-
11.发明申请公开(公告)号：US20170229505A1
公开(公告)日：2017-08-10
申请号：US15329112
申请日：2015-07-22
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Simon Gubser , Sonja Hanselmann , Qichuan Yu , Cris Calsena , Guo Xiong Wu , Hartmut Rudmann
IPC: H01L27/146 , H01L25/04
CPC classification number: H01L27/14618 , H01L25/042 , H01L27/14623 , H01L27/14634 , H01L27/14636 , H01L27/14685 , H01L27/14687 , H01L2224/48091 , H01L2924/00014
Abstract: This disclosure describes optoelectronic modules that include an image sensor having at least two regions separated optically from one another by a wall. The wall can include a bridge portion that extends over the image sensor and further can include a cured adhesive portion, part of which is disposed between a lower surface of the bridge portion and an upper surface of the image sensor. Various techniques are described for fabricating the modules so as to help prevent the adhesive from contaminating sensitive regions of the image sensor. The wall can be substantially light-tight so as to prevent undesired optical cross-talk, for example, between a light emitter located to one side of the wall and a light sensitive region of the image sensor located to the other side of the wall.
-
公开(公告)号：US09478681B2
公开(公告)日：2016-10-25
申请号：US14140712
申请日：2013-12-26
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Simon Gubser , Hakan Karpuz
IPC: H01L33/00 , H01L31/0232 , G02B13/00 , H01L27/146 , G02B3/00 , G02B5/18
CPC classification number: G02B13/0085 , G02B3/0031 , G02B5/005 , G02B5/1852 , H01L27/14625 , H01L27/14627 , H01L27/14685 , H01L31/02325 , H01L31/02327 , H01L33/58 , H01L51/5275 , H01S5/005
Abstract: Fabricating a wafer-scale spacer/optics structure includes replicating optical replication elements and spacer replication sections directly onto an optics wafer (or other wafer) using a single replication tool. The replicated optical elements and spacer elements can be composed of the same or different materials.
Abstract translation: 制造晶片级间隔物/光学结构包括使用单个复制工具将光学复制元件和间隔物复制部分直接复制到光学晶片（或其他晶片）上。 复制的光学元件和间隔元件可以由相同或不同的材料组成。
-
13.发明申请公开(公告)号：US20160223746A1
公开(公告)日：2016-08-04
申请号：US15014244
申请日：2016-02-03
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Simon Gubser , Frank Sobel , Alexander Bietsch , Jens Geiger
CPC classification number: G02B6/0065 , B29D11/00663
Abstract: The waveguide structure can be manufactured on wafer-scale and comprises a holding structure and a first and a second waveguides each having a core and two end faces. The holding structure comprises a separation structure being arranged between the first and the second waveguide and provides an optical separation between the first and the second waveguide in a region between the end faces of the first and second waveguides. A method for manufacturing such a waveguide structure with at least one waveguide comprises shaping replication material by means of tool structures to obtain the end faces, hardening the replication material and removing the tool structures from a waveguide structures wafer comprising a plurality of so-obtained waveguides.
Abstract translation: 波导结构可以在晶片级制造，并且包括保持结构和每个具有芯和两个端面的第一和第二波导。 保持结构包括布置在第一和第二波导之间的分离结构，并且在第一和第二波导的端面之间的区域中提供第一和第二波导之间的光学隔离。 用于制造具有至少一个波导的这种波导结构的方法包括通过工具结构对复制材料进行成形以获得端面，硬化复制材料并从包括多个如此获得的波导的波导结构晶片中去除工具结构 。
-
公开(公告)号：US20140291703A1
公开(公告)日：2014-10-02
申请号：US14303968
申请日：2014-06-13
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Alexander Bietsch , Susanne Westenhöfer , Simon Gubser
IPC: H01L31/167 , H01L31/0232
CPC classification number: H01L31/167 , G01S7/4813 , G01S17/026 , H01L31/02325 , H01L31/02327 , H01L31/12 , H01L31/173
Abstract: An optical proximity sensor module includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member disposed between the substrate and the optics member. The separation member may surround the light emitter and the light detector, and may include a wall portion that extends from the substrate to the optics member and that separates the light emitter and the light detector from one another. The separation member may be composed, for example, of a non-transparent polymer material containing a pigment, such as carbon black.
