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23 条记录 (耗时 0.019 秒)

    High-speed hybrid circuit
    12.
    发明授权
    High-speed hybrid circuit 有权

    公开(公告)号：US11057984B2

    公开(公告)日：2021-07-06

    申请号：US16199484

    申请日：2018-11-26

    申请人： Finisar Corporation

    发明人： Steven C. Bird ,  Henry Meyer Daghighian

    IPC分类号： H05K1/02 ,  H05K3/00 ,  H05K3/40 ,  H05K1/18 ,  H01S5/024 ,  H01S5/02253 ,  H01S5/02325 ,  H01S5/02345 ,  H01S5/183

    摘要： A circuit includes a printed circuit board including a first portion defining a window formed as a first void on a first side of the printed circuit board and a second portion defining a cavity formed as a second void opposite the first void on a second side of the printed circuit board. The circuit further includes a heat sink inserted in the second void, the heat sink having a first side forming a bottom of the first void and the bottom of the first void within the printed circuit board. The circuit yet further includes at least one electronic circuit die mounted to the first side of the heat sink and electrically coupled to the first side of the printed circuit board.

    Method of forming micro via in printed circuit board
    13.
    发明授权
    Method of forming micro via in printed circuit board 有权

    公开(公告)号：US10111343B2

    公开(公告)日：2018-10-23

    申请号：US14538684

    申请日：2014-11-11

    申请人： FINISAR CORPORATION

    发明人： Henry Meyer Daghighian ,  Steven C. Bird ,  YongShan Zhang

    IPC分类号： H01K3/10 ,  H05K3/40 ,  H05K3/00 ,  H05K1/02

    摘要： Some embodiments relate to micro vias in printed circuit boards (PCBs). In an example, a PCB may include a PCB substrate and a micro via. The micro via may extend between opposing surfaces of the PCB substrate and may have a diameter less than or equal to about 100 microns. In another example, a method of forming micro vias in a PCB may include forming a through hole in a PCB substrate of the PCB. The method may also include positioning a pillar that is electrically conductive within the through hole. The method may also include backfilling the through hole around the pillar with an epoxy backfill.

    Hybrid PCB with multi-unreinforced laminate
    15.
    发明授权
    Hybrid PCB with multi-unreinforced laminate 有权
    混合PCB与多层非增强层压板

    公开(公告)号：US09526185B2

    公开(公告)日：2016-12-20

    申请号：US14248108

    申请日：2014-04-08

    申请人： FINISAR CORPORATION

    发明人： Henry Meyer Daghighian ,  Steven C. Bird ,  Gerald Douglas Babel

    IPC分类号： H05K3/46 ,  H05K3/24 ,  H05K1/02 ,  H05K1/03

    CPC分类号： H05K3/4688 ,  H01L2224/48227 ,  H01L2224/85464 ,  H05K1/024 ,  H05K1/0366 ,  H05K3/244 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/0191

    摘要： A hybrid printed circuit board may include a top layer, a bottom layer, and a plurality of internal layers stacked up between the top layer and the bottom layer. The plurality of internal layers may include a first internal layer below the top layer and a second internal layer above the bottom layer. The hybrid printed circuit board may include first unreinforced laminate placed between the top layer and the first internal layer. The hybrid circuit board may additionally include second unreinforced laminate placed between the second internal layer and the bottom layer. The hybrid printed circuit board may include third laminate placed between adjacent internal layers of the plurality of internal layers.

    摘要翻译： 混合印刷电路板可以包括顶层，底层和堆叠在顶层和底层之间的多个内层。 多个内层可以包括在顶层下面的第一内层和在底层之上的第二内层。 混合印刷电路板可以包括放置在顶层和第一内层之间的第一未加强的层压材料。 混合电路板可以另外包括放置在第二内层和底层之间的第二未加强层叠体。 混合印刷电路板可以包括放置在多个内层的相邻内层之间的第三层压体。

    High-speed pluggable rigid-end flex circuit
    16.
    发明授权
    High-speed pluggable rigid-end flex circuit 有权
    高速可插拔刚性端柔性电路

