公开(公告)号：US20100032807A1

公开(公告)日：2010-02-11

申请号：US12588231

申请日：2009-10-08

Applicant: Hyun-Soo Chung ,  Seung-Duk Baek ,  Dong-Ho Lee ,  Dong-Hyeon Jang ,  Seong-Deok Hwang

Inventor： Hyun-Soo Chung ,  Seung-Duk Baek ,  Dong-Ho Lee ,  Dong-Hyeon Jang ,  Seong-Deok Hwang

IPC: H01L23/544

CPC classification number: H01L23/3114 ,  H01L24/10 ,  H01L24/13 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05548 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/274 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A wafer level semiconductor module may include a module board and an IC chip set mounted on the module board. The IC chip set may include a plurality of IC chips having scribe lines areas between the adjacent IC chips. Each IC chip may have a semiconductor substrate having an active surface with a plurality of chip pads and a back surface. A passivation layer may be provided on the active surface of the semiconductor substrate of each IC chip and may having openings through which the chip pads may be exposed. Sealing portions may be formed in scribe line areas.

Abstract translation: 晶片级半导体模块可以包括安装在模块板上的模块板和IC芯片组。 IC芯片组可以包括在相邻IC芯片之间具有划线区域的多个IC芯片。 每个IC芯片可以具有具有多个芯片焊盘和后表面的有源表面的半导体衬底。 可以在每个IC芯片的半导体衬底的有源表面上提供钝化层，并且可以具有可以暴露芯片焊盘的开口。 密封部分可以形成在划线区域中。

公开(公告)号：US07626260B2

公开(公告)日：2009-12-01

申请号：US11751464

申请日：2007-05-21

Applicant: Hyun-Soo Chung ,  Cha-Jea Jo ,  Dong-Ho Lee ,  Seong-Deok Hwang

Inventor： Hyun-Soo Chung ,  Cha-Jea Jo ,  Dong-Ho Lee ,  Seong-Deok Hwang

IPC: H01L23/34

CPC classification number: H01L23/473 ,  H01L25/0657 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/10158 ,  H01L2924/00

Abstract: Provided is a semiconductor device having a cooling path on its bottom surface. The stack-type semiconductor device having a cooling path comprises a stack-type semiconductor chip comprising a first semiconductor chip and a second semiconductor chip. The first semiconductor chip comprises a first surface in which a circuit unit is formed and a second surface in which a first cooling path is formed, and the second semiconductor chip comprises a first surface in which a circuit unit is formed and a second surface in which a second cooling path is formed. The second surface of the first semiconductor chip and the second surface of the second semiconductor chip are bonded to each other, and a third cooling path is formed in the middle of the stack-type semiconductor chip using the first and second cooling paths. Warpage of the stack-type semiconductor device is suppressed and heat is easily dissipated.

Abstract translation: 提供了在其底面上具有冷却路径的半导体器件。 具有冷却路径的叠层型半导体器件包括：堆叠型半导体芯片，包括第一半导体芯片和第二半导体芯片。 第一半导体芯片包括其中形成有电路单元的第一表面和形成有第一冷却路径的第二表面，并且第二半导体芯片包括其中形成电路单元的第一表面和第二表面，其中第二表面 形成第二冷却路径。 第一半导体芯片的第二表面和第二半导体芯片的第二表面彼此接合，并且使用第一和第二冷却路径在堆叠型半导体芯片的中间形成第三冷却路径。 堆叠型半导体器件的翘曲被抑制，并且易于散热。

公开(公告)号：US07572673B2

公开(公告)日：2009-08-11

申请号：US11355545

申请日：2006-02-15

Applicant: Hyun-Soo Chung ,  Ho-Jin Lee ,  Dong-Hyun Jang ,  Dong-Ho Lee

Inventor： Hyun-Soo Chung ,  Ho-Jin Lee ,  Dong-Hyun Jang ,  Dong-Ho Lee

IPC: H01L21/00 ,  H01L21/44

CPC classification number: H01L25/0657 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/13025 ,  H01L2224/274 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01079 ,  H01L2924/01087

Abstract: In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.