Abstract translation: 光学接近传感器模块包括基板，安装在基板的第一表面上的光发射器，所述发光器可操作以发射第一波长的光;以及光检测器，安装在基板的第一表面上，光检测器 可操作以检测第一波长的光。 该模块包括基本上平行于基板设置的光学部件，以及设置在基板和光学部件之间的分离部件。 分离构件可以围绕光发射器和光检测器，并且可以包括从基板延伸到光学构件并将光发射器和光检测器彼此分离的壁部分。 分离构件可以由例如碳黑等含有颜料的不透明聚合物材料构成。
-
公开(公告)号：US20140183585A1
公开(公告)日：2014-07-03
申请号：US14140712
申请日：2013-12-26
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Simon Gubser , Hakan Karpuz
IPC: H01L31/0232 , H01L33/58
CPC classification number: G02B13/0085 , G02B3/0031 , G02B5/005 , G02B5/1852 , H01L27/14625 , H01L27/14627 , H01L27/14685 , H01L31/02325 , H01L31/02327 , H01L33/58 , H01L51/5275 , H01S5/005
Abstract: Fabricating a wafer-scale spacer/optics structure includes replicating optical replication elements and spacer replication sections directly onto an optics wafer (or other wafer) using a single replication tool. The replicated optical elements and spacer elements can be composed of the same or different materials.
Abstract translation: 制造晶片级间隔物/光学结构包括使用单个复制工具将光学复制元件和间隔物复制部分直接复制到光学晶片（或其他晶片）上。 复制的光学元件和间隔元件可以由相同或不同的材料组成。
-
Patent Agency Ranking
公开(公告)号：US11009660B2
公开(公告)日：2021-05-18
申请号：US16483987
申请日：2018-02-09
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Simon Gubser , Qichuan Yu , Choon Hein Law , Ji Wang
Abstract: The present disclosure describes light guides and a method of manufacturing light guides that include a rectangular prism-shaped bar, a first polymer or metal cladding on four sides of the rectangular prism-shaped bar, and a second polymer cladding disposed on the first polymer cladding on the four sides of the rectangular prism-shaped bar.
-
17.发明授权公开(公告)号：US10199412B2
公开(公告)日：2019-02-05
申请号：US15329112
申请日：2015-07-22
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Simon Gubser , Sonja Hanselmann , Qichuan Yu , Cris Calsena , Guo Xiong Wu , Hartmut Rudmann
IPC: H01L27/146 , H01L25/04
Abstract: This disclosure describes optoelectronic modules that include an image sensor having at least two regions separated optically from one another by a wall. The wall can include a bridge portion that extends over the image sensor and further can include a cured adhesive portion, part of which is disposed between a lower surface of the bridge portion and an upper surface of the image sensor. Various techniques are described for fabricating the modules so as to help prevent the adhesive from contaminating sensitive regions of the image sensor. The wall can be substantially light-tight so as to prevent undesired optical cross-talk, for example, between a light emitter located to one side of the wall and a light sensitive region of the image sensor located to the other side of the wall.
-
18.发明申请公开(公告)号：US20180372943A1
公开(公告)日：2018-12-27
申请号：US15992273
申请日：2018-05-30
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Simon Gubser , Frank Sobel , Alexander Bietsch , Jens Geiger
Abstract: The waveguide structure can be manufactured on wafer-scale and comprises a holding structure and a first and a second waveguides each having a core and two end faces. The holding structure comprises a separation structure being arranged between the first and the second waveguide and provides an optical separation between the first and the second waveguide in a region between the end faces of the first and second waveguides. A method for manufacturing such a waveguide structure with at least one waveguide comprises shaping replication material by means of tool structures to obtain the end faces, hardening the replication material and removing the tool structures from a waveguide structures wafer comprising a plurality of so-obtained waveguides.
-
公开(公告)号：US10126530B2
公开(公告)日：2018-11-13
申请号：US15271288
申请日：2016-09-21
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Simon Gubser , Hakan Karpuz
IPC: H01L33/60 , G02B13/00 , H01L31/0232 , H01L27/146 , G02B3/00 , G02B5/00 , H01L33/58 , H01L51/52 , H01S5/00 , G02B5/18
Abstract: Fabricating a wafer-scale spacer/optics structure includes replicating optical replication elements and spacer replication sections directly onto an optics wafer (or other wafer) using a single replication tool. The replicated optical elements and spacer elements can be composed of the same or different materials.
-
公开(公告)号：US09859327B2
公开(公告)日：2018-01-02
申请号：US15367257
申请日：2016-12-02
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Sonja Hanselmann , Christoph Friese , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
IPC: H01L21/00 , H01L27/146 , H01L31/0203 , H01L31/0232 , H01L33/58
CPC classification number: H01L27/14685 , H01L27/14618 , H01L27/14625 , H01L27/14687 , H01L31/0203 , H01L31/02325 , H01L33/58 , H01L2224/48091 , H01L2924/00014 , H01L2924/12044 , H01L2933/0058 , H01L2924/00
Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
-
-
-
-
-
-
-
-
-
Search Results
46
records
(took 0.018 seconds)
