公开(公告)号：US11422291B2

公开(公告)日：2022-08-23

申请号：US16611338

申请日：2018-05-02

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Qichuan Yu ,  Han Nee Ng ,  Tobias Senn ,  John A. Vidallon ,  Ramon Opeda, Jr. ,  Attilio Ferrari ,  Hartmut Rudmann ,  Martin Schubert

IPC: G02B3/00 ,  B29D11/00 ,  G03F7/00 ,  B29C43/36

Abstract: The method for manufacturing a multitude of devices comprises: providing a replication tool comprising a tool material; conditioning the replication tool, wherein the conditioning comprises applying a treatment to the tool material, wherein the treatment comprises exposing the tool material to a conditioning material. And it further comprises, after the conditioning: carrying out one or more replication processes, wherein in each of the one or more replication processes, one or more of the devices are produced from a replication material by replication using the replication tool. The treatment can comprise dimensionally changing the tool material by the exposure of the tool material to the conditioning material. Before carrying out the replication processes, the conditioning material can be hardened and removed.

公开(公告)号：US09859327B2

公开(公告)日：2018-01-02

申请号：US15367257

申请日：2016-12-02

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Simon Gubser ,  Susanne Westenhöfer ,  Stephan Heimgartner ,  Jens Geiger ,  Sonja Hanselmann ,  Christoph Friese ,  Xu Yi ,  Thng Chong Kim ,  John A. Vidallon ,  Ji Wang ,  Qi Chuan Yu ,  Kam Wah Leong

IPC: H01L21/00 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/58

CPC classification number: H01L27/14685 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14687 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2933/0058 ,  H01L2924/00

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

公开(公告)号：US20170084663A1

公开(公告)日：2017-03-23

申请号：US15367257

申请日：2016-12-02

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Simon Gubser ,  Susanne Westenhöfer ,  Stephan Heimgartner ,  Jens Geiger ,  Sonja Hanselmann ,  Christoph Friese ,  Xu Yi ,  Thng Chong Kim ,  John A. Vidallon ,  Ji Wang ,  Qi Chuan Yu ,  Kam Wah Leong

IPC: H01L27/146 ,  H01L31/0232 ,  H01L33/58

CPC classification number: H01L27/14685 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14687 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2933/0058 ,  H01L2924/00

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

公开(公告)号：US20150340265A1

公开(公告)日：2015-11-26

申请号：US14408890

申请日：2013-06-28

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Stephan Heimgartner ,  John A. Vidallon

IPC: H01L21/683 ,  B32B37/12 ,  B32B38/18 ,  B32B37/18

CPC classification number: H01L21/6838 ,  B32B37/12 ,  B32B37/18 ,  B32B38/1858 ,  B32B2457/00 ,  B32B2551/00

Abstract: Techniques are described for holding a wafer or wafer sub-stack to facilitate further processing of the wafer of sub-stack. In some implementations, a wafer or wafer sub-stack is held by a vacuum chuck in a manner that can help reduce bending of the wafer or wafer sub-stack.

Abstract translation: 描述了用于保持晶片或晶片子堆以促进子堆的晶片的进一步处理的技术。 在一些实施方案中，晶片或晶片子堆叠由真空吸盘保持，以便有助于减小晶片或晶片子堆叠的弯曲。

公开(公告)号：US20150325613A1

公开(公告)日：2015-11-12

申请号：US14743073

申请日：2015-06-18

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Simon Gubser ,  Susanne Westenhöfer ,  Stephan Heimgartner ,  Jens Geiger ,  Xu Yi ,  Thng Chong Kim ,  John A. Vidallon ,  Ji Wang ,  Qi Chuan Yu ,  Kam Wah Leong

IPC: H01L27/146 ,  G02B7/02 ,  F21V5/04 ,  G02B13/00 ,  G02B5/22

CPC classification number: H01L27/14623 ,  F21V5/048 ,  F21Y2115/10 ,  G02B5/22 ,  G02B7/02 ,  G02B13/0085 ,  H01L24/94 ,  H01L25/50 ,  H01L31/0203 ,  H01L31/0543 ,  H01L33/486 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2933/0033 ,  H04N5/2252 ,  H04N5/2257 ,  Y02E10/52 ,  Y10T29/41 ,  H01L2924/00

Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.

Abstract translation: 光电模块包括光电器件和透明盖。 在透明盖的侧壁上设置不透明的材料，这有助于减少透明盖的侧面的光泄漏，或者有助于减少杂散光进入模块。 模块可以例如在晶片级工艺中制造。 在一些实施方案中，诸如沟槽的开口形成在透明晶片中。 然后可以使用例如真空注射工具用不透明材料填充沟槽。 当随后将包括沟槽填充的透明晶片的晶片堆叠分离成单个模块时，结果是每个模块可以包括具有被不透明材料覆盖的侧壁的透明盖。

公开(公告)号：US20150036046A1

公开(公告)日：2015-02-05

申请号：US14339623

申请日：2014-07-24

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Simon Gubser ,  Susanne Westenhöfer ,  Stephan Heimgartner ,  Jens Geiger ,  Xu Yi ,  Thng Chong Kim ,  John A. Vidallon ,  Ji Wang ,  Qi Chuan Yu ,  Kam Wah Leong

IPC: H04N5/225 ,  H01L25/00

CPC classification number: H01L27/14623 ,  F21V5/048 ,  F21Y2115/10 ,  G02B5/22 ,  G02B7/02 ,  G02B13/0085 ,  H01L24/94 ,  H01L25/50 ,  H01L31/0203 ,  H01L31/0543 ,  H01L33/486 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2933/0033 ,  H04N5/2252 ,  H04N5/2257 ,  Y02E10/52 ,  Y10T29/41 ,  H01L2924/00

Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.