公开(公告)号：US11088352B2

公开(公告)日：2021-08-10

申请号：US16429531

申请日：2019-06-03

Applicant: BOE Technology Group Co., Ltd.

Inventor： Wenqu Liu ,  Feng Zhang ,  Qi Yao ,  Zhijun Lv ,  Liwen Dong ,  Shizheng Zhang ,  Ning Dang ,  Xiaoxin Song ,  Zhao Cui

IPC: H01L51/52 ,  H01L51/56 ,  H01L27/32 ,  H01L51/00

Abstract: A display substrate, a manufacturing method thereof, and a display device are provided, in the field of display technology. The display substrate includes a base substrate, and a thin-film transistor, a light-emitting device, an encapsulation structure, and a conductive film layer sequentially disposed on the base substrate in a direction away from the base substrate. Since the display substrate includes a conductive film layer on a side of the encapsulation structure away from the base substrate, when the protective film layer on the side of the conductive film layer away from the base substrate is peeled off, static electricity generated by the separation of the film layer can be released to the conductive film layer, avoiding electron transition to the active layer of the thin-film transistor in the display substrate to cause offset of the threshold voltage of the thin-film transistor. The display brightness uniformity of the display substrate can be ensured.

公开(公告)号：US20210202648A1

公开(公告)日：2021-07-01

申请号：US16071681

申请日：2017-12-11

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Feng Zhang ,  Zhijun Lv ,  Wenqu Liu ,  Liwen Dong ,  Shizheng Zhang ,  Ning Dang ,  Zhiyong Liu

IPC: H01L27/32 ,  H01L29/786

Abstract: The present application discloses an array substrate having a plurality of first thin film transistors and a plurality of second thin film transistors. Each of the plurality of first thin film transistors includes a silicon active layer. The array substrate includes a base substrate; a silicon layer having a plurality of silicon active layers respectively for the plurality of first thin film transistors; and a UV absorption layer on a side of the silicon layer distal to the base substrate, and including a plurality of UV absorption blocks. Each of the plurality of UV absorption blocks is on a side of the one of the plurality of silicon active layers distal to the base substrate, and is insulated from the one of the plurality of silicon active layers.

公开(公告)号：US20190096969A1

公开(公告)日：2019-03-28

申请号：US15989014

申请日：2018-05-24

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Feng Zhang ,  Wenqu Liu ,  Zhijun Lv ,  Liwen Dong ,  Shizheng Zhang ,  Ning Dang

IPC: H01L27/32 ,  H01L51/56 ,  H01L51/00 ,  H01L51/52 ,  H01L51/50

Abstract: The present disclosure provides a method for manufacturing an OLED display substrate, including a step of forming a pattern of a pixel definition layer on a substrate through a patterning process. A bottom wall of the pixel definition layer is formed on the substrate, a top wall of the pixel definition layer is arranged parallel to the bottom wall, and a side wall of the pixel definition layer is angled relative to the top wall at an acute angle.

公开(公告)号：US12033994B2

公开(公告)日：2024-07-09

申请号：US17204562

申请日：2021-03-17

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhijun Lv ,  Feng Zhang ,  Liwen Dong ,  Wenqu Liu ,  Xiaoxin Song ,  Zhao Cui ,  Detian Meng ,  Libo Wang ,  Dongfei Hou ,  Qi Yao

IPC: H01L25/16 ,  H01L23/00 ,  H01L27/12 ,  H01L33/62

CPC classification number: H01L25/167 ,  H01L24/32 ,  H01L24/83 ,  H01L24/98 ,  H01L27/1262 ,  H01L33/62 ,  H01L2224/32145 ,  H01L2224/83005 ,  H01L2224/83048 ,  H01L2224/838 ,  H01L2924/12041 ,  H01L2933/0066

Abstract: The present application discloses a display panel and a preparation method thereof. The display panel includes a base substrate provided with a circuit area and a light-emitting area; a driving circuit located in the circuit area of the base substrate; an organic insulating layer covering the light-emitting area of the base substrate; a light-emitting element embedded in the organic insulating layer, where an overlap area between the orthographic projection of the light-emitting element on the base substrate and the orthographic projection of the driving circuit on the base substrate is 0; and a first lapping electrode located on the side, facing away from the base substrate, of the light-emitting element, where the light-emitting element is electrically connected to the driving circuit through the first lapping electrode.

