公开(公告)号：US20190027445A1

公开(公告)日：2019-01-24

申请号：US16142137

申请日：2018-09-26

Applicant: Apple Inc.

Inventor： Meng Chi Lee ,  Shakti S. Chauhan ,  Flynn P. Carson ,  Jun Chung Hsu ,  Tha-An Lin

IPC: H01L23/552 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/522 ,  H01L23/528

CPC classification number: H01L23/552 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/5226 ,  H01L23/528 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/81

Abstract: A system in package (SiP) is disclosed that uses an EMI shield to inhibit EMI or other electrical interference on the components within the SiP. A metal shield may be formed on an upper surface of an encapsulant encapsulating the SiP. The metal shield may be electrically coupled to a ground layer in a printed circuit board (PCB) to form the EMI shield around the SiP. The metal shield may be electrically coupled to the ground layer using one or more conductive structures located in the encapsulant. The conductive structures may be located on a perimeter of the components in the SiP. The conductive structures may provide a substantially vertical connection between the substrate and the shield on the upper surface of the encapsulant.

公开(公告)号：US10147685B2

公开(公告)日：2018-12-04

申请号：US15403046

申请日：2017-01-10

Applicant: Apple Inc.

Inventor： Phillip R. Sommer ,  Shankar Pennathur ,  Meng Chi Lee ,  Shakti S. Chauhan ,  Yanfeng Chen

IPC: H01L23/552 ,  H01L23/31 ,  H01L25/065 ,  H01L23/498 ,  H01L21/288 ,  H01L21/3205 ,  H01L21/285 ,  H01L21/268 ,  H01L23/00 ,  H01L21/56

Abstract: Electrical components may be packaged using system-in-package configurations or other component packages. Integrated circuit dies and other electrical components may be soldered or otherwise mounted on printed circuits. A layer of encapsulant may be used to encapsulate the integrated circuits. A shielding layer may be formed on the encapsulant layer to shield the integrate circuits. The shielding layer may include a sputtered metal seed layer and an electroplated layer of magnetic material. The electroplated layer may be a magnetic material that has a high permeability such as permalloy or mu metal to provide magnetic shielding for the integrated circuits. Integrated circuits may be mounted on one or both sides of the printed circuit. A temporary carrier and sealant may be used to hold the encapsulated integrated circuits during electroplating.

公开(公告)号：US20180092213A1

公开(公告)日：2018-03-29

申请号：US15710579

申请日：2017-09-20

Applicant: Apple Inc.

Inventor： Corey S. Provencher ,  Meng Chi Lee ,  Derek J. Walters ,  Ian A. Spraggs ,  Flynn P. Carson ,  Shakti S. Chauhan ,  Daniel W. Jarvis ,  David A. Pakula ,  Jun Zhai ,  Michael V. Yeh ,  Alex J. Crumlin ,  Dennis R. Pyper ,  Amir Salehi ,  Vu T. Vo ,  Gregory N. Stephens

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34

CPC classification number: H05K1/181 ,  H05K1/0298 ,  H05K1/113 ,  H05K1/115 ,  H05K1/144 ,  H05K3/0014 ,  H05K3/284 ,  H05K3/341 ,  H05K3/3436 ,  H05K2201/10159 ,  H05K2201/10674 ,  H05K2203/1316 ,  Y02P70/611

Abstract: The present disclosure is related to printed circuit board packages and methods of assembly that may be used in the fabrication of electrical devices. Printed circuit board packages may be manufactured by stacking printed circuit board assemblies. Each printed circuit board assembly may have multiple printed circuit boards supported by a resin mold. The printed circuit board assemblies may be shaped to improve space utilization efficiency and to accommodate large electrical components that are attached to the printed circuit board package.