Abstract translation: 在具有应力消除间隔物的半导体器件封装及其制造方法中，从芯片本体延伸的金属互连指状物提供芯片互连。 金属手指通过应力消除间隔物与芯片的主体隔离。 在一个示例中，这种隔离采取气隙的形式。 在另一个实例中，这种隔离采用弹性体材料的形式。 在这两种情况下，都避免了金属互连指和芯体之间的热膨胀系数的不匹配，从而减轻了与开裂和分层相关的问题，从而提高了器件的产量和器件的可靠性。

公开(公告)号：US07515220B2

公开(公告)日：2009-04-07

申请号：US11138211

申请日：2005-05-27

Applicant: Hyung-Seok Ko ,  Soo-Jin Kim ,  Dong-Ho Lee

Inventor： Hyung-Seok Ko ,  Soo-Jin Kim ,  Dong-Ho Lee

IPC: G02F1/1333 ,  G02F1/1335

CPC classification number: G02F1/133308 ,  G02B6/0018 ,  G02B6/002 ,  G02B6/0088 ,  G02F2001/133322 ,  G02F2001/133342

Abstract: A display device including a display panel displaying an image; a light source unit supplying light to the display panel, and a light guiding unit including a light guiding section which has a light receiving surface positioned adjacent to the light source unit and a light emitting surface positioned opposite to the display panel and which guides light emitted from the light source unit to the display panel, a side wall section forming a reception space for receiving the display panel along the edges of the light guiding section, and a fixing section fixing the light guiding section to the display device.

Abstract translation: 一种显示装置，包括显示图像的显示面板; 向显示面板供给光的光源单元以及具有导光部的导光单元，该导光单元具有位于与该光源单元相邻的光接收面和与该显示面相对配置的发光面， 从所述光源单元到所述显示面板的侧壁部，形成沿着所述导光部的边缘接收所述显示面板的接收空间的侧壁部以及将所述导光部固定在所述显示装置上的固定部。

公开(公告)号：US07508479B2

公开(公告)日：2009-03-24

申请号：US10199831

申请日：2002-07-19

Applicant: Hyung-Guel Kim ,  Dong-Ho Lee ,  Won-Seok Ma

Inventor： Hyung-Guel Kim ,  Dong-Ho Lee ,  Won-Seok Ma

IPC: G02F1/1345

CPC classification number: G11C19/28 ,  G09G3/2011 ,  G09G3/3688 ,  G09G2300/0408 ,  G09G2300/08 ,  G09G2310/0275 ,  G09G2310/0297

Abstract: An LCD capable of being reduced by a whole size and a defective proportion thereof being minimized. An LCD panel of the LCD includes a gate driving circuit that drives gate lines formed extended along a row direction and a line block selecting circuit that drives data lines extended along a column direction. On the LCD panel, an integrated driving chip having a controller, a memory, a level shifter, a source driver, a common voltage generator and a DC/DC converter is mounted. The integrated driving chip not only drives the gate driving circuit and line block selecting circuit, but also controls the operation of the LCD panel to display an image. Thus configured, a defective proportion of the LCD is decreased, with the whole size thereof being reduced.

Abstract translation: 能够将整体尺寸减小并且其缺陷比例的LCD最小化。 LCD的LCD面板包括驱动沿着行方向延伸的栅极线的栅极驱动电路和驱动沿列方向延伸的数据线的线路块选择电路。 在LCD面板上，安装有具有控制器，存储器，电平转换器，源极驱动器，公共电压发生器和DC / DC转换器的集成驱动芯片。 集成驱动芯片不仅驱动栅极驱动电路和线路块选择电路，而且还控制LCD面板的操作以显示图像。 因此，LCD的缺陷比例减小，整体尺寸减小。

公开(公告)号：US07301233B2

公开(公告)日：2007-11-27

申请号：US11169615

申请日：2005-06-30

Applicant: Hae-Hyung Lee ,  Sang-Wook Park ,  Joong-Hyun Baek ,  Dong-Ho Lee ,  Jin-Yang Lee

Inventor： Hae-Hyung Lee ,  Sang-Wook Park ,  Joong-Hyun Baek ,  Dong-Ho Lee ,  Jin-Yang Lee

IPC: H01L23/34 ,  H01L23/10 ,  H01L23/02

CPC classification number: H01L23/38 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/37599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49112 ,  H01L2224/49113 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2224/8485 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/37099

Abstract: The semiconductor chip package may include a substrate having circuit patterns and substrate pads connected with the circuit patterns. At least one semiconductor chip is mounted on the substrate, and a thermoelectric cooler having a P-type material plate and an N-type material plate is mounted on the semiconductor chip. Portions of the P-type and N-type material plates may be attached on the semiconductor chip. The P-type and N-type material plates may be electrically connected to the circuit patterns of the substrate to be provided with DC power.