    公开(公告)号：US09204537B2

    公开(公告)日：2015-12-01

    申请号：US13623615

    申请日：2012-09-20

    申请人： FINISAR CORPORATION

    发明人： Henry Meyer Daghighian ,  Steve Bird ,  Bruce Sramek

    IPC分类号： H05K1/02 ,  H04B10/40 ,  H01P3/08 ,  H05K3/46 ,  H05K1/03 ,  H05K1/16 ,  H05K3/40 ,  H05K3/42

    CPC分类号： H05K1/0283 ,  H01P3/08 ,  H01P3/088 ,  H04B10/40 ,  H05K1/0242 ,  H05K1/0251 ,  H05K1/0373 ,  H05K1/0393 ,  H05K1/16 ,  H05K1/165 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/4691 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/086 ,  H05K2201/09518 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/10121 ,  H05K2201/10189 ,  H05K2201/2009

    摘要： High-speed pluggable rigid-end flex circuit. A circuit includes a flexible section, rigid section, connector disposed on the rigid section, and electrically conductive signal transmission line electrically coupled to the connector. The flexible section includes a first portion of a flexible insulating layer. The rigid section includes a second portion of the flexible insulating layer and a rigid insulating layer disposed on the second portion of the flexible insulating layer. The connector is configured to form a pluggable conductive connection. The electrically conductive signal transmission line includes a first signal trace having a root mean square surface roughness below 20 micrometers and a filled signal via configured to pass through at least a portion of the rigid insulating layer. The flexible and rigid insulating layers have a dissipation factor equal to or below a ratio of 0.004 and a dielectric constant equal to or below a ratio of 3.7.

    摘要翻译： 高速可插拔刚性端柔性电路。 电路包括柔性部分，刚性部分，设置在刚性部分上的连接器，以及电连接到连接器的导电信号传输线。 柔性部分包括柔性绝缘层的第一部分。 刚性部分包括柔性绝缘层的第二部分和设置在柔性绝缘层的第二部分上的刚性绝缘层。 连接器被配置成形成可插拔的导电连接。 导电信号传输线包括具有低于20微米的均方根粗糙度的第一信号迹线和经配置以穿过刚性绝缘层的至少一部分的填充信号通道。 柔性和刚性绝缘层的损耗因子等于或低于0.004的比例和等于或低于3.7的介电常数。

    LIGHT-WEIGHT ON-CHIP SIGNAL MONITOR WITH INTEGRATED MEMORY MANAGEMENT AND DATA COLLECTION
    20.
    发明申请
    LIGHT-WEIGHT ON-CHIP SIGNAL MONITOR WITH INTEGRATED MEMORY MANAGEMENT AND DATA COLLECTION 有权
    具有集成存储器管理和数据采集的轻量级片上信号监视器

    公开(公告)号：US20160378132A1

    公开(公告)日：2016-12-29

    申请号：US14748469

    申请日：2015-06-24

    申请人： Finisar Corporation

    发明人： Henry Meyer Daghighian ,  Lucy G. Hosking ,  Gilles P. Denoyer

    IPC分类号： G06F1/08 ,  G06F12/02

    CPC分类号： G06F12/023 ,  G06F11/349 ,  G06F13/16 ,  H04B10/07953 ,  H04B10/40

    摘要： Embodiments of a device and method to automatically acquire signal quality metrics in a digital communication system are disclosed. The device may include acquisition means to sample the likelihood of a digital communication signal passing through a grid of time and amplitude regions, and storage means by which such likelihood measurements may be accumulated in a computer memory array for analysis. A state machine may execute a method that controls both the acquisition means and the storage means, requiring minimal intervention from supervisory systems.

    摘要翻译： 公开了一种在数字通信系统中自动采集信号质量度量的装置和方法的实施例。 该装置可以包括采集装置，以对数字通信信号通过时间和幅度区域网格的可能性进行采样，以及存储装置，通过该存储装置可以在计算机存储器阵列中累积这种可能性测量值用于分析。 状态机可以执行控制采集装置和存储装置两者的方法，从而需要来自监督系统的最少干预。