发明申请
- 专利标题： MINIATURIZED ELECTRONICS PACKAGE WITH PATTERNED THIN FILM SOLID STATE BATTERY
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申请号： US15585924申请日： 2017-05-03
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公开(公告)号： US20180323472A1公开(公告)日： 2018-11-08
- 发明人: Qianwen Chen , Bing Dang , John U. Knickerbocker
- 申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 主分类号： H01M10/0585
- IPC分类号： H01M10/0585 ; H01M10/0525 ; A61B5/00
摘要：
A method for integrating a thin film microbattery with electronic circuitry includes forming a release layer over a handler, forming a thin film microbattery over the release layer of the handler, removing the thin film microbattery from the handler, depositing the thin film microbattery on an interposer, forming electronic circuitry on the interposer, and sealing the thin film microbattery and the electronic circuitry to create individual microbattery modules.
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