公开(公告)号：US20210184719A1

公开(公告)日：2021-06-17

申请号：US17119504

申请日：2020-12-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeongho LEE ,  Byungjoon PARK ,  Sangho LEE

IPC: H04B1/40 ,  H04B7/06

Abstract: The present disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). A transceiver in a wireless communication system may include: a first circuit configured to up-convert a first digital signal corresponding to a first band and to up-convert a second digital signal corresponding to a second band using a same intermediate frequency (IF) frequency, and to analog-convert the up-converted signals into a first analog signal and a second analog signal; a second circuit configured to up-convert the first analog signal and the second analog signal to produce a first radio frequency (RF) signal of the first band and a second RF signal of the second band, and to output an RF signal of a third bandwidth including the first RF signal and the second RF signal; and a third circuit configured to separate the RF signal of the third bandwidth into the first RF signal and the second RF signal, to adjust a phase of the first RF signal to perform beamforming in the first band, and to adjust a phase of the second RF signal to perform beamforming in the second band.

公开(公告)号：US20200213017A1

公开(公告)日：2020-07-02

申请号：US16725323

申请日：2019-12-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jooseok LEE ,  Jeongho LEE ,  Juho SON

IPC: H04B17/12 ,  H01Q3/36 ,  H01Q3/26 ,  H01Q1/24 ,  H04B7/06

Abstract: A communication method and a system for converging a 4th-Generation (4G) communication system or a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. The disclosure provides an electronic device including a wireless communication module. The wireless communication module includes an antenna array including at least one antenna element, a phase shifter configured to control a phase of a beam radiating from the antenna array, a processor electrically connected to the phase shifter and configured to perform beamforming by controlling the phase shifter, and a memory including phase offset information of the wireless communication module.

公开(公告)号：US20190140721A1

公开(公告)日：2019-05-09

申请号：US16177767

申请日：2018-11-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeongho LEE ,  Dae Young LEE ,  Sunggi YANG

IPC: H04B7/06 ,  H01Q3/26 ,  H01Q3/34 ,  H03K21/38

Abstract: The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). An electronic device including a first radio frequency (RF) chip and a second RF chip is provided. The electronic device includes a modem configured to transmit a first clock signal to the second RF chip, the first RF chip connected to the modem and configured to receive a second clock signal from the modem, and the second RF chip electrically connected to the first RF chip through a transmission line and configured to receive the second clock signal from the first RF chip and to measure a phase of the transmission line based on the first clock signal and the second clock signal. The first clock signal and the second clock signal have different frequencies.

公开(公告)号：US20240222280A1

公开(公告)日：2024-07-04

申请号：US18363995

申请日：2023-08-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： MyungDo CHO ,  Youngchan KO ,  Gyeongho KIM ,  Byung Ho KIM ,  Yongkoon LEE ,  Jeongho LEE

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L23/5381 ,  H01L21/486 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49833 ,  H01L23/49866 ,  H01L23/5385 ,  H01L23/5386 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2924/182

Abstract: A semiconductor package may include: a first redistribution layer structure; a bridge structure on the first redistribution layer structure; a plurality of conductive pillars on the first redistribution layer structure and side by side with the bridge structure; an encapsulant molding the bridge structure and the plurality of conductive pillars on the first redistribution layer structure; a second redistribution layer structure on the encapsulant, wherein a region of the second redistribution layer structure on the bridge structure is defined as a first region and a region other than the first region is defined as a second region; and a plurality of bonding pads at the first region. A vertical thickness of the first region may be smaller than a vertical thickness of the second region.

公开(公告)号：US20240145397A1

公开(公告)日：2024-05-02

申请号：US18403583

申请日：2024-01-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeongho LEE ,  Doohwan LEE

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L25/10 ,  H01L25/18

CPC classification number: H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/5383 ,  H01L23/5386 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L25/105 ,  H01L25/18 ,  H01L2221/68372 ,  H01L2224/16227 ,  H01L2224/214 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/18161

Abstract: A semiconductor package includes a frame structure having a core portion and a lower pad under the core portion. A cavity penetrates the core portion, and a semiconductor chip is arranged in the cavity and has an active surface on which a bump pad is arranged and a non-active surface facing the active surface. A redistribution structure is positioned under the frame structure and the semiconductor chip, and is connected to the lower pad and the bump pad. A molding member covers the frame structure and the semiconductor chip and fills the cavity. The molding member surrounds a lower surface of the frame structure, the active surface of the semiconductor chip, the lower pad, and the bump pad.

