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公开(公告)号:US20160172953A1
公开(公告)日:2016-06-16
申请号:US15046194
申请日:2016-02-17
Applicant: Apple Inc.
Inventor: Brett W. Degner , Bradley J. Hamel , David H. Narajowski , Jonah A. Harley , Michael E. Leclerc , Patrick Kessler , Samuel Bruce Weiss , Storrs T. Hoen
IPC: H02K41/035
CPC classification number: H02K33/00 , G08B6/00 , H02K7/08 , H02K33/02 , H02K35/00 , H02K35/02 , H02K41/0356 , H04M19/047
Abstract: Embodiments described herein may take the form of an electromagnetic actuator that produces a haptic output during operation. Generally, an electromagnetic coil is wrapped around a central magnet array. A shaft passes through the central magnet array, such that the central array may move along the shaft when the proper force is applied. When a current passes through the electromagnetic coil, the coil generates a magnetic field. The coil is stationary with respect to a housing of the actuator, while the central magnet array may move along the shaft within the housing. Titus, excitation of the coil exerts a force on the central magnet array, which moves in response to that force. The direction of the current through the coil determines the direction of the magnetic field and thus the motion of the central magnet array.
Abstract translation: 本文描述的实施例可以采取在操作期间产生触觉输出的电磁致动器的形式。 通常,电磁线圈缠绕在中心磁体阵列周围。 轴通过中心磁体阵列,使得当施加适当的力时,中心阵列可以沿着轴移动。 当电流通过电磁线圈时,线圈产生磁场。 线圈相对于致动器的壳体是静止的,而中心磁体阵列可以沿壳体内的轴移动。 Titus,线圈的激励对中心磁体阵列施加力,响应于该力而移动。 通过线圈的电流的方向确定磁场的方向,从而确定中心磁体阵列的运动。
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公开(公告)号:US12050494B2
公开(公告)日:2024-07-30
申请号:US18131983
申请日:2023-04-07
Applicant: APPLE INC.
Inventor: Brett W. Degner , Caitlin Elizabeth Kalinowski , Richard D. Kosoglow , Joshua D. Banko , David H. Narajowski , Jonathan L. Berk , Michael E. Leclerc , Michael D. McBroom , Asif Iqbal , Paul S. Michelsen , Mark K. Sin , Paul A. Baker , Harold L. Sontag , Wai Ching Yuen , Matthew P. Casebolt , Kevin S. Fetterman , Alexander C. Calkins , Daniel L. McBroom
IPC: H05K5/00 , F21V8/00 , G06F1/18 , G06F1/20 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/40 , H05K1/02 , H05K5/03 , H05K7/20
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
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公开(公告)号:US11650634B2
公开(公告)日:2023-05-16
申请号:US17649661
申请日:2022-02-01
Applicant: Apple Inc.
Inventor: Brett W. Degner , Caitlin Elizabeth Kalinowski , Richard D. Kosoglow , Joshua D. Banko , David H. Narajowski , Jonathan L. Berk , Michael E. Leclerc , Michael D. McBroom , Asif Iqbal , Paul S. Michelsen , Mark K. Sin , Paul A. Baker , Harold L. Sontag , Wai Ching Yuen , Matthew P. Casebolt , Kevin S. Fetterman , Alexander C. Calkins , Daniel L. McBroom
IPC: H05K5/00 , G06F1/20 , G06F1/18 , H05K7/20 , H01L23/40 , H05K5/03 , H05K1/02 , F21V8/00 , G06F3/00 , G08B5/36 , G08B21/18
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/001 , G02B6/0008 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/2039 , H05K7/2049 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
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公开(公告)号:US20230147273A1
公开(公告)日:2023-05-11
申请号:US17821920
申请日:2022-08-24
Applicant: Apple Inc.