Abstract translation: 半导体芯片封装可以包括具有电路图案的衬底和与电路图案连接的衬底焊盘。 至少一个半导体芯片安装在基板上，并且具有P型材料板和N型材料板的热电冷却器安装在半导体芯片上。 P型和N型材料板的部分可以附着在半导体芯片上。 P型和N型材料板可以电连接到衬底的电路图案以提供DC电力。

公开(公告)号：US20070109474A1

公开(公告)日：2007-05-17

申请号：US11616506

申请日：2006-12-27

Applicant: Yong-Ho Yang ,  Dong-Ho Lee

Inventor： Yong-Ho Yang ,  Dong-Ho Lee

IPC: G02F1/1335

CPC classification number: G02F1/133514 ,  G02F1/133555 ,  G02F2001/133357

Abstract: A color filter substrate is provided, including a substrate, a color filter layer formed on the substrate and including color filters where at least one of the color filters has an opening that partially exposes a portion of the substrate, a planarization layer reducing a step difference between the color filter layer and the portion of the substrate exposed by the opening, and a transparent electrode formed on the planarization layer,

Abstract translation: 提供一种滤色器基板，包括基板，形成在基板上的滤色器层，并且包括滤色器，其中至少一个滤色器具有部分地暴露基板的一部分的开口，平坦化层减小阶梯差 在所述滤色器层和由所述开口曝光的所述基板的所述部分之间，形成在所述平坦化层上的透明电极，

公开(公告)号：US20060176254A1

公开(公告)日：2006-08-10

申请号：US11102175

申请日：2005-04-08

Applicant: Dong-Hwan Lee ,  Dong-Ho Lee ,  Soo-Jin Kim

Inventor： Dong-Hwan Lee ,  Dong-Ho Lee ,  Soo-Jin Kim

IPC: G09G3/36

CPC classification number: G02F1/13452 ,  G02F2001/13456

Abstract: In a display apparatus, a printed circuit board has a base substrate, a flip chip, and an adhesive member. The flip chip is mounted onto a first face of the base substrate by the adhesive member between the flip chip and the first face of the base substrate. The first display panel is disposed on a second face opposite to the first face of the base substrate, and a second display panel is mounted on the first face of the base substrate with the flip chip. Thus, a chip mounted on the printed circuit board is made smaller and the freed up space can be used to mount the second display panel.

Abstract translation: 在显示装置中，印刷电路板具有基底基板，倒装芯片和粘合部件。 倒装芯片通过位于倒装芯片和基底基板的第一面之间的粘合部件安装在基底基板的第一面上。 第一显示面板设置在与基底基板的第一面相反的第二面上，第二显示面板通过倒装芯片安装在基底基板的第一面上。 因此，安装在印刷电路板上的芯片更小，并且可以使用释放的空间来安装第二显示面板。

公开(公告)号：US20060134833A1

公开(公告)日：2006-06-22

申请号：US11289665

申请日：2005-11-28

Applicant: Seung-Duk Baek ,  Sun-Won Kang ,  Sang-Wook Park ,  Dong-Ho Lee ,  Jong-Joo Lee

Inventor： Seung-Duk Baek ,  Sun-Won Kang ,  Sang-Wook Park ,  Dong-Ho Lee ,  Jong-Joo Lee

IPC: H01L21/48

CPC classification number: H01L23/49833 ,  H01L23/3128 ,  H01L24/48 ,  H01L25/03 ,  H01L25/0657 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Aspects of the subject matter described herein relate to a packaged semiconductor die which becomes a component of a finished multi-chip package. The packaged semiconductor die comprises a die substrate, a semiconductor package, and a sealant. The die substrate includes an insulating substrate and a circuit pattern formed on the insulating substrate. The semiconductor package has a semiconductor chip electrically coupled to the circuit pattern that is a known good package and is coupled to the die substrate. The sealant seals the semiconductor package. The packaged semiconductor die utilizes a known good package which has passed a series of package tests.

公开(公告)号：US07007996B2

公开(公告)日：2006-03-07

申请号：US10698789

申请日：2003-10-30

Applicant: Dong-Ho Lee ,  Wae-Yeul Kim

Inventor： Dong-Ho Lee ,  Wae-Yeul Kim

IPC: B69N3/12

CPC classification number: B60R11/0211 ,  B60R2011/0005 ,  B60R2011/0047 ,  B60R2011/0096 ,  Y10T70/50

Abstract: In a lock of information reproducer for car, when a passenger or a driver stays in a car, in more detail, only when a car key is inserted into a car key holder (power of the car is ON), an information reproducer can be detached from a contact support unit, when the key is taken out of the key holder, the information reproducer can not be detached from the contact support unit, and accordingly theft of the information reproducer can be efficiently prevented in parking.

Abstract translation: 在汽车信息再现器锁中，当乘客或驾驶员停留在汽车中时，更详细地说，只有当汽车钥匙插入汽车钥匙座（汽车电源为ON）时，信息再现器可以是 从接触支撑单元分离时，当钥匙从钥匙架中取出时，信息再现器不能从接触支撑单元拆下，因此在停车时可以有效地防止信息再现器的盗窃。