公开(公告)号：US20230289157A1

公开(公告)日：2023-09-14

申请号：US18199103

申请日：2023-05-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongjin SOHN ,  Eunseob KO ,  Soomin KIM ,  Youngjoo KIM ,  Jaesung PARK ,  Jeongho LEE ,  Moonyoung JUNG ,  Areum JEONG ,  Sungho CHEON

IPC: G06F8/52 ,  G06F8/65

CPC classification number: G06F8/52 ,  G06F8/65

Abstract: A system server includes a communication module for communicating with an electronic device and an external server, a memory that stores device information and production information for a plurality of electronic devices received from the external server, and a processor operatively connected to the communication module and the memory where the processor is configured to receive unique state information from the electronic device based on the electronic device accessing the system server, compare the received unique state information with the device information for the plurality of electronic devices stored in the memory to determine whether a binary change is required in the electronic device, generate change information including information about a binary to be changed, and transmit the generated change information to the electronic device.

公开(公告)号：US20220254725A1

公开(公告)日：2022-08-11

申请号：US17731841

申请日：2022-04-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangkyu LEE ,  Jingu KIM ,  Kyungdon MUN ,  Shanghoon SEO ,  Jeongho LEE

IPC: H01L23/538 ,  H01L25/00 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L25/10

Abstract: A semiconductor package is disclosed. The semiconductor package includes a back-side wiring substrate and a front-side redistribution layer which are in parallel, and a connector, a semiconductor chip and an encapsulator which are between the back-side wiring substrate and the front-side redistribution layer. The encapsulator surrounds surfaces of the connector and the semiconductor chip. The back-side wiring substrate includes a core layer, a back-side via plug extending through the core layer, and a back-side redistribution layer on the back-side via plug.

公开(公告)号：US20220147470A1

公开(公告)日：2022-05-12

申请号：US17466726

申请日：2021-09-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeongho LEE ,  Younho Jeon ,  Daehui Kim ,  Heehyun Nam

IPC: G06F13/16 ,  G06F13/40

Abstract: A device configured to communicate through a bus may include a first interface circuit configured to, based on a first protocol, provide first access to a first memory through the bus and a second interface circuit configured to, based on a second protocol, provide a non-coherent input/output (I/O) interface through the bus. The second interface circuit may be configured to access the first memory in response to a message received through the bus based on the second protocol to provide second access to the first memory through the bus.

公开(公告)号：US20210218376A1

公开(公告)日：2021-07-15

申请号：US17250748

申请日：2019-08-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunchul PARK ,  Byungjoon PARK ,  Daehyun KANG ,  Juho SON ,  Sunggi YANG ,  Jeongho LEE ,  Yunsung CHO

IPC: H03F3/24 ,  H03F1/32 ,  H03F3/193 ,  H03F3/21 ,  H03F1/08 ,  H03F1/56

Abstract: Disclosed is a 5G (5th generation) or pre-5G communication system for supporting a data transmission rate higher than that of a 4G (4th generation) communication system such as long-term evolution (LTE). A transmission device comprises: a first amplification unit having a common source structure, including cross coupled capacitors, and amplifying an input signal; a second amplification unit, having a common gate structure, for amplifying a signal output from the first amplification unit; and a first removal unit which is connected to output terminals of the first amplification unit and input terminals of the second amplification unit and which removes at least one portion of second harmonics. The first removal unit can offset, with respect to a fundamental frequency, at least some of parasitic capacitance generated from the output terminals of the first amplification unit and the input terminals of the second amplification unit, and can ground a signal having a secondary harmonic frequency with respect to the secondary harmonic frequency.

公开(公告)号：US20210119662A1

公开(公告)日：2021-04-22

申请号：US17072512

申请日：2020-10-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeongho LEE ,  Byungjoon PARK ,  Daehyun KANG ,  Donghyun LEE ,  Jooseok LEE

IPC: H04B1/40 ,  H04B1/00 ,  H04B7/06

Abstract: A transceiver in a wireless communication system is provided. The transceiver includes a first circuit configured to convert a digital signal having a third bandwidth, a second circuit configured to separate the analog signal into a first analog signal corresponding to the first band and a second analog signal corresponding to the second band, up-convert the first analog signal and the second analog signal to generate a first radio frequency (RF) signal in the first band and a second RF signal in the second band, and output an RF signal having the third bandwidth, and a third circuit configured to separate the RF signal into the first RF signal and the second RF signal, adjust a phase of the first RF signal for beamforming in the first band, and adjust a phase of the second RF signal for beamforming in the second band.