公开(公告)号：US10520528B2

公开(公告)日：2019-12-31

申请号：US15790185

申请日：2017-10-23

Applicant: Chroma Ate Inc.

Inventor： Xin-Yi Wu ,  Chien-Hung Lo ,  Jui-Chih Chou ,  Hao-Che Yang ,  Nan-Yi Kuo

IPC: G01R31/26 ,  G01R1/04 ,  G01R31/28

Abstract: A dew resistant module for a test socket, and an electronic component testing device having the same are provided. An enclosure body is provided to circumscribe the test socket; and a test socket base plate provided on top of the test socket and enclosure body. A cover is provided to cover the test socket, enclosure body and test socket base plate. With the provision of the enclosure body and the cover, the test socket, test socket base plate and a portion of the thermal head are prevented from coming into contact directly with the atmosphere, whereby condensation or dewing is prevented, thermal insulation achieved and energy consumption minimized.