公开(公告)号：US11835751B2

公开(公告)日：2023-12-05

申请号：US17264027

申请日：2020-05-25

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Xiandong Meng ,  Jifeng Tan ,  Shuilang Dong ,  Wei Wang ,  Wenqu Liu ,  Wenqing Zhao ,  Qiuyu Ling ,  Xianqin Meng ,  Yishan Tian ,  Zhao Kang

IPC: G02F1/1335 ,  F21V8/00 ,  G02F1/1362 ,  G02F1/13357 ,  G02F1/1333

CPC classification number: G02B6/0093 ,  G02B6/0065 ,  G02F1/133357 ,  G02F1/133368 ,  G02F1/133512 ,  G02F1/133524 ,  G02F1/133615 ,  G02F1/136209 ,  G02F2201/07 ,  G02F2201/30 ,  G02F2201/50

Abstract: A display panel and a manufacturing method thereof, and a display device. The display panel includes a light guide plate, an array substrate, a liquid crystal layer between the light guide plate and the array substrate, a plurality of light-extracting gratings located on one side of a light exit surface of the light guide plate, and a transparent protection layer between a film layer where the light-extracting gratings are located and the light guide plate. The light guide plate includes a plurality of light-extracting port areas, and transparent areas besides the light-extracting port areas; each light-extracting port area is provided with one light-extracting grating; the protection layer is at least provided on the transparent areas, and the protection layer is configured to prevent the light guide plate in the transparent areas from being excessively etched to form a plurality of depressions.

公开(公告)号：US11759778B2

公开(公告)日：2023-09-19

申请号：US16763838

申请日：2019-12-06

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Xiaoxin Song ,  Feng Zhang ,  Wenqu Liu ,  Zhijun Lv ,  Zhao Cui ,  Qi Yao

IPC: B01L3/00 ,  B05D7/00 ,  C23C14/08

CPC classification number: B01L3/502715 ,  B01L3/50273 ,  B01L3/502707 ,  B01L2200/027 ,  B01L2200/12 ,  B01L2300/0645 ,  B01L2300/0816 ,  B01L2300/165 ,  B01L2300/166 ,  B01L2400/022 ,  B01L2400/088 ,  B05D7/56 ,  C23C14/086

Abstract: The present disclosure provides an electrode plate, a microfluidic chip, and a method of manufacturing the electrode plate. In one embodiment, an electrode plate includes: a substrate, an electrode and a surface contact layer stacked in sequence, and a droplet inlet hole passing through the substrate, the electrode and the surface contact layer. The surface contact layer comprises a super-hydrophobic region and a hydrophilic region, and the droplet inlet hole is disposed in the hydrophilic region. The microfluidic chip includes: a first electrode plate formed by the abovementioned electrode plate, and a second electrode plate provided on a side of the first electrode plate close to the surface contact layer. The first electrode plate is provided opposite to the second electrode plate and a liquid channel is formed between the first electrode plate and the second electrode plate.

公开(公告)号：US20220373840A1

公开(公告)日：2022-11-24

申请号：US17770205

申请日：2021-06-08

Applicant: BOE Technology Group Co., Ltd.

