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公开(公告)号：US12196806B2
公开(公告)日：2025-01-14
申请号：US18054197
申请日：2022-11-10
Applicant: CHROMA ATE INC.
Inventor： I-Shih Tseng , Xin-Yi Wu , Chin-Yi Ouyang
Abstract: The present invention relates to an aging test system and an aging test method for a thermal interface material and an electronic device testing apparatus having the system, wherein a controller controls a movable carrier to move to a high temperature generating device so that the thermal interface material on the movable carrier is brought into contact with the high temperature generating device; the controller further controls a temperature sensor to detect the temperature of the thermal interface material; the controller compares an output temperature datum of the high temperature generating device with a temperature measurement datum detected by the temperature sensor. Accordingly, the thermal conductivity of the thermal interface material can be obtained for immediately determining the quality and the performance degradation of the thermal interface material, which can be used as a reference for selection or replacement of the thermal interface material.
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12.发明公开公开(公告)号：US20240192268A1
公开(公告)日：2024-06-13
申请号：US18511638
申请日：2023-11-16
Applicant: CHROMA ATE INC.
Inventor： Yu-Wei Chuang , Xin-Yi Wu , Jui-Che Chou
CPC classification number: G01R31/2874 , G01R31/2863 , G05D23/20 , H01L22/12
Abstract: A multiphase thermal interface component, a method of forming the same, and an electronic device testing apparatus provided with the same are provided. The multiphase thermal interface component includes a thermal interface solid element and a thermal interface fluid material. The thermal conductive surface of the thermal interface solid element has an accommodation space, and the thermal interface fluid material is accommodated in the accommodation space. Therefore, the multiphase thermal interface component combines solid-phase and fluid-phase thermal interface materials. Since fluids have the properties of changing shape, flowing, and splitting arbitrarily, the thermal interface fluid material can completely fill up the air gaps between the thermal interface solid element and the thermal control device/the temperature-controlled component, so that the full surface temperature control of the contact interface can be achieved, thereby effectively improving the thermal conduction performance.
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公开(公告)号：US11740283B2
公开(公告)日：2023-08-29
申请号：US17834035
申请日：2022-06-07
Applicant: CHROMA ATE INC.
Inventor： Chin-Yi Ouyang , Chien-Ming Chen , Wei-Cheng Kuo , Xin-Yi Wu , Iching Tsai
CPC classification number: G01R31/2893 , G01R1/0458
Abstract: The present invention relates to a multistory electronic device testing apparatus, which mainly comprises a feeding and binning device, a multi-axis transfer device, a chip-testing device and a main controller. The feeding and binning device includes an upper module and a lower module. The chip-testing device includes a plurality of testing units arranged vertically. The main controller not only controls the feeding, binning and testing operations, but also controls the multi-axis transfer device to transfer an electronic device to be tested or a tested electronic device between the feeding and binning device and the chip-testing device. Accordingly, the three-dimensional arrangement of the feeding and binning module and the testing device is realized, and the accommodating capacity and the testing capacity for the electronic devices to be tested and the tested electronic devices can be increased.
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14.发明授权公开(公告)号：US10520528B2
公开(公告)日：2019-12-31
申请号：US15790185
申请日：2017-10-23
Applicant: Chroma Ate Inc.
Inventor： Xin-Yi Wu , Chien-Hung Lo , Jui-Chih Chou , Hao-Che Yang , Nan-Yi Kuo
Abstract: A dew resistant module for a test socket, and an electronic component testing device having the same are provided. An enclosure body is provided to circumscribe the test socket; and a test socket base plate provided on top of the test socket and enclosure body. A cover is provided to cover the test socket, enclosure body and test socket base plate. With the provision of the enclosure body and the cover, the test socket, test socket base plate and a portion of the thermal head are prevented from coming into contact directly with the atmosphere, whereby condensation or dewing is prevented, thermal insulation achieved and energy consumption minimized.
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Patent Agency Ranking
15.发明授权公开(公告)号：US10309986B2
公开(公告)日：2019-06-04
申请号：US15628069
申请日：2017-06-20
Applicant: CHROMA ATE INC.
Inventor： Chia-Hung Chien , Xin-Yi Wu
Abstract: A temperature-controlled module for electronic devices and a testing apparatus provided with the same mainly include a temperature-controlled tray, an upper board and a dry-air supply device. The temperature-controlled tray includes holding cavities for accommodating electronic devices and a fluid chamber for cooling fluid. The upper board is furnished with through holes, while the upper board and the temperature-controlled tray are spaced by a predetermined distance. The dry-air supply device provides dry air to a space between the temperature-controlled tray and the upper board. Thereupon, by having cooling fluid to flow inside the temperature-controlled tray, the temperature-controlled tray can be kept in a lower predetermined temperature so as to rapidly cool down the electronic device. In addition, by providing the upper board and the dry-air supply device to allow dry air to flow through the surface of the electronic device, then the water-condensation phenomenon and air leakage can avoided.
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16.发明授权公开(公告)号：US09983259B2
公开(公告)日：2018-05-29
申请号：US15420154
申请日：2017-01-31
Applicant: CHROMA ATE INC.
