公开(公告)号：US20150114948A1

公开(公告)日：2015-04-30

申请号：US14505355

申请日：2014-10-02

Applicant: Applied Materials, Inc.

Inventor： Robin L. TINER ,  Soo Young CHOI ,  Beom Soo PARK ,  Shinichi KURITA ,  Bora OH ,  Gaku FURUTA

IPC: C23C16/458 ,  H05B3/22 ,  H01L21/67

CPC classification number: H05B3/22 ,  C23C16/458 ,  C23C16/4586 ,  C23C16/50 ,  H01L21/67103 ,  H05B2203/003

Abstract: The present invention generally relates to a substrate support for use in a processing chamber. The substrate support is divided into quadrants with each quadrant capable of heating independent of the other quadrants. The independent heating permits the substrate support to provide different heating to either different substrate simultaneously disposed on the substrate support or to different areas of a common substrate. Thus, the substrate heating may be tailored to ensure desired processing of the substrate or substrates occurs.

Abstract translation: 本发明一般涉及一种用于处理室中的基片支架。 衬底支撑分为象限，每个象限能够独立于其他象限进行加热。 独立加热允许衬底支撑件向同时设置在衬底支撑件上的不同衬底或公共衬底的不同区域提供不同的加热。 因此，可以调整基板加热以确保发生基板或基板的期望的处理。

公开(公告)号：US20200043706A1

公开(公告)日：2020-02-06

申请号：US16052304

申请日：2018-08-01

Applicant: Applied Materials, Inc.

Inventor： Jianheng LI ,  Lai ZHAO ,  Robin L. TINER ,  Allen K. LAU ,  Gaku FURUTA ,  Soo Young CHOI

IPC: H01J37/32 ,  C23C16/505

Abstract: Embodiments described herein generally relate to apparatus and methods for processing a substrate utilizing a high radio frequency (RF) power. The high RF power enables deposition of films on the substrate with more desirable properties. A first plurality of insulating members is disposed on a plurality of brackets and extends laterally inward from a chamber body. A second plurality of insulating members is disposed on the chamber body and extends from the first plurality of insulating members to a support surface of the chamber body. The insulating members reduce the occurrence of arcing between the plasma and the chamber body.

公开(公告)号：US20190193233A1

公开(公告)日：2019-06-27

申请号：US15853548

申请日：2017-12-22

Applicant: Applied Materials, Inc.

Inventor： Ilyoung HONG ,  Lai ZHAO ,  Jianhua ZHOU ,  Robin L. TINER ,  Gaku FURUTA ,  Shinichi KURITA ,  Soo Young CHOI

IPC: B24B19/00 ,  C23C16/44 ,  C23C16/455 ,  H01J37/32

CPC classification number: B24B19/009 ,  B24B1/04 ,  C23C16/4407 ,  C23C16/45559 ,  H01J37/3244

Abstract: Methods for manufacturing a diffuser plate for a PECVD chamber are provided. The methods provide for applying a compliant abrasive medium to round the sharp edges at corners of the output holes on a contoured downstream side of a gas diffuser plate. By rounding the edges of the output holes reduces the flaking of deposited materials on the downstream side of the gas diffuser plate and reduces the amount of undesirable particles generated during the PECVD deposition process.

公开(公告)号：US20190096624A1

公开(公告)日：2019-03-28

申请号：US16122003

申请日：2018-09-05

Applicant: Applied Materials, Inc.

Inventor： Gaku FURUTA ,  Soo Young CHOI ,  Yi CUI ,  Robin L. TINER ,  Jinhyun CHO ,  Jiarui WANG ,  Suhail ANWAR

IPC: H01J29/07 ,  C23C16/458 ,  C23C16/04 ,  H01J37/32

Abstract: Embodiments of the present disclosure generally relates a shadow frame including two opposing major side frame members adjacent to two opposing minor side frame members coupled together with a corner bracket, wherein the corner bracket includes a corner inlay having legs that extend in directions generally orthogonal to each other.

公开(公告)号：US20180340257A1

公开(公告)日：2018-11-29

申请号：US15644191

申请日：2017-07-07

Applicant: Applied Materials, Inc.

Inventor： Umesha ACHARY ,  Sanjay D. YADAV ,  Lai ZHAO ,  Gaku FURUTA ,  Ko-Ta SHIH ,  Soo Young CHOI

IPC: C23C16/50 ,  C23C16/458 ,  C23C16/455

Abstract: Embodiments described herein relate to a plasma enhanced chemical vapor deposition (PECVD) chamber and diffuser assembly for processing large area flat panel display substrates. The diffuser includes a first plate having a plurality of first bores formed therein, a second plate having a second plurality of bores formed therein, and a third plate having a third plurality of bores formed therein. The second plate is disposed between the first plate and the second plate. The first plate, second plate, and third plate are brazed to form a diffuser having a unitary body.

公开(公告)号：US20170231033A1

公开(公告)日：2017-08-10

申请号：US15496405

申请日：2017-04-25

Applicant: Applied Materials, Inc.

Inventor： Robin L. TINER ,  Soo Young CHOI ,  Beom Soo PARK ,  Shinichi KURITA ,  Bora OH ,  Gaku FURUTA

IPC: H05B3/22 ,  C23C16/458 ,  H01L21/67 ,  C23C16/50

CPC classification number: H05B3/22 ,  C23C16/458 ,  C23C16/4586 ,  C23C16/50 ,  H01L21/67103 ,  H05B2203/003

Abstract: The present invention generally relates to a substrate support for use in a processing chamber. The substrate support has a rectangular body. The rectangular body has a first quadrant, a second quadrant, a third quadrant and a fourth quadrant. A first heating element is disposed in the first quadrant and extending from a center area of the rectangular body. The first heating element has a first segment having a first length and extending from the center area, a second segment having a second length, the second segment extending from the first segment and coupled thereto, a third segment having a third length extending from the second segment and coupled thereto, and a fourth segment having a fourth length coupled to and extending from the third segment to the center area. A second heating element is enclosed by the first heating element and the center area.