公开(公告)号：US10275033B2

公开(公告)日：2019-04-30

申请号：US15519582

申请日：2016-10-26

Applicant: BOE Technology Group Co., Ltd.

Inventor： Long Wang ,  Li Zhou ,  Feng Jiang ,  Fangzhen Zhang ,  Chungchun Lee

IPC: G06F3/01 ,  G06F3/044 ,  H01L41/08 ,  H01L41/113

Abstract: A touch display device includes a display panel, a processor and a pressure sensing device and a touch feedback device disposed over the display panel. The pressure sensing device is configured to sense a pressure sensing upon an occurrence of touch, such that the pressure signal may be provided to the processor to generate a feedback signal. The touch feedback device is configured to perform a corresponding feedback operation according to the feedback signal.

公开(公告)号：US10209557B2

公开(公告)日：2019-02-19

申请号：US15126020

申请日：2016-01-29

Applicant: BOE Technology Group Co., Ltd.

Inventor： Jing Niu ,  Yonglian Qi ,  Shuang Sun ,  Fangzhen Zhang

IPC: G02F1/1335 ,  G02B5/30 ,  G02F1/1362 ,  G02F1/1368 ,  G03F7/20 ,  G02F1/1333 ,  G03F7/00

Abstract: Disclosed is a display substrate, which includes a base substrate and a polarization layer, wherein the polarization layer includes grid polarizer (GPs) and light-shielding matrixes arranged in a same layer and made from a same material. The display substrate simplifies the production process, reduces the cost and reduces the thickness of a liquid crystal display (LCD) device.

公开(公告)号：US09972643B2

公开(公告)日：2018-05-15

申请号：US14892067

申请日：2015-04-20

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Zhijun LV ,  Ke Wang ,  Jiushi Wang ,  Fangzhen Zhang

IPC: H01L29/786 ,  H01L27/12 ,  H01L21/77

CPC classification number: H01L27/1225 ,  H01L21/77 ,  H01L27/12 ,  H01L27/124 ,  H01L27/1248 ,  H01L27/1262 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An array substrate and a fabrication method thereof, and a display device are provided. The array substrate comprises: a thin film transistor (TFT 10) provided on a base substrate (01), a first passivation layer (200) provided on the thin film transistor (TFT 10), and a transparent electrode layer (300) provided on a surface of the first passivation layer (200). The first passivation layer (300) includes: a first sub-thin film layer (210), and a second sub-thin film layer (211) which is provided on a surface of the first sub-thin film layer (210) and in contact with the transparent electrode layer (300); and a film density of the second sub-thin film layer (211) is greater than that of the first sub-thin film layer (210).

公开(公告)号：US20170261806A1

公开(公告)日：2017-09-14

申请号：US15126020

申请日：2016-01-29

Applicant: BOE Technology Group Co., Ltd.

Inventor： Jing Niu ,  Yonglian Qi ,  Shuang Sun ,  Fangzhen Zhang

IPC: G02F1/1335 ,  G03F7/20 ,  G02F1/1362 ,  G02B5/30 ,  G02F1/1368

CPC classification number: G02F1/133516 ,  G02B5/3058 ,  G02F1/133512 ,  G02F1/133528 ,  G02F1/133617 ,  G02F1/136209 ,  G02F1/1368 ,  G02F2001/133357 ,  G02F2001/133548 ,  G03F7/0002 ,  G03F7/0007 ,  G03F7/2043

Abstract: Disclosed is a display substrate, which includes a base substrate and a polarization layer, wherein the polarization layer includes grid polarizer (GPs) and light-shielding matrixes arranged in a same layer and made from a same material. The display substrate simplifies the production process, reduces the cost and reduces the thickness of a liquid crystal display (LCD) device.

公开(公告)号：US09634044B2

公开(公告)日：2017-04-25

申请号：US14347833

申请日：2013-04-22

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Fangzhen Zhang

IPC: H01L21/027 ,  H01L27/12 ,  H01L21/265 ,  H01L29/786 ,  H01L21/02 ,  H01L21/306 ,  H01L29/167 ,  H01L29/66

CPC classification number: H01L27/1288 ,  H01L21/02532 ,  H01L21/02595 ,  H01L21/0274 ,  H01L21/265 ,  H01L21/30604 ,  H01L21/32139 ,  H01L29/167 ,  H01L29/66575 ,  H01L29/66757 ,  H01L29/78621

Abstract: Embodiments of the invention provides a method for fabricating an array substrate comprising: forming, on a substrate, at least two semiconductor active islands, first patterns positioned on both sides of each of the semiconductor active islands, second patterns positioned at outer side of a part of the first patterns, and third patterns positioned at outer side of the rest of the first patterns, through a single patterning process; doping a semiconductor at the second patterns for once to form a semiconductor of a first conductivity type; and doping a semiconductor at the third patterns for once to form a semiconductor of a second conductivity type.

公开(公告)号：US12268555B2

公开(公告)日：2025-04-08

申请号：US17416712

申请日：2020-09-28

Applicant: BOE Technology Group Co., Ltd.

