公开(公告)号：US20240162135A1

公开(公告)日：2024-05-16

申请号：US18215292

申请日：2023-06-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jingu KIM ,  Yieok KWON ,  Wooyoung KIM ,  Gongje LEE ,  Sangkyu LEE ,  Bongju CHO

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L23/49838 ,  H01L21/4857 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49822 ,  H01L24/16 ,  H01L25/0657 ,  H01L25/50 ,  H01L23/291 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2924/0665

Abstract: A semiconductor package includes a lower redistribution wiring layer; and a first semiconductor device on the lower redistribution wiring layer, the first semiconductor device being connected to the lower redistribution wiring layer via conductive bumps, wherein the lower redistribution wiring layer includes: a first redistribution wire in a first lower insulating layer; an insulating structure layer having an opening that exposes a portion of the first redistribution wire, the insulating structure layer including a first photosensitive insulating layer, a light blocking layer on the first photosensitive insulating layer, and a second photosensitive insulating layer on the light blocking layer; a second redistribution wire in the opening of the insulating structure layer, the second redistribution wire including a redistribution via contacting the first redistribution wire, and a redistribution line stacked on the redistribution via; and bonding pads bonded to the conductive bumps and electrically connected to the second redistribution wire.

公开(公告)号：US20210398923A1

公开(公告)日：2021-12-23

申请号：US17154041

申请日：2021-01-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myungsam KANG ,  Sangkyu LEE ,  Yongkoon LEE

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/538 ,  H01L23/552 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01Q1/22 ,  H01Q1/52

Abstract: A semiconductor package includes a front redistribution structure having a first surface and a second surface, opposite to the first surface, a dielectric layer, an antenna substrate including a plurality of antenna members in the dielectric layer, a semiconductor chip having a connection pad connected to the plurality of antenna members, a conductive core structure having a first through-hole accommodating the antenna substrate and a second through-hole accommodating the semiconductor chip, and a rear redistribution structure including a conductive cover layer exposing an upper portion of the antenna substrate and covering an upper portion of the semiconductor chip, and a conductive via connecting the conductive cover layer to the conductive core structure.

公开(公告)号：US20220254725A1

公开(公告)日：2022-08-11

申请号：US17731841

申请日：2022-04-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangkyu LEE ,  Jingu KIM ,  Kyungdon MUN ,  Shanghoon SEO ,  Jeongho LEE

IPC: H01L23/538 ,  H01L25/00 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L25/10

Abstract: A semiconductor package is disclosed. The semiconductor package includes a back-side wiring substrate and a front-side redistribution layer which are in parallel, and a connector, a semiconductor chip and an encapsulator which are between the back-side wiring substrate and the front-side redistribution layer. The encapsulator surrounds surfaces of the connector and the semiconductor chip. The back-side wiring substrate includes a core layer, a back-side via plug extending through the core layer, and a back-side redistribution layer on the back-side via plug.

公开(公告)号：US20220006173A1

公开(公告)日：2022-01-06

申请号：US17205055

申请日：2021-03-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongkoon LEE ,  Jingu KIM ,  Sangkyu LEE

IPC: H01Q1/22 ,  H01L23/66 ,  H01L23/00

Abstract: A semiconductor package includes a redistribution wiring layer having redistribution wirings, a semiconductor chip on the redistribution wiring layer, a frame on the redistribution wiring layer, the frame surrounding the semiconductor chip, and the frame having core connection wirings electrically connected to the redistribution wirings, and an antenna structure on the frame, the antenna structure including a ground pattern layer, a first antenna insulation layer, a radiator pattern layer, a second antenna insulation layer, and a director pattern layer sequentially stacked on one another.

公开(公告)号：US20240258274A1

公开(公告)日：2024-08-01

申请号：US18236673

申请日：2023-08-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangkyu LEE ,  Yi Eok KWON

IPC: H01L25/065 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L21/568 ,  H01L24/05 ,  H01L24/08 ,  H01L24/16 ,  H01L24/24 ,  H01L24/73 ,  H01L25/50 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/0557 ,  H01L2224/05647 ,  H01L2224/08145 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/24227 ,  H01L2224/244 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73259 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548

Abstract: Provided is a semiconductor package including a redistribution layer, a three-dimensional integrated circuit (3D IC) structure on the redistribution layer, a plurality of conductive posts on the redistribution layer adjacent to the 3D IC structure, a molding material on the redistribution layer and encapsulating the 3D IC structure and the plurality of conductive posts, and a printed circuit board (PCB) on the molding material.

公开(公告)号：US20210233859A1

公开(公告)日：2021-07-29

申请号：US16990717

申请日：2020-08-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangkyu LEE ,  Jingu KIM ,  Kyungdon MUN ,  Shanghoon SEO ,  Jeongho LEE

IPC: H01L23/538 ,  H01L25/10 ,  H01L25/00 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683

Abstract: A semiconductor package is disclosed. The semiconductor package includes a back-side wiring substrate and a front-side redistribution layer which are in parallel, and a connector, a semiconductor chip and an encapsulator which are between the back-side wiring substrate and the front-side redistribution layer. The encapsulator surrounds surfaces of the connector and the semiconductor chip. The back-side wiring substrate includes a core layer, a back-side via plug extending through the core layer, and a back-side redistribution layer on the back-side via plug.

公开(公告)号：US20170111076A1

公开(公告)日：2017-04-20

申请号：US15292258

申请日：2016-10-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong-Chul CHOI ,  Li-Yeon KANG ,  Kwangmin GIL ,  Jinkeun PARK ,  Min-Woo YOO ,  Sangsoo LEE ,  Min-Jong LIM ,  Jae-Hoon CHOI ,  Chang-Ryong HEO ,  Dongsub KIM ,  Sangkyu LEE

IPC: H04B1/3888

CPC classification number: H04B1/3888 ,  H04B1/38 ,  H04M1/185

Abstract: An electronic device may include: at least one protective member disposed in at least one area of the electronic device; at least one sensor configured to detect the drop of the electronic device; a protective member driving module configured to activate the protective member to change the shape of the protective member according to whether the drop of the electronic device is detected; and at least one processor configured to receive a drop sensing signal detected by the sensor and to control the protective member driving module to change the shape of the protective member.