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公开(公告)号：US11456284B2
公开(公告)日：2022-09-27
申请号：US16939678
申请日：2020-07-27
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L25/065 , H01L25/18 , H01L23/00 , H01L23/552 , H01L23/64 , H01L21/78 , H01L21/66 , H01L25/00 , H01L23/66 , H01Q1/22 , H01Q1/48
摘要： Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more microelectronic devices are stacked on the substrate and the components are connected with conductive material in preformed holes in dielectric material in the bond lines aligned with TSVs of the devices and the exposed conductors of the substrate. Methods of fabrication are also disclosed.
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公开(公告)号：US11281392B2
公开(公告)日：2022-03-22
申请号：US16995345
申请日：2020-08-17
摘要： Systems, apparatuses, and methods related to media management, including “garbage collection,” in memory or storage systems or sub-systems, such as solid state drives, are described. For example, a criticality value can be determined and used as a basis for managing a garbage collection operation on a data block. A controller or the system or sub-system may determine that a criticality value associated with performing a garbage collection operation satisfies a condition. Based on determining that the condition is satisfied, a parameter associated with performing the garbage collection operation can be adjusted. The garbage collection operation is performed on the data block stored on the memory component using the adjusted parameter.
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公开(公告)号：US20210118851A1
公开(公告)日：2021-04-22
申请号：US16939720
申请日：2020-07-27
IPC分类号： H01L25/065 , H01L25/18 , H01L23/00 , H01L23/552 , H01L23/64 , H01L21/78 , H01L21/66 , H01L25/00
摘要： Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more microelectronic devices are stacked on the substrate, each microelectronic device comprising an active surface operably coupled to conductive traces extending over a dielectric material to via locations beyond at least one side of the stack, at least one surface mount component operably coupled to conductive traces of at least one dielectric material, and vias extending through the dielectric materials at the via locations and comprising conductive material in contact with at least some of the conductive traces of each of the two or more electronic devices and extending to exposed conductors of the substrate.
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公开(公告)号：US10803969B1
公开(公告)日：2020-10-13
申请号：US16553842
申请日：2019-08-28
IPC分类号： G11C11/409 , G11C29/02 , G06F21/79 , G06F12/14
摘要： Apparatuses and methods related to authenticating memory. Memory devices can be authenticated utilizing authentication codes. An authentication code can be generated based on information stored in a fuse array of the memory device. The authentication code can be compared to an externally provided authentication code to authenticate the memory device. The memory device may be authenticated to ensure that the memory device is not a security threat.
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公开(公告)号：US20240272703A1
公开(公告)日：2024-08-15
申请号：US18438912
申请日：2024-02-12
发明人： Priya Vemparala Guruswamy , Barbara J. Bailey , Marsela Pontoh , Aparna U. Limaye , Tejas Jagadeesh
CPC分类号： G06F3/011 , G01N33/0034 , G06V10/10
摘要： Methods, apparatuses, and systems associated with a smart nose with machine learning are described. A system can include a smart nose device configured to receive an odor and create a first odor vector associated with the odor. The system can include an image detection device configured to receive a plurality of images while the odor is received and identify a plurality of objects within the plurality of images. The system can also include a computing device to refine the first odor vector based on the identified plurality of objects, create, utilizing a machine learning model, a second odor vector based on the refined first odor vector and an odor pattern database, and predict the odor based on the second odor vector.
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公开(公告)号：US11664057B2
公开(公告)日：2023-05-30
申请号：US17374601
申请日：2021-07-13
CPC分类号： G11C7/1012 , G11C5/06 , G11C7/109 , G11C7/1039 , G11C7/1063
摘要： Apparatus and methods are disclosed, including memory devices and systems. Example memory devices, systems and methods include a buffer to translate high speed data interactions on a host interface side into slower, wider data interactions on a DRAM interface side. Example memory devices, systems and methods include a multiplexer circuit to further facilitate use of slower, and wider bandwidth memory devices. Devices and methods described may be configured to substantially match the capacity of a narrower, higher speed host interface.
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17.发明授权公开(公告)号：US11362070B2
公开(公告)日：2022-06-14
申请号：US16939650
申请日：2020-07-27
IPC分类号： H01L23/552 , H01L25/065 , H01L25/18 , H01L23/00 , H01L23/64 , H01L21/78 , H01L21/66 , H01L25/00 , H01L23/66 , H01Q1/22 , H01Q1/48
摘要： Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more stacks of microelectronic devices are located on the substrate, and microelectronic devices of the stacks are connected to vertical conductive paths external to the stacks and extending to the substrate and to lateral conductive paths extending between the stacks. Methods of fabrication are also disclosed.
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公开(公告)号：US20220171562A1
公开(公告)日：2022-06-02
申请号：US17673408
申请日：2022-02-16
摘要： Systems, apparatuses, and methods related to media management, including “garbage collection,” in memory or storage systems or sub-systems, such as solid state drives, are described. For example, a criticality value can be determined and used as a basis for managing a garbage collection operation on a data block. A controller or the system or sub-system may determine that a criticality value associated with performing a garbage collection operation satisfies a condition. Based on determining that the condition is satisfied, a parameter associated with performing the garbage collection operation can be adjusted. The garbage collection operation is performed on the data block stored on the memory component using the adjusted parameter.
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公开(公告)号：US20220020403A1
公开(公告)日：2022-01-20
申请号：US17374601
申请日：2021-07-13
摘要： Apparatus and methods are disclosed, including memory devices and systems. Example memory devices, systems and methods include a buffer to translate high speed data interactions on a host interface side into slower, wider data interactions on a DRAM interface side. Example memory devices, systems and methods include a multiplexer circuit to further facilitate use of slower, and wider bandwidth memory devices. Devices and methods described may be configured to substantially match the capacity of a narrower, higher speed host interface.
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公开(公告)号：US11144214B2
公开(公告)日：2021-10-12
申请号：US16522454
申请日：2019-07-25
摘要： Apparatuses and methods related to memory authentication. Memory devices can be authenticated utilizing authentication codes. An authentication code can be generated based on information stored in a fuse array of the memory device. The authentication code can be stored in the memory device. The stored authentication code can be compared to a captured authentication code based on fuse array information broadcast to memory components of the memory device. The authenticity of the memory device can be determined based on the comparison and can result in placing the memory device in an unlocked state.
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