the third signal is received from the touch IC, transmit the third signal or a fourth signal based on the third signal to the processor.
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公开(公告)号:US11412165B2
公开(公告)日:2022-08-09
申请号:US16986759
申请日:2020-08-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hongki Kim , Minkyung Kim , Minkwan Kim , Minho Jang , Insung Joe
IPC: H04N5/369 , H04N9/04 , H01L27/146
Abstract: An image sensor is presented which includes a pixel array including a plurality of image sensing pixels in a substrate, a phase detection shared pixel in the substrate, the phase detection shared pixel including two phase detection subpixels arranged next to each other, a color filter fence disposed on the plurality of image sensing pixels, and the phase detection shared pixel, the color filter fence defining a plurality of color filter spaces, a plurality of color filter layers respectively disposed in the plurality of color filter spaces on the plurality of image sensing pixels, and the phase detection shared pixel, a first micro-lens disposed on each of the plurality of image sensing pixels to have a first height, and a second micro-lens disposed to vertically overlap the two phase detection subpixels of the phase detection shared pixel and to have a second height greater than the first height.
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公开(公告)号:US11581347B2
公开(公告)日:2023-02-14
申请号:US16775937
申请日:2020-01-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hongki Kim , Donghyun Kim , Minkwan Kim , Minkyung Kim , Minho Jang , In Sung Joe
IPC: H01L27/146
Abstract: An image sensor and a method of manufacturing thereof are provided. The image sensor includes a substrate, a grid structure, and color filters. The substrate includes a pixel separation structure defining pixel regions, and a sub-pixel regions for each pixel region. The grid structure is disposed on the substrate and includes first fence segments provided between the sub-pixel regions, and second fence segments provided between neighboring pixel regions. The grid structure defines openings corresponding respectively to the sub-pixel regions. The color filters are disposed in the openings defined by the grid structure. Each of the color filters has a flat top surface and the flat top surface of each color filter is parallel to a bottom surface thereof.
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公开(公告)号:US11425484B2
公开(公告)日:2022-08-23
申请号:US17173030
申请日:2021-02-10
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hongki Kim , Kyuho Lee , Kiwook Han , Jungsoo Kim , Ikhyun Cho , Chijeong Choi , Yongsang Yun
IPC: H04R1/10
Abstract: An ear wearable device includes a housing, a speaker, a structure, nonconductive supporting member, and an Integrated Circuit (IC). The housing includes a nonconductive cover. The speaker is positioned in the housing. The structure is positioned in the housing and includes a nonconductive supporting member facing the nonconductive cover and positioned in the housing, and a first conductive pattern positioned on the nonconductive supporting member. The nonconductive bonding member is positioned between the structure and the nonconductive cover. The touch sensor IC is positioned in the housing and electrically connected with the first conductive pattern.
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公开(公告)号:US09559140B2
公开(公告)日:2017-01-31
申请号:US14465062
申请日:2014-08-21
Applicant: Samsung Electronics Co., Ltd.
Inventor: JeongWook Ko , Hongki Kim , Younghoon Park , Wonje Park , Yu Jin Ahn , Junetaeg Lee
IPC: H01L27/146
CPC classification number: H01L27/14685 , H01L27/14607 , H01L27/14621 , H01L27/14623 , H01L27/14627 , H01L27/14629 , H01L27/14636 , H01L27/1464 , H01L27/14641 , H01L27/14645 , H01L27/14687 , H04N5/374 , H04N5/378
Abstract: Example embodiments disclose an image sensor and a fabricating method thereof. An image sensor may include a semiconductor layer with a light-receiving region and a light-blocking region, the semiconductor layer including photoelectric conversion devices, a light-blocking layer on a surface of the semiconductor layer, color filters on the semiconductor layer and the light-blocking layer, and micro lenses on the color filters. The color filters are absent from an interface region between the light-receiving region and the light-blocking region.
Abstract translation: 示例性实施例公开了图像传感器及其制造方法。 图像传感器可以包括具有光接收区域和遮光区域的半导体层,所述半导体层包括光电转换装置,半导体层表面上的阻光层,半导体层上的滤色器和 遮光层和滤镜上的微透镜。 滤光器不在光接收区域和遮光区域之间的界面区域中。
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公开(公告)号:US12224296B2
公开(公告)日:2025-02-11
申请号:US17511754
申请日:2021-10-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hongki Kim , Changrok Moon , Taehyong Kim , Seungjae Oh , Jihyun Kwak
IPC: H01L27/146
Abstract: An image sensor includes: a semiconductor substrate that has a first surface and a second surface opposite to each other. The semiconductor substrate includes: a first trench that vertically extends from the first surface of the semiconductor substrate and provides a pixel region, and a second trench that vertically extends from the first surface of the semiconductor substrate and is disposed on the pixel region. The image sensor further includes: a pixel separation structure that vertically extends from the second surface of the semiconductor substrate and overlaps the first trench; and a gap-fill dielectric layer disposed on the first surface of the semiconductor substrate, wherein the gap-fill dielectric layer includes a pixel separation part and a scattering pattern part, wherein the pixel separation part is disposed in the first trench, and the scattering pattern part is disposed in the second trench.