Inventor： Xin-Yi Wu , Chien-Hung Lo
CPC classification number: G01R31/2875 , F25B21/04 , F25B2321/021 , F25B2321/0212 , F25B2321/0252 , F28D15/00 , G01R31/2877 , G05D23/19 , G05D23/1919
Abstract: A dual loop type temperature control module and an electronic device testing apparatus having the same are provided. The temperature control module comprises a first loop through which a first working fluid of a first temperature flows, a second loop through which a second working fluid of a second temperature flows, a controller for controlling a first switching valve such that the first or second working fluid flows through a temperature regulating device, and a second switching valve such that the working fluid flowing through the temperature regulating device returns to the first or second loop. The temperature regulating device adjusts a thermoelectric cooling device to reach two different reference temperatures based on the rise/fall of its temperature dependent on the working fluid. The thermoelectric cooling device regulates the temperature of the tested object under a wide range of temperature difference and with accuracy based on the reference temperatures to facilitate the detection of high/low temperature.
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公开(公告)号：US09470749B2
公开(公告)日：2016-10-18
申请号：US14108176
申请日：2013-12-16
Applicant: CHROMA ATE INC.
Inventor： Xin-Yi Wu , Hsuan-Jen Shen , Chien-Ming Chen , Chin-Yi Ou Yang
CPC classification number: G01R31/2877 , G01N1/42 , G01R31/2865
Abstract: A test apparatus includes a test site, a buffer carrying device, a transport carrying device, a handling mechanism and a dry air flow guide mechanism. The test site performs a test procedure on the objects. The buffer carrying device is disposed close to a side of the test site, holds the objects and performs a temperature conditioning process. The transport carrying device is disposed close to another side of the test site, moves back and forth along a transporting direction, transports the objects into and out of the test site, and heats up the objects. The handling mechanism carries the objects among the buffer carrying device, the test site and the transport carrying device. The dry air flow guide mechanism guides a dry air to surround the test site, the buffer carrying device, the transport carrying device and the handling mechanism and generates a dry environment to prevent dew condensation.
Abstract translation: 试验装置包括试验部位，缓冲载体装置，输送装置，搬运机构以及干燥空气引导机构。 测试站点对对象执行测试程序。 缓冲载体装置靠近试验部位的一侧设置，保持物体并进行温度调节处理。 运送装置靠近试验场的另一侧，沿运送方向前后移动，运送物体进出试验场地，并加热物体。 处理机构携带缓冲运送装置，试验部位和运送装置中的物体。 干燥空气流动引导机构引导干燥空气围绕测试场所，缓冲装置，输送装置和处理机构，并产生干燥环境以防止结露。
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公开(公告)号：US09353995B2
公开(公告)日：2016-05-31
申请号：US14291573
申请日：2014-05-30
Applicant: CHROMA ATE INC.
Inventor： Xin-Yi Wu , Jui-Chih Chou , Hsuan-Jen Shen
IPC: G06F1/16 , H05K5/00 , H05K7/00 , F28D15/00 , H01L23/473
CPC classification number: F28D15/00 , H01L23/473 , H01L2924/0002 , H01L2924/00
Abstract: A temperature control module for a socket is provided with of an upper docking plate and a lower docking plate. The upper docking plate has a recess for accommodating a socket and two temperature-controlling fluid passages. One end of the passages communicates with the recess, and the other end thereof is connected to a temperature-controlling fluid source. The lower docking plate is disposed under the upper docking plate and covers the recess. A fluid chamber is formed of the recess of the docking plate, the lower docking plate and the socket. The temperature-controlling fluid source outputs a temperature-controlling fluid to the fluid chamber via the temperature-controlling fluid passages for maintaining the socket at a specific temperature.
Abstract translation: 用于插座的温度控制模块设置有上对接板和下对接板。 上对接板具有用于容纳插座的凹部和两个温度控制流体通道。 通路的一端与凹部连通，另一端与温度调节型流体源连接。 下对接板设置在上对接板下方并覆盖凹部。 流体室由对接板，下部对接板和插座的凹部形成。 温度控制流体源通过温度控制流体通道将温度控制流体输出到流体室，用于将插座保持在特定温度。
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公开(公告)号：US20140368999A1
公开(公告)日：2014-12-18
申请号：US14291573
申请日：2014-05-30
Applicant: CHROMA ATE INC.
Inventor： Xin-Yi Wu , Jui-Chih CHOU , Hsuan-Jen SHEN
CPC classification number: F28D15/00 , H01L23/473 , H01L2924/0002 , H01L2924/00
Abstract: A temperature control module for a socket is provided with of an upper docking plate and a lower docking plate. The upper docking plate has a recess for accommodating a socket and two temperature-controlling fluid passages. One end of the passages communicates with the recess, and the other end thereof is connected to a temperature-controlling fluid source. The lower docking plate is disposed under the upper docking plate and covers the recess. A fluid chamber is formed of the recess of the docking plate, the lower docking plate and the socket. The temperature-controlling fluid source outputs a temperature-controlling fluid to the fluid chamber via the temperature-controlling fluid passages for maintaining the socket at a specific temperature.
Abstract translation: 用于插座的温度控制模块设置有上对接板和下对接板。 上对接板具有用于容纳插座的凹部和两个温度控制流体通道。 通路的一端与凹部连通，另一端与温度调节型流体源连接。 下对接板设置在上对接板下方并覆盖凹部。 流体室由对接板，下部对接板和插座的凹部形成。 温度控制流体源通过温度控制流体通道将温度控制流体输出到流体室，用于将插座保持在特定温度。
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