Inventor： Xiaoxin Song ,  Feng Zhang ,  Wenqu Liu ,  Zhijun Lv ,  Liwen Dong ,  Zhao Cui ,  Detian Meng ,  Libo Wang ,  Dongfei Hou ,  Qi Yao ,  Xue Dong

IPC: G02F1/13357 ,  G02F1/1335

Abstract: The present disclosure relates to a backlight module, a method for designing the same, and a display device. The backlight module includes: a first substrate; a plurality of LED chips on the first substrate; and a light control structure on the first substrate. The backlight module includes a plurality of light control region groups in one-to-one correspondence with the plurality of light-emitting diode chips, each light control region group includes at least a first light control region and a second light control region. The light control structure includes a plurality of light control substructure groups respectively located in the plurality of light control region groups. Each light control substructure group includes at least a first light control substructure in the first light control region and a second light control substructure in the second light control region.

公开(公告)号：US11460735B2

公开(公告)日：2022-10-04

申请号：US17244979

申请日：2021-04-30

Applicant: BOE Technology Group Co., Ltd.

Inventor： Liwen Dong ,  Qi Yao ,  Guangcai Yuan ,  Feng Zhang ,  Zhijun Lv ,  Wenqu Liu ,  Zhao Cui ,  Xiaoxin Song ,  Detian Meng

IPC: G02F1/1339 ,  G02F1/13357 ,  G02F1/1335 ,  F21V8/00

Abstract: Provided are a display panel and a preparation method thereof, and a display apparatus. The display panel includes a first substrate and a second substrate which are aligned and combined into a cell, wherein the first substrate includes a backlight structure layer and an array structure layer arranged on a side of the backlight structure layer facing the second substrate, the backlight structure layer includes a light guide plate, a grating layer arranged on a side of the light guide plate facing the array structure layer and a refractive layer covering the grating layer, the grating layer includes a plurality of grating units, the array structure layer includes a plurality of pixel electrodes, and the grating units are in one-to-one correspondence with the pixel electrodes.

公开(公告)号：US11301082B2

公开(公告)日：2022-04-12

申请号：US17242511

申请日：2021-04-28

Applicant: BOE Technology Group Co., Ltd.

Inventor： Wenqu Liu ,  Qi Yao ,  Feng Zhang ,  Zhao Cui ,  Libo Wang ,  Dongfei Hou ,  Xiaoxin Song ,  Zhijun Lv ,  Liwen Dong ,  Detian Meng ,  Jalil Ryu ,  Yang Yue ,  Haitao Huang

IPC: G06F3/041 ,  G06F3/045 ,  G06F3/044 ,  G06K9/00

Abstract: The present disclosure provides a fingerprint recognition unit and a fabrication method thereof, a fingerprint recognition module and a display device. The fingerprint recognition unit includes: a bearing substrate; a receiving electrode layer on the bearing substrate; a piezoelectric material layer on a side of the receiving electrode layer away from the bearing substrate; and a driving electrode layer on a side of the piezoelectric material layer away from the receiving electrode layer. A density of the driving electrode layer is greater than 5 g/cm3, and a thickness of the driving electrode layer, a thickness of the piezoelectric material layer and a thickness of the bearing substrate are configured such that a vibration nodal plane of the piezoelectric material layer is within the piezoelectric material layer.

公开(公告)号：US11094740B2

公开(公告)日：2021-08-17

申请号：US16534362

申请日：2019-08-07

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhijun Lv ,  Liwen Dong ,  Wenqu Liu ,  Xiaoxin Song ,  Zhao Cui ,  Feng Zhang ,  Qi Yao ,  Changzheng Wang

IPC: H01L33/62 ,  H01L27/15 ,  H01L33/00

Abstract: The disclosure discloses a backboard, a display device, and a method for fabricating the same, and the backboard includes: a backboard body; and a plurality of LED installation mounts arranged in an array on the backboard body, wherein each of the plurality of LED installation mounts includes at least two lead-out electrodes to be connected with LED pins, and a coil structure around each of the at least two lead-out electrodes, wherein the coil structure is configured to produce a magnetic field upon being powered on. The coils can be formed on the backboard body in the backboard to absorb electrodes of LEDs to thereby position them precisely so as to transfer the LEDs in a mass manner with a high good yield ratio, and the lead-out electrodes can be powered on to thereby detect abnormally operating LEDs.