Inventor： Tingting Zhou ,  Kuanjun Peng ,  Fangzhen Zhang ,  Yanan Niu ,  Jintao Peng ,  Jing Niu ,  Shuang Sun ,  Lubin Shi ,  Jinyu Ren

IPC: A61B8/00 ,  A61B8/08 ,  B06B1/02 ,  B06B1/06

Abstract: Embodiments of the present disclosure provide a flexible sensor, including a flexible substrate; a plurality of ultrasonic detectors, on the flexible substrate; and a plurality of detection circuits, respectively corresponding to the ultrasonic detectors; wherein each of the detection circuits is between the flexible substrate and the corresponding ultrasonic detector, and configured to drive the ultrasonic detector to emit an ultrasonic wave, and detect a detection signal output by the ultrasonic detector after receiving the ultrasonic wave; each of the ultrasonic detectors includes: a first electrode coupled to the corresponding detection circuit, a second electrode on a side of the first electrode away from the flexible substrate, and a piezoelectric induction layer between the first electrode and the second electrode; a plurality of holes are provided in a region other than a region where the detection circuits are located.

公开(公告)号：US20240297203A1

公开(公告)日：2024-09-05

申请号：US18026476

申请日：2022-05-30

Applicant: BOE Technology Group Co., Ltd.

Inventor： Shuang Sun ,  Fangzhen Zhang ,  Xinxing Wang ,  Jing Niu ,  Tingting Zhou ,  Wei Wang ,  Yanan Niu

IPC: H01L27/15 ,  H01L25/18

CPC classification number: H01L27/156 ,  H01L25/18

Abstract: The present application provides a light emitting chip, a manufacturing method for the same, and a light emitting device, relating to the field of display technology. The light emitting chip includes a substrate and a plurality of light emitting units arranged in an array on the substrate. The light emitting unit includes at least one first electrode disposed on the substrate and a plurality of epitaxial wafers arranged in an array, at least two of the epitaxial wafers have different colors. Several epitaxial wafers in the epitaxial wafers share one of the first electrodes.

公开(公告)号：US11887400B2

公开(公告)日：2024-01-30

申请号：US16343769

申请日：2018-11-15

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Jing Niu ,  Chengchung Yang ,  Fangzhen Zhang

IPC: G06V40/13 ,  H10K50/86 ,  H10K59/12 ,  H10K59/60 ,  H10K59/65

CPC classification number: G06V40/1318 ,  H10K50/865 ,  H10K59/12 ,  H10K59/60 ,  H10K59/65

Abstract: A display substrate includes a base substrate, and a plurality of light emitters and a plurality of light sensors over the base substrate. The light emitters and light sensors are configured to respectively emit lights towards, and sense lights reflected by, a pattern to be detected, such as a fingerprint. At least one light emitter includes a first electrode, a light-emitting layer, and a second electrode, sequentially over the base substrate. At least one light sensor includes a third electrode, a photosensitive layer, and a fourth electrode, sequentially over the base substrate. The first electrode and the third electrode are integral or the second electrode and the fourth electrode are integral. A method of using the display substrate to identify a pattern such as a fingerprint can be employed by a display panel containing the display substrate.

公开(公告)号：US10510784B2

公开(公告)日：2019-12-17

申请号：US15110416

申请日：2015-10-13

Applicant: BOE Technology Group Co., Ltd.

Inventor： Ce Ning ,  Fangzhen Zhang

IPC: H01L29/66 ,  H01L27/12 ,  H01L21/28 ,  H01L21/84 ,  H01L21/30 ,  H01L21/768 ,  H01L29/786 ,  H01L29/417 ,  H01L29/45 ,  H01L29/49

Abstract: The present disclosure provides an array substrate and a method of manufacturing the same and a display apparatus in which the array substrate is applied. In one embodiment, the method of manufacturing an array substrate at least includes the steps of: forming a first electrode layer, a metal gate layer and a first layer of non-oxide insulation material, the first layer of non-oxide insulation material being formed on an upper surface of the metal gate layer; forming, by using one patterning process, a pattern including a first electrode and a gate such that, after completion of the patterning process, a first non-oxide insulation layer is further formed on the gate and a first sub-electrode belonging to the first electrode layer is further formed below the gate. This method of manufacturing the array substrate is simple, which facilitates mass production of the array substrate as well as the display apparatus.

公开(公告)号：US10381584B2

公开(公告)日：2019-08-13

申请号：US15520069

申请日：2016-08-17

Applicant: BOE TECHNOLOGY GROUP CO., LTD. ,  PEKING UNIVERSITY

Inventor： Xuelei Liang ,  Guanbao Hui ,  Boyuan Tian ,  Fangzhen Zhang ,  Haiyan Zhao ,  Jiye Xia ,  Qiuping Yan ,  Lianmao Peng

IPC: H01L51/05 ,  H01L29/43 ,  H01L29/786 ,  H01L51/00 ,  H01L29/06

Abstract: The present disclosure provides a carbon nanotube thin film transistor (CNT-TFT) and its manufacturing method. The carbon nanotube thin film transistor includes a source electrode, a drain electrode, a channel region, a plurality of protrusions, and a carbon nanotube layer. The channel region is between the source electrode and the drain electrode. The plurality of protrusions are at, and extend in a length direction of, the channel region. The carbon nanotube layer is disposed over the plurality of protrusions, and comprises a plurality of carbon nanotubes.