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13 条记录 (耗时 0.015 秒)

    HIGH-SPEED HYBRID CIRCUIT
    1.
    发明申请
    HIGH-SPEED HYBRID CIRCUIT 审中-公开

    公开(公告)号：US20190166684A1

    公开(公告)日：2019-05-30

    申请号：US16199484

    申请日：2018-11-26

    申请人： Finisar Corporation

    发明人： Steven C. Bird ,  Henry Meyer Daghighian

    IPC分类号： H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/40 ,  H01S5/022 ,  H01S5/024

    摘要： A circuit includes a printed circuit board including a first portion defining a window formed as a first void on a first side of the printed circuit board and a second portion defining a cavity formed as a second void opposite the first void on a second side of the printed circuit board. The circuit further includes a heat sink inserted in the second void, the heat sink having a first side forming a bottom of the first void and the bottom of the first void within the printed circuit board. The circuit yet further includes at least one electronic circuit die mounted to the first side of the heat sink and electrically coupled to the first side of the printed circuit board.

    TUNABLE DIFFERENTIAL VIA CIRCUIT
    5.
    发明申请
    TUNABLE DIFFERENTIAL VIA CIRCUIT 审中-公开

    公开(公告)号：US20190164891A1

    公开(公告)日：2019-05-30

    申请号：US15822952

    申请日：2017-11-27

    申请人： Finisar Corporation

    发明人： Steven C. Bird ,  Ron Greenlaw ,  Henry Meyer Daghighian

    IPC分类号： H01L23/538 ,  H01L23/66 ,  H01L31/02

    摘要： A circuit of tunable differential vias may include a first tunable via circuit configured to couple a first signal of a differential signal pair from a first outer surface of a printed circuit board (PCB) to a second outer surface of the PCB. The circuit may further include a second tunable via circuit configured to couple a second signal of the differential signal pair from the first outer surface of the PCB to the second outer surface of the PCB. The first tunable via circuit may further include a first buried via spatially offset from the second tunable via circuit to cause a predetermined impedance for the first and second signals through the first and second tunable via circuits at an operating frequency.

    HYBRID PRINTED CIRCUIT BOARD CONSTRUCTION
    6.
    发明申请
    HYBRID PRINTED CIRCUIT BOARD CONSTRUCTION 有权
    混合印刷电路板结构

    公开(公告)号：US20150289368A1

    公开(公告)日：2015-10-08

    申请号：US14248108

    申请日：2014-04-08

    申请人： FINISAR CORPORATION

    发明人： Henry Meyer Daghighian ,  Steven C. Bird ,  Gerald Douglas Babel

    IPC分类号： H05K1/03 ,  H05K1/09 ,  H05K1/02

    CPC分类号： H05K3/4688 ,  H01L2224/48227 ,  H01L2224/85464 ,  H05K1/024 ,  H05K1/0366 ,  H05K3/244 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/0191

    摘要： A hybrid printed circuit board is described. The hybrid printed circuit board may include a top layer, a bottom layer, and a plurality of internal layers stacked up between the top layer and the bottom layer. The plurality of internal layers may include a first internal layer below the top layer and a second internal layer above the bottom layer. The hybrid printed circuit board may include first unreinforced laminate placed between the top layer and the first internal layer. The hybrid circuit board may additionally include second unreinforced laminate placed between the second internal layer and the bottom layer. The hybrid printed circuit board may include third laminate placed between adjacent internal layers of the plurality of internal layers.

