公开(公告)号：US20190305430A1

公开(公告)日：2019-10-03

申请号：US15939180

申请日：2018-03-28

Applicant: Intel IP Corporation

Inventor： Trang Thai ,  Sidharth Dalmia

IPC: H01Q9/04 ,  H01Q21/00 ,  H01Q19/13

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: a substrate including an antenna feed structure; an antenna patch, wherein the antenna patch is a millimeter wave antenna patch; and an air cavity between the antenna patch and the substrate.

公开(公告)号：US20190139915A1

公开(公告)日：2019-05-09

申请号：US16306833

申请日：2016-06-03

Applicant: Intel IP Corporation

Inventor： Sidharth Dalmia ,  Igal Yehuda Kushnir

IPC: H01L23/66 ,  H01Q1/22 ,  H01L23/00 ,  H01L23/522 ,  H01L23/552 ,  H01L23/42

Abstract: Wireless modules having a semiconductor package attached to an antenna package and cap package are disclosed. The semiconductor package may have one or more electronic components disposed thereon. The antenna package may be communicatively coupled to the semiconductor package using by one or more coupling pads. The antenna package may further have one or more radiating elements for transmitting and or receiving wireless signals. The cap package may also be attached to the semiconductor package on a side opposing the side on which the antenna package is disposed. The cap package may provide routing and/or additional antenna elements. The cap package may also allow for thermal grease to be dispensed therethrough. The antenna package, the cap package, and the semiconductor package may have dissimilar number of interconnect layers and/or dissimilar materials of construct.

公开(公告)号：US10741932B2

公开(公告)日：2020-08-11

申请号：US16146672

申请日：2018-09-28

Applicant: INTEL IP CORPORATION

Inventor： Trang Thuy Thai ,  Sidharth Dalmia ,  Jonathan C. Jensen ,  Josef Hagn ,  Baljit Singh ,  Bhagyashree S. Ganore ,  Daniel Roberts Cox ,  Evan A. Chenelly

IPC: H01Q1/02 ,  H01Q21/06 ,  H01Q13/16 ,  H01Q1/52 ,  H01Q5/392 ,  H01Q1/24 ,  H01Q9/28 ,  H01Q19/28 ,  H01Q1/38 ,  H01Q21/28 ,  H01Q9/04

Abstract: The techniques described herein relate to a Radio Frequency (RF) communication module for a hand-held mobile electronic device. The Radio Frequency (RF) communication module includes a circuit board and a plurality of antennas disposed on a top side and bottom side of the circuit board. The plurality of antennas comprise a first subset of antennas comprising end-fire antennas and a second subset of antennas comprising broadside antennas. The first subset of antennas and the second subset of antennas also have a bandwidth of approximately 40 percent. The Radio Frequency (RF) communication module also includes a shielded area comprising circuitry coupled to the circuit board for controlling the antennas.

公开(公告)号：US20190103682A1

公开(公告)日：2019-04-04

申请号：US16146672

申请日：2018-09-28

Applicant: INTEL IP CORPORATION

Inventor： Trang Thuy Thai ,  Sidharth Dalmia ,  Jonathan C. Jensen ,  Josef Hagn ,  Baljit Singh ,  Bhagyashree S. Ganore ,  Daniel Roberts Cox ,  Evan A. Chenelly

IPC: H01Q21/06 ,  H01Q13/16 ,  H01Q5/392 ,  H01Q1/52 ,  H01Q1/02

CPC classification number: H01Q21/064 ,  H01Q1/02 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q1/526 ,  H01Q5/392 ,  H01Q9/0414 ,  H01Q9/28 ,  H01Q13/16 ,  H01Q19/28 ,  H01Q21/28

Abstract: The techniques described herein relate to a Radio Frequency (RF) communication module for a hand-held mobile electronic device. The Radio Frequency (RF) communication module includes a circuit board and a plurality of antennas disposed on a top side and bottom side of the circuit board. The plurality of antennas comprise a first subset of antennas comprising end-fire antennas and a second subset of antennas comprising broadside antennas. The first subset of antennas and the second subset of antennas also have a bandwidth of approximately 40 percent. The Radio Frequency (RF) communication module also includes a shielded area comprising circuitry coupled to the circuit board for controlling the antennas.

公开(公告)号：US11855353B2

公开(公告)日：2023-12-26

申请号：US16933444

申请日：2020-07-20

Applicant: Intel IP Corporation

Inventor： Trang Thuy Thai ,  Sidharth Dalmia ,  Jonathan C. Jensen ,  Josef Hagn ,  Baljit Singh ,  Bhagyashree S. Ganore ,  Daniel Roberts Cox ,  Evan A. Chenelly

IPC: H01Q1/38 ,  H01Q21/06 ,  H01Q13/16 ,  H01Q1/02 ,  H01Q1/52 ,  H01Q5/392 ,  H01Q1/24 ,  H01Q9/28 ,  H01Q19/28 ,  H01Q21/28 ,  H01Q9/04

CPC classification number: H01Q21/064 ,  H01Q1/02 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q1/526 ,  H01Q5/392 ,  H01Q9/0414 ,  H01Q9/28 ,  H01Q13/16 ,  H01Q19/28 ,  H01Q21/28

Abstract: The techniques described herein relate to a Radio Frequency (RF) communication module for a hand-held mobile electronic device. The Radio Frequency (RF) communication module includes a circuit board and a plurality of antennas disposed on a top side and bottom side of the circuit board. The plurality of antennas comprise a first subset of antennas comprising end-fire antennas and a second subset of antennas comprising broadside antennas. The first subset of antennas and the second subset of antennas also have a bandwidth of approximately 40 percent. The Radio Frequency (RF) communication module also includes a shielded area comprising circuitry coupled to the circuit board for controlling the antennas.

公开(公告)号：US20190067163A1

公开(公告)日：2019-02-28

申请号：US16102117

申请日：2018-08-13

Applicant: Intel IP Corporation

Inventor： Quan Qi ,  Carlton E. Hanna ,  Eytan Mann ,  Sidharth Dalmia

IPC: H01L23/433 ,  H01L23/367 ,  H01L21/48 ,  H01L23/538 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/4334 ,  H01L21/4814 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/96 ,  H01L2223/6677 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/38 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures included herein may include a die on a first substrate, at least one first component adjacent the die on the first substrate, and molding material on the first substrate, wherein the at least one component and the die are embedded in the molding material. A second substrate may be physically coupled to the first substrate. A communication structure may be disposed on a top surface of the second substrate, wherein at least one second component may also be located on the top surface of the second substrate.

公开(公告)号：US20180034134A1

公开(公告)日：2018-02-01

申请号：US15225527

申请日：2016-08-01

Applicant: Intel IP Corporation

Inventor： Sidharth Dalmia

IPC: H01Q1/24 ,  H01Q5/49

CPC classification number: H01Q1/243 ,  H01Q5/49 ,  H01Q19/30 ,  H01Q21/28 ,  H01Q21/29

Abstract: In various embodiments, the disclosure describes systems and methods that can be use in connection with electronic devices (for example, mobile devices) and can include one or more a dies, first antenna elements/feeding elements electrically coupled to the die, and second antenna elements/parasitic elements disposed on at least a portion of the electronic device. In one embodiment, the parasitic elements can be disposed near the feeding element and in a spaced relationship over one or more gaps. Further the parasitic elements can be electrically coupled to the feeding element over the gap. In various embodiments, the disclosed systems and methods can be used to implement a Yagi-Uda antenna in an electronic device, for example, a mobile device.