公开(公告)号：US20190074201A1

公开(公告)日：2019-03-07

申请号：US16079961

申请日：2017-03-30

Applicant: Applied Materials, Inc.

Inventor： Mehdi VAEZ-IRAVANI ,  Todd EGAN ,  Samer BANNA ,  Kyle TANTIWONG

IPC: H01L21/67 ,  G06T7/00

Abstract: Embodiments of the disclosure provide methods and system for inspecting and treating a substrate. In one embodiment, a method is provided including transmitting a first plurality of beams from a diffractive beam splitter to a first surface of a substrate to generate a reflection of a second plurality of beams, wherein the first plurality of beams are spaced apart from each other upon arriving at the first surface of the substrate; receiving the second plurality of beams on a recording surface of an optical device, wherein the second plurality of beams are spaced apart from each other upon arriving at the recording surface; measuring positional information of the second plurality of beams on the recording surface; comparing the positional information of the second plurality of beams to positional information stored in a memory; and storing a result of the comparison in the memory.

公开(公告)号：US20250076212A1

公开(公告)日：2025-03-06

申请号：US18798303

申请日：2024-08-08

Applicant: Applied Materials, Inc.

Inventor： Venkatakaushik VOLETI ,  Mehdi VAEZ-IRAVANI

IPC: G01N21/88 ,  G01N21/95 ,  H01L21/66

Abstract: An optical inspection system for pre-bonding inspection system includes a stage on which a sample to be inspected is placed, a sensor, optical assemblies, each including an optical head having optics to direct a sample field-of-view (FOV) to a portion of the sample, a first light source configured to illuminate the sample at a first oblique angle, a second light source configured to illuminate the sample at a second oblique angle, a focusing lens to focus a first optical image of the portion of the sample generated by the first light source, and a second optical image of the portion of the sample generated by the second light source onto a segment of the sensor, and a controller configured to combine the first optical image and the second optical image generated by each optical assembly, and generate a map of point defects on the sample.

公开(公告)号：US20220099546A1

公开(公告)日：2022-03-31

申请号：US17033521

申请日：2020-09-25

Applicant: Applied Materials, Inc.

Inventor： Mehdi VAEZ-IRAVANI ,  Avishek GHOSH

IPC: G01N15/02

Abstract: Examples disclosed herein relate to system and method for detecting the size of a particle in a fluid. The system includes a conduit for transporting a fluid and a sample area. Some of the fluid passes through the sample area. A first imaging device has an optical lens and a digital detector. A laser source emits a first laser beam. The digital detector generates a metric of an initial intensity of a scattered light that passes through the optical lens. The scattered light is scattered from particles passing through the sample area, and includes light from the first laser beam, which passes through the sample area. A controller outputs a corrected particle intensity based upon a comparison of the initial intensity to data representative of intensity of a focused and defocused particle. The corrected particle intensity generates a corrected metric corresponding to an actual size of the particles.

公开(公告)号：US20210372911A1

公开(公告)日：2021-12-02

申请号：US16885257

申请日：2020-05-27

Applicant: Applied Materials, Inc.

Inventor： Mehdi VAEZ-IRAVANI ,  Todd EGAN ,  Guoheng ZHAO

IPC: G01N15/02 ,  G01N15/14

Abstract: Examples disclosed herein generally relate to systems and methods for detecting the size of a particle in a fluid. In one example, a system for imaging a particle includes a first imaging device. The first imaging device includes a lens and a digital detector. The system further includes a laser source. He laser source is configured to emit a first laser beam and a second laser beam. The digital detector is configured to accumulate a metric of an intensity of an accumulated light that passes through the lens. The accumulated light is scattered from the particle. The accumulated light includes light from the first laser beam and the second laser beam.

公开(公告)号：US20190072497A1

公开(公告)日：2019-03-07

申请号：US16080075

申请日：2017-05-23

Applicant: Applied Materials, Inc.

Inventor： Todd EGAN ,  Mehdi VAEZ-IRAVANI ,  Samer BANNA ,  Kyle TANTIWONG ,  Gregory KIRK ,  Abraham RAVID ,  Yaoming SHEN

IPC: G01N21/95 ,  H01L21/67 ,  G01N15/02 ,  G01N21/94 ,  G01N15/14

Abstract: A system for processing a substrate is provided. The system includes a process chamber including one or more sidewalls enclosing a processing region; and a substrate support. The system further includes a passageway connected to the process chamber; and a first particle detector disposed at a first location along the passageway. The first particle detector includes an energy source configured to emit a first beam; one or more optical devices configured to direct the first beam along one or more paths, where the one or more paths extend through at least a portion of the passageway. The first particle detector further includes a first energy detector disposed at a location other than on the one or more paths. The system further includes a controller configured to communicate with the first particle detector, wherein the controller is configured to identify a fault based on signals received from the first particle detector.

公开(公告)号：US20190057910A1

公开(公告)日：2019-02-21

申请号：US16080102

申请日：2017-03-09

Applicant: Applied Materials, Inc.