    摘要翻译： 描述了混合印刷电路板。 混合印刷电路板可以包括顶层，底层和堆叠在顶层和底层之间的多个内层。 多个内层可以包括在顶层下面的第一内层和在底层之上的第二内层。 混合印刷电路板可以包括放置在顶层和第一内层之间的第一未加强的层压材料。 混合电路板可以另外包括放置在第二内层和底层之间的第二未加强层叠体。 混合印刷电路板可以包括放置在多个内层的相邻内层之间的第三层压体。

    High-speed hybrid circuit
    7.
    发明授权
    High-speed hybrid circuit 有权

    公开(公告)号：US11057984B2

    公开(公告)日：2021-07-06

    申请号：US16199484

    申请日：2018-11-26

    申请人： Finisar Corporation

    发明人： Steven C. Bird ,  Henry Meyer Daghighian

    IPC分类号： H05K1/02 ,  H05K3/00 ,  H05K3/40 ,  H05K1/18 ,  H01S5/024 ,  H01S5/02253 ,  H01S5/02325 ,  H01S5/02345 ,  H01S5/183

    摘要： A circuit includes a printed circuit board including a first portion defining a window formed as a first void on a first side of the printed circuit board and a second portion defining a cavity formed as a second void opposite the first void on a second side of the printed circuit board. The circuit further includes a heat sink inserted in the second void, the heat sink having a first side forming a bottom of the first void and the bottom of the first void within the printed circuit board. The circuit yet further includes at least one electronic circuit die mounted to the first side of the heat sink and electrically coupled to the first side of the printed circuit board.

    Method of forming micro via in printed circuit board
    8.
    发明授权
    Method of forming micro via in printed circuit board 有权

    公开(公告)号：US10111343B2

    公开(公告)日：2018-10-23

    申请号：US14538684

    申请日：2014-11-11

    申请人： FINISAR CORPORATION

    发明人： Henry Meyer Daghighian ,  Steven C. Bird ,  YongShan Zhang

    IPC分类号： H01K3/10 ,  H05K3/40 ,  H05K3/00 ,  H05K1/02

    摘要： Some embodiments relate to micro vias in printed circuit boards (PCBs). In an example, a PCB may include a PCB substrate and a micro via. The micro via may extend between opposing surfaces of the PCB substrate and may have a diameter less than or equal to about 100 microns. In another example, a method of forming micro vias in a PCB may include forming a through hole in a PCB substrate of the PCB. The method may also include positioning a pillar that is electrically conductive within the through hole. The method may also include backfilling the through hole around the pillar with an epoxy backfill.

    Hybrid PCB with multi-unreinforced laminate
    9.
    发明授权
    Hybrid PCB with multi-unreinforced laminate 有权
    混合PCB与多层非增强层压板

    公开(公告)号：US09526185B2

    公开(公告)日：2016-12-20

    申请号：US14248108

    申请日：2014-04-08

    申请人： FINISAR CORPORATION

    发明人： Henry Meyer Daghighian ,  Steven C. Bird ,  Gerald Douglas Babel

    IPC分类号： H05K3/46 ,  H05K3/24 ,  H05K1/02 ,  H05K1/03

    CPC分类号： H05K3/4688 ,  H01L2224/48227 ,  H01L2224/85464 ,  H05K1/024 ,  H05K1/0366 ,  H05K3/244 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/0191

    摘要： A hybrid printed circuit board may include a top layer, a bottom layer, and a plurality of internal layers stacked up between the top layer and the bottom layer. The plurality of internal layers may include a first internal layer below the top layer and a second internal layer above the bottom layer. The hybrid printed circuit board may include first unreinforced laminate placed between the top layer and the first internal layer. The hybrid circuit board may additionally include second unreinforced laminate placed between the second internal layer and the bottom layer. The hybrid printed circuit board may include third laminate placed between adjacent internal layers of the plurality of internal layers.

    摘要翻译： 混合印刷电路板可以包括顶层，底层和堆叠在顶层和底层之间的多个内层。 多个内层可以包括在顶层下面的第一内层和在底层之上的第二内层。 混合印刷电路板可以包括放置在顶层和第一内层之间的第一未加强的层压材料。 混合电路板可以另外包括放置在第二内层和底层之间的第二未加强层叠体。 混合印刷电路板可以包括放置在多个内层的相邻内层之间的第三层压体。