Inventor: Brett W. Degner , Jie-Hua Zhao , Kristopher P. Laurent , Michael E. Leclerc , Rangaraj Dhanasekaran , Simon J. Trivett
IPC: H01L23/00 , H01L25/16 , H01L25/065 , H01L23/498 , H01L21/48
CPC classification number: H01L23/562 , H01L25/16 , H01L25/0655 , H01L24/16 , H01L24/32 , H01L24/73 , H01L23/49816 , H01L21/4817 , H01L21/4853 , H01L24/81 , H01L2924/3025 , H01L2924/3511 , H01L2924/1431 , H01L2924/1432 , H01L2924/1436 , H01L2224/73253 , H01L2224/32245 , H01L2224/16225 , H01L2224/81097 , H01L2924/1616 , H01L2924/16235 , H01L2924/16251 , H01L2924/1632 , H01L2924/1659
Abstract: Electronic assemblies and methods of assembly are described. In an embodiment, an electronic assembly includes a stiffener structure shear bonded to an opposite side of a module substrate from a ball grid array (BGA) package. The stiffener structure may be shear bonded at elevated temperature after bonding of the BGA package to lock in a flat or near-flat surface contour of the module substrate.
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公开(公告)号:US11323793B2
公开(公告)日:2022-05-03
申请号:US16362393
申请日:2019-03-22
Applicant: Apple Inc.
Inventor: Kristopher P. Laurent , David H. Narajowski , Michael E. Leclerc , Brett W. Degner , Christopher J. Stringer , Daniele de Iuliis , Markus Diebel , Sung-Ho Tan
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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公开(公告)号:US20200378547A1
公开(公告)日:2020-12-03
申请号:US16572410
申请日:2019-09-16
Applicant: Apple Inc.
Inventor: Michael E. Leclerc , Brett W. Degner , Danny L. McBroom , David H. Narajowski , Denis H. Endisch , Kristopher P. Laurent , Simon J. Trivett
Abstract: A display stand has two spaced apart legs connected by a horizontal support bar that is attachable to multiple displays. Carriage assemblies allow the stand to adjust the vertical position of the displays, shuttles and rails allow the stand to adjust the horizontal positions of the displays, and a central joint on the support bar allows the stand to adjust the angle between the displays. The carriage assemblies can convert rotational movement of adjustment handles into vertical movement of the support bar that is synchronized at both legs whether the support bar is in a straight or angled configuration. Wheels on the shuttles can provide smooth, consistent contact with rails in the support bar despite changes in the nominal dimensions of the rails. The display stand provides improved smoothness, rigidity, and comfort for the user to support and use multiple displays on a single stand.
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公开(公告)号:US20200348734A1
公开(公告)日:2020-11-05
申请号:US16586745
申请日:2019-09-27
Applicant: Apple Inc.
Inventor: Brett W. Degner , Eric R. Prather , Michael E. Leclerc
Abstract: An electronic device can include a housing that defines an internal volume. The electronic device can also include a component within the internal volume that divides the internal volume into a first volume and a second volume. The first volume and second volume can be fluidically isolated except at an aperture defined by the component. An air-moving system can produce a positive air pressure in the first volume and a negative air pressure in the second volume.
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公开(公告)号:US20190235587A1
公开(公告)日:2019-08-01
申请号:US16377155
申请日:2019-04-06
Applicant: Apple Inc.
Inventor: Brett W. DEGNER , Caitlin Elizabeth Kalinowski , Richard D. Kosoglow , Joshua D. Banko , David H. Narajowski , Jonathan L. Berk , Michael E. Leclerc , Michael D. McBroom , Asif Iqbal , Paul S. Michelsen , Mark K. Sin , Paul A. Baker , Harold L. Sontag , Wai Ching Yuen , Matthew P. Casebolt , Kevin S. Fetterman , Alexander C. Calkins , Daniel L. McBroom
IPC: G06F1/18 , G06F1/20 , H05K5/03 , H05K7/20 , H01L23/40 , F21V8/00 , G06F3/00 , G08B5/36 , G08B21/18 , H05K1/02
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
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公开(公告)号:US20190222915A1
公开(公告)日:2019-07-18
申请号:US16362393
申请日:2019-03-22
Applicant: Apple Inc.
Inventor: Kristopher P. Laurent , David H. Narajowski , Michael E. Leclerc , Brett W. Degner , Christopher J. Stringer , Daniele de Iuliis , Markus Diebel , Sung-Ho Tan
IPC: H04R1/10
CPC classification number: H04R1/1008
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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公开(公告)号:US20190103701A1
公开(公告)日:2019-04-04
申请号:US15720165
申请日:2017-09-29
Applicant: Apple Inc.
Inventor: Brett W. Degner , Bradley J