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公开(公告)号：US10940265B2
公开(公告)日：2021-03-09
申请号：US16435517
申请日：2019-06-09
摘要： A digital biomedical device includes a substrate forming a reservoir, a membrane comprising a first layer and a second layer having a strain therebetween, the membrane sealing the reservoir, and a controller configured to activate the membrane and release at least a portion of the strain causing the membrane curl and open the reservoir.
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公开(公告)号：US10923458B2
公开(公告)日：2021-02-16
申请号：US16592296
申请日：2019-10-03
发明人： Stephen W. Bedell , Bing Dang , Ning Li , Frank R. Libsch , Devendra K. Sadana
IPC分类号： H01L33/62 , H01L25/075 , H01L33/30 , H01L33/32
摘要： A structure containing a vertical light emitting diode (LED) is provided. The vertical LED is present in an opening located in a display substrate, and the vertical LED is coupled to a back contact structure via a magnetic back contact structure. A first top contact structure contacts a topmost surface of the vertical LED and a second top contact structure contacts a surface of the back contact structure.
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公开(公告)号：US10892643B2
公开(公告)日：2021-01-12
申请号：US15920803
申请日：2018-03-14
IPC分类号： H02J50/00 , H04B1/3827 , H02J50/10 , H02J50/80 , H02J50/90 , H02J50/40 , A61L2/26 , A61L2/10 , A61L2/04 , A61L2/16
摘要： Systems, devices, and techniques facilitating wirelessly charging and/or communicating with one or more electronic devices (e.g., electronic wearable devices) are provided. A device can comprise a memory and a storage component that can be operatively coupled to the memory. The storage component can comprise one or more recesses that can receive a second device that can be charged by the storage component. The storage component can comprise a charging circuit and an inductive circuit that can be coupled to the charging circuit. The storage component can harvest energy from one or more energy sources to charge the charging circuit. Based on the energy harvested, the inductive circuit can inductively couple to the second device having a second inductive circuit and positioned in at least one of the recesses and the inductive circuit can charge a power source of the second device.
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公开(公告)号：US10687425B2
公开(公告)日：2020-06-16
申请号：US15821446
申请日：2017-11-22
发明人： Paul S. Andry , Qianwen Chen , Bing Dang , John U. Knickerbocker , Minhua Lu , Robert J. Polastre , Bucknell C. Webb
IPC分类号： H05K3/30 , H05K1/18 , H05K3/00 , H05K3/34 , H05K1/11 , H05K1/03 , H05K1/02 , G01R31/44 , G01R31/309 , G01R31/28 , H05K13/00
摘要： An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.
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公开(公告)号：US20200098638A1
公开(公告)日：2020-03-26
申请号：US16693526
申请日：2019-11-25
摘要： A support structure for use in fan-out wafer level packaging is provided that includes, a silicon handler wafer having a first surface and a second surface opposite the first surface, a release layer is located above the first surface of the silicon handler wafer, and a layer selected from the group consisting of an adhesive layer and a redistribution layer is located on a surface of the release layer. After building-up a fan-out wafer level package on the support structure, infrared radiation is employed to remove (via laser ablation) the release layer, and thus remove the silicon handler wafer from the fan-out wafer level package.
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16.发明授权公开(公告)号：US10522383B2
公开(公告)日：2019-12-31
申请号：US14668534
申请日：2015-03-25
IPC分类号： H01L21/683 , C08L63/00 , C08G59/06 , C09J163/00 , C09J171/00 , C08K3/04 , C09J9/00
摘要： A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.
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公开(公告)号：US10393798B2
公开(公告)日：2019-08-27
申请号：US15821403
申请日：2017-11-22
发明人： Paul S. Andry , Qianwen Chen , Bing Dang , John U. Knickerbocker , Minhua Lu , Robert J. Polastre , Bucknell C. Webb
IPC分类号： G01R31/309 , G01R31/28 , H05K3/34 , H05K3/30 , H05K3/00 , H05K1/18 , H05K1/11 , H05K1/03 , H05K1/02 , H05K13/00
摘要： An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.
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公开(公告)号：US20190115243A1
公开(公告)日：2019-04-18
申请号：US16214422
申请日：2018-12-10
发明人： Paul S. Andry , Russell A. Budd , Bing Dang , Li-Wen Hung , John U. Knickerbocker , Cornelia Kang-I Tsang
IPC分类号： H01L21/683 , B32B43/00 , H01L21/78 , B23K26/57 , H01L21/67
CPC分类号： H01L21/6835 , B23K26/57 , B32B43/006 , B32B2457/14 , H01L21/67092 , H01L21/78 , H01L23/544 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2223/54426 , H01L2223/54453 , H01L2224/94 , H01L2924/10253 , H01L2924/14 , Y10S156/93 , Y10S156/941 , Y10T156/1158 , Y10T156/1917
摘要： A bonded structure contains a substrate containing at least one feature, the substrate having a top surface; a first release layer overlying the top surface of the substrate, the first release layer being absorptive of light having a first wavelength for being decomposed by the light; an adhesive layer overlying the first release layer, and a second release layer overlying the adhesive layer. The second release layer is absorptive of light having a second wavelength for being decomposed by the light having the second wavelength. The bonded structure further contains a handle substrate that overlies the second release layer, where the handle substrate is substantially transparent to the light having the first wavelength and the second wavelength. Also disclosed is a debonding method to process the bonded structure to remove and reclaim the adhesive layer for re-use. In another embodiment a multi-step method optically cuts and debonds a bonded structure.
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公开(公告)号：US20190088481A1
公开(公告)日：2019-03-21
申请号：US15859608
申请日：2017-12-31
发明人： Russell A. Budd , Qianwen Chen , Bing Dang , Jeffrey D. Gelorme , Li-wen Hung , John U. Knickerbocker
IPC分类号： H01L21/20 , H01L21/683 , B24B7/22
CPC分类号： H01L21/2007 , B24B7/228 , H01L21/6835 , H01L23/49827 , H01L2221/68318 , H01L2221/6834
摘要： Small size chip handling and electronic component integration are accomplished using handle fixturing to transfer die or other electronic components from a full area array to a targeted array. Area array dicing of a thinned device wafer on a handle wafer/panel may be followed by selective or non-selective de-bonding of targeted die or electronic components from the handle wafer and optional attachment to a carrier such as a transfer head or tape. Alignment fiducials may facilitate precision alignment of the transfer head or tape to the device wafer and subsequently to the targeted array. Alternatively, the dies or other electronic elements are transferred selectively from either a carrier or the device wafer to the targeted array.
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公开(公告)号：US20180323472A1
公开(公告)日：2018-11-08
申请号：US15585924
申请日：2017-05-03
发明人： Qianwen Chen , Bing Dang , John U. Knickerbocker
IPC分类号： H01M10/0585 , H01M10/0525 , A61B5/00
CPC分类号： H01M10/0585 , A61B5/681 , A61B5/6861 , A61B2560/0214 , H01M10/0525 , H01M2220/30
摘要： A method for integrating a thin film microbattery with electronic circuitry includes forming a release layer over a handler, forming a thin film microbattery over the release layer of the handler, removing the thin film microbattery from the handler, depositing the thin film microbattery on an interposer, forming electronic circuitry on the interposer, and sealing the thin film microbattery and the electronic circuitry to create individual microbattery modules.
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