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11.发明申请公开(公告)号：US20170317126A1
公开(公告)日：2017-11-02
申请号：US15651510
申请日：2017-07-17
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Stephan Heimgartner , Ville Kettunen , Nicola Spring , Alexander Bietsch , Mario Cesana , Hartmut Rudmann , Jukka Alasirnio , Robert Lenart
IPC: H01L27/146 , H01L31/18 , H01L31/0232 , G02B27/00 , H01L31/0216 , H04N5/225
CPC classification number: H01L27/14625 , G02B27/0025 , H01L27/14627 , H01L27/14685 , H01L27/14687 , H01L31/02162 , H01L31/02164 , H01L31/02325 , H01L31/18 , H04N5/2254 , Y10T29/49826
Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.
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12.发明授权公开(公告)号：US09748297B2
公开(公告)日：2017-08-29
申请号：US14177552
申请日：2014-02-11
Applicant: Heptagon Micro Optics Pte. Ltd. , Franco Rinaldo
Inventor： Stephan Heimgartner , Ville Kettunen , Nicola Spring , Alexander Bietsch , Mario Cesana , Hartmut Rudmann , Jukka Alasirnio , Robert Lenart
IPC: H04N5/225 , H01L27/146 , G02B27/00 , H01L31/18 , H01L31/0216 , H01L31/0232
CPC classification number: H01L27/14625 , G02B27/0025 , H01L27/14627 , H01L27/14685 , H01L27/14687 , H01L31/02162 , H01L31/02164 , H01L31/02325 , H01L31/18 , H04N5/2254 , Y10T29/49826
Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.
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公开(公告)号：US10101555B2
公开(公告)日：2018-10-16
申请号：US14905391
申请日：2014-07-16
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Jukka Alasirnio , Hartmut Rudmann , Mario Cesana , Stephan Heimgartner
Abstract: Camera modules include a lens, a lens stack and/or an array of lenses. One or more of the lenses have a non-circular shape, which in some cases can provide greater flexibility in the dimensions of the module and can result in a very small camera module.
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14.发明授权Optical modules including focal length adjustment and fabrication of the optical modules 有权光学模块包括焦距调整和光学模块的制造公开(公告)号：US09595553B2
公开(公告)日：2017-03-14
申请号：US14064550
申请日：2013-10-28
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Stephan Heimgartner , Ville Kettunen , Nicola Spring , Alexander Bietsch , Mario Cesana , Hartmut Rudmann , Jukka Alasirnio , Robert Lenart
IPC: H04N5/222 , H01L27/146 , G02B27/00 , H04N5/225 , H01L31/18 , H01L31/0216 , H01L31/0232
CPC classification number: H01L27/14625 , G02B27/0025 , H01L27/14627 , H01L27/14685 , H01L27/14687 , H01L31/02162 , H01L31/02164 , H01L31/02325 , H01L31/18 , H04N5/2254 , Y10T29/49826
Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.
Abstract translation: 制造光学器件可以包括在衬底上安装多个单独的透镜系统，将衬底的厚度调整到至少一些透镜系统的下方，以为透镜系统提供相应的焦距校正，随后将衬底分离成多个 光学模块，每个光学模块包括安装在基板的一部分上的透镜系统之一。 调整衬底的厚度可以包括例如微加工衬底以在透镜系统的至少一些下方形成相应的孔，或者在透镜系统的至少一些之下添加一个或多个层，以便校正透镜系统中的变化 镜头系统的焦距。
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15.发明申请STACKS OF ARRAYS OF BEAM SHAPING ELEMENTS INCLUDING STACKING, SELF-ALIGNMENT AND/OR SELF-CENTERING FEATURES 有权波束形成元件的阵列包括堆叠，自对准和/或自我中心特征公开(公告)号：US20160349414A1
公开(公告)日：2016-12-01
申请号：US15116599
申请日：2015-02-02
Applicant: HEPTAGON MICRO OPTICS PTE. LTD.
Inventor： Hartmut Rudmann , Markus Rossi , Mario Cesana , Ohad Meitav , Peter Roentgen , Jukka Alasirniö , Stephan Heimgartner , Kai Engelhardt
CPC classification number: G02B3/0062 , G02B7/003 , G02B7/021 , G02B7/022 , G02B27/0961
Abstract: Various stacks of arrays of beam shaping elements are described. Each array of beam shaping elements can be formed, for example, as part of a monolithic piece that includes a body portion as well as the beam shaping elements. In some implementations, the monolithic pieces may be formed, for example, as integrally formed molded pieces. The monolithic pieces can include one or more features to facilitate stacking, aligning and/or centering of the arrays with respect to one another.