Inventor： Mehdi VAEZ-IRAVANI ,  Todd EGAN ,  Samer BANNA ,  Kyle TANTIWONG

IPC: H01L21/66 ,  G01B11/24 ,  G02B27/12

Abstract: Embodiments of the disclosure provide a metrology system. In one example, a metrology system includes a laser source adapted to transmit a light beam, a lens adapted to receive at least a portion of the light beam from the laser source, a first beam splitter positioned to receive at least the portion of the light beam passing through the lens, a first beam displacing device adapted to cause a portion of the light beam received from the beam splitter to be split into two or more sub-light beams a first recording device having a detection surface, and a first polarizer that is positioned between the first displacing device and the first recording device, wherein the first polarizer is configured to cause the two or more sub-light beams provided from the first displacing device to form an interference pattern on the detection surface of the first recording device.

公开(公告)号：US20170017165A1

公开(公告)日：2017-01-19

申请号：US15207991

申请日：2016-07-12

Applicant: Applied Materials, Inc.

Inventor： Christopher Dennis BENCHER ,  Joseph R. JOHNSON ,  Dave MARKLE ,  Mehdi VAEZ-IRAVANI

IPC: G03F7/20 ,  G02B27/28 ,  G02B5/30 ,  G02B26/08

CPC classification number: G02B27/283 ,  G02B5/3083 ,  G02B26/0833 ,  G02F1/1303 ,  G03F7/2008 ,  G03F7/2057 ,  G03F7/70291 ,  G03F7/70566

Abstract: The present disclosure provides a method for producing an image on a substrate. The method includes providing a single beam of light to a multiple DMD assembly, splitting the single beam of light into an s-polarization beam and a p-polarization beam, and reflecting the s-polarization beam and the p-polarization beam through the multiple DMD assembly such that the multiple DMD assembly produces a plurality of superimposed images on the substrate.

Abstract translation: 本公开提供了一种用于在基板上产生图像的方法。 该方法包括向多个DMD组件提供单个光束，将单个光束分解为s偏振光束和p偏振光束，并将S偏振光束和p偏振光束反射通过多个 DMD组件，使得多个DMD组件在衬底上产生多个叠加的图像。

公开(公告)号：US20240363446A1

公开(公告)日：2024-10-31

申请号：US18141306

申请日：2023-04-28

Applicant: Applied Materials, Inc.

Inventor： Venkatakaushik VOLETI ,  Kyle TANTIWONG ,  Mehdi VAEZ-IRAVANI

IPC: H01L21/66 ,  H01L21/67 ,  H01L23/00

CPC classification number: H01L22/12 ,  H01L21/67144 ,  H01L21/67288 ,  H01L24/80 ,  H01L2224/8001 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/80908

Abstract: Methods and apparatus of hybrid bonding with inspection are provided herein. In some embodiments, a method of hybrid bonding with inspection includes: cleaning a substrate via a first cleaning chamber and a tape frame having a plurality of chiplets via a second cleaning chamber; inspecting, via a first metrology system, the substrate for pre-bond defects in a first metrology chamber and the tape frame for pre-bond defects in a second metrology chamber; bonding one or more of the plurality of chiplets to the substrate via a hybrid bonding process in a bonder chamber to form a bonded substrate; and performing, via a second metrology system different than the first metrology system, a post-bond inspection of the bonded substrate via a third metrology chamber for post-bond defects.

公开(公告)号：US20240241456A1

公开(公告)日：2024-07-18

申请号：US18098482

申请日：2023-01-18

Applicant: Applied Materials, Inc.

Inventor： Venkatakaushik VOLETI ,  Mehdi VAEZ-IRAVANI

IPC: G03F9/00 ,  G03F7/20

CPC classification number: G03F9/7088 ,  G03F7/70775 ,  G03F9/7069

Abstract: Methods and apparatus for detecting metrology data are provided herein. For example, an apparatus comprises a substrate support configured to support a substrate and another substrate disposed on the substrate, an incoherent light source configured to transmit an illumination beam through the substrate and the another substrate, a set of optics configured to direct the illumination beam when transmitted through the substrate and the another substrate, an actuator operably coupled to the substrate support and configured to move the substrate and another substrate back and forth in a scanning pattern, and a sensor operably coupled to the actuator, synchronized therewith, and configured to receive the illumination beam from the set of optics to obtain subsurface images of the substrate and the another substrate.

公开(公告)号：US20210142976A1

公开(公告)日：2021-05-13

申请号：US16676717

申请日：2019-11-07

Applicant: Applied Materials, Inc.

Inventor： Mehdi VAEZ-IRAVANI ,  Christopher Dennis BENCHER ,  Krishna SREERAMBHATLA ,  Hussein FAWAZ ,  Lior ENGEL ,  Robert PERLMUTTER

IPC: H01J37/20 ,  H01J37/317 ,  H01J37/21 ,  H01J37/147 ,  H01J37/09 ,  H01J37/04 ,  H01L21/027 ,  G03F7/20

Abstract: A method of method of operating a multibeamlet charged particle device is disclosed. In the method, a target attached to a stage is translated, and each step of selecting beamlets, initializing beamlets, and exposing the target is repeated. The step of selecting beamlets includes passing a reconfigurable plurality of selected beamlets through the blanking circuit. The step of initializing beamlets includes pointing each of the selected beamlets in an initial direction. The step of exposing the target includes scanning each of the selected beamlets from the initial direction to a final direction, and irradiating a plurality of regions of the target on the stage with the selected beamlets.