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公开(公告)号:US20230328404A1
公开(公告)日:2023-10-12
申请号:US18336495
申请日:2023-06-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hongki Kim , Minkyung Kim , Minkwan Kim , Minho Jang , Insung Joe
IPC: H04N25/704 , H01L27/146 , H04N25/11
CPC classification number: H04N25/704 , H01L27/14645 , H01L27/14621 , H01L27/14685 , H04N25/11 , H01L27/1464 , H01L27/14641 , H01L27/14627 , H01L27/14629
Abstract: An image sensor is presented which includes a pixel array including a plurality of image sensing pixels in a substrate, a phase detection shared pixel in the substrate, the phase detection shared pixel including two phase detection subpixels arranged next to each other, a color filter fence disposed on the plurality of image sensing pixels, and the phase detection shared pixel, the color filter fence defining a plurality of color filter spaces, a plurality of color filter layers respectively disposed in the plurality of color filter spaces on the plurality of image sensing pixels, and the phase detection shared pixel, a first micro-lens disposed on each of the plurality of image sensing pixels to have a first height, and a second micro-lens disposed to vertically overlap the two phase detection subpixels of the phase detection shared pixel and to have a second height greater than the first height.
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公开(公告)号:US11026020B2
公开(公告)日:2021-06-01
申请号:US16520676
申请日:2019-07-24
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Youngbae Park , Changshik Yoon , Hongki Kim , Junhui Lee , Dongheon Jang , Sohae Kim , Hyunjong Roh , Limsam Lim , Hochul Hwang
Abstract: An electronic device includes a memory, a housing, an acoustic module comprising a coil and an acoustic membrane configured to be movable based on a signal applied to the coil, the acoustic module being disposed in an internal space of the housing, an amplifier, and a processor. The memory may store instructions that when executed by the processor cause the processor to apply a first signal to the coil through the amplifier to move the acoustic membrane in a first direction by a first distance and applying a second signal to the coil through the amplifier to move the acoustic membrane in a second direction different from the first direction and/or to move the acoustic membrane by a second distance different from the first distance after applying the first signal to the coil.
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公开(公告)号:US12294797B2
公开(公告)日:2025-05-06
申请号:US18336495
申请日:2023-06-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hongki Kim , Minkyung Kim , Minkwan Kim , Minho Jang , Insung Joe
IPC: H04N25/704 , H01L27/146 , H04N25/11
Abstract: An image sensor is presented which includes a pixel array including a plurality of image sensing pixels in a substrate, a phase detection shared pixel in the substrate, the phase detection shared pixel including two phase detection subpixels arranged next to each other, a color filter fence disposed on the plurality of image sensing pixels, and the phase detection shared pixel, the color filter fence defining a plurality of color filter spaces, a plurality of color filter layers respectively disposed in the plurality of color filter spaces on the plurality of image sensing pixels, and the phase detection shared pixel, a first micro-lens disposed on each of the plurality of image sensing pixels to have a first height, and a second micro-lens disposed to vertically overlap the two phase detection subpixels of the phase detection shared pixel and to have a second height greater than the first height.
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公开(公告)号:US11910112B2
公开(公告)日:2024-02-20
申请号:US17812795
申请日:2022-07-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hongki Kim , Minkyung Kim , Minkwan Kim , Minho Jang , Insung Joe
IPC: H04N25/704 , H01L27/146 , H04N25/11
CPC classification number: H04N25/704 , H01L27/1464 , H01L27/14621 , H01L27/14627 , H01L27/14629 , H01L27/14641 , H01L27/14645 , H01L27/14685 , H04N25/11
Abstract: An image sensor is presented which includes a pixel array including a plurality of image sensing pixels in a substrate, a phase detection shared pixel in the substrate, the phase detection shared pixel including two phase detection subpixels arranged next to each other, a color filter fence disposed on the plurality of image sensing pixels, and the phase detection shared pixel, the color filter fence defining a plurality of color filter spaces, a plurality of color filter layers respectively disposed in the plurality of color filter spaces on the plurality of image sensing pixels, and the phase detection shared pixel, a first micro-lens disposed on each of the plurality of image sensing pixels to have a first height, and a second micro-lens disposed to vertically overlap the two phase detection subpixels of the phase detection shared pixel and to have a second height greater than the first height.
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