Abstract translation: 描述了束形成元件阵列的各种堆叠。 波束成形元件的每个阵列可以例如形成为包括主体部分以及波束成形元件的整体件的一部分。 在一些实施方案中，整体件可以形成为例如整体成型的模制件。 单块件可以包括一个或多个特征，以便于阵列相对于彼此的堆叠，对准和/或对中。
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Patent Agency Ranking
16.发明申请OPTOELECTRONIC MODULES HAVING A SILICON SUBSTRATE, AND FABRICATION METHODS FOR SUCH MODULES 有权具有硅基板的光电模块，以及用于这种模块的制造方法公开(公告)号：US20160056194A1
公开(公告)日：2016-02-25
申请号：US14823174
申请日：2015-08-11
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Mario Cesana , Jens Geiger , Peter Roentgen , Vincenzo Condorelli
IPC: H01L27/146 , H01L33/58
CPC classification number: H01L27/14625 , H01L27/14618 , H01L27/14621 , H01L27/14685
Abstract: Optoelectronic modules include a silicon substrate in which or on which there is an optoelectronic device. An optics assembly is disposed over the optoelectronic device, and a spacer separates the silicon substrate from the optics assembly. Methods of fabricating such modules also are described.
Abstract translation: 光电模块包括硅衬底，其中或在其上具有光电子器件。 光学组件设置在光电子器件上方，并且间隔件将硅衬底与光学组件分离。 还描述了制造这种模块的方法。
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17.发明申请公开(公告)号：US20170287963A1
公开(公告)日：2017-10-05
申请号：US15622813
申请日：2017-06-14
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Mario Cesana , Jens Geiger , Peter Roentgen , Vincenzo Condorelli
IPC: H01L27/146
CPC classification number: H01L27/14625 , H01L27/14618 , H01L27/14621 , H01L27/14685
Abstract: Optoelectronic modules include a silicon substrate in which or on which there is an optoelectronic device. An optics assembly is disposed over the optoelectronic device, and a spacer separates the silicon substrate from the optics assembly. Methods of fabricating such modules also are described.
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18.发明授权公开(公告)号：US09711552B2
公开(公告)日：2017-07-18
申请号：US14823174
申请日：2015-08-11
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Hartmut Rudmann , Mario Cesana , Jens Geiger , Peter Roentgen , Vincenzo Condorelli
IPC: H01L33/00 , H01L27/146
CPC classification number: H01L27/14625 , H01L27/14618 , H01L27/14621 , H01L27/14685
Abstract: Optoelectronic modules include a silicon substrate in which or on which there is an optoelectronic device. An optics assembly is disposed over the optoelectronic device, and a spacer separates the silicon substrate from the optics assembly. Methods of fabricating such modules also are described.
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19.发明申请公开(公告)号：US20160218239A1
公开(公告)日：2016-07-28
申请号：US14917104
申请日：2014-08-20
Applicant: HEPTAGON MICRO OPTICS PTE. LTD.
Inventor： Simon Gubser , Mario Cesana , Markus Rossi , Hartmut Rudmann
IPC: H01L31/18 , H01L31/0203 , H01L33/00 , H01L33/58 , H01S5/183 , H01L27/146 , H01L51/56 , H01L51/52 , H01S5/00 , H01S5/02 , H01L33/56 , H01L31/0232
CPC classification number: H01L33/56 , H01L24/97 , H01L27/14618 , H01L27/14625 , H01L27/14685 , H01L31/0203 , H01L31/02164 , H01L31/02327 , H01L31/186 , H01L33/0095 , H01L33/44 , H01L33/486 , H01L33/54 , H01L33/58 , H01L51/5237 , H01L51/5275 , H01L51/56 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H01L2924/181 , H01L2933/0025 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01S5/005 , H01S5/02 , H01S5/183 , H01L2924/00012 , H01L2924/00
Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.
Abstract translation: 描述了各种光电模块并且包括一个或多个光电子器件。 每个光电子模块包括一个或多个光电器件。 侧壁横向围绕每个光电子器件，并且可以与光电子器件的侧面直接接触，或者在一些情况下与围绕光电子器件的包覆模制体一起直接接触。 侧壁可以由例如对由光电子器件发射或由光电子器件发射的光不透明的真空注入材料构成。 该模块还包括无源光学元件。 根据实施方案，无源光学元件可以在模块的盖上，直接位于光电子器件的顶表面上，或在围绕光电器件的包覆模制上。 还描述了制造这种模块的方法，并且可以有助于使用晶片级工艺来制造模块。
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20.发明申请公开(公告)号：US20140167196A1
公开(公告)日：2014-06-19
申请号：US14177552
申请日：2014-02-11
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor： Stephan Heimgartner , Ville Kettunen , Nicola Spring , Alexander Bietsch , Mario Cesana , Hartmut Rudmann , Jukka Alasirnio , Robert Lenart
IPC: H01L27/146 , H01L31/18
CPC classification number: H01L27/14625 , G02B27/0025 , H01L27/14627 , H01L27/14685 , H01L27/14687 , H01L31/02162 , H01L31/02164 , H01L31/02325 , H01L31/18 , H04N5/2254 , Y10T29/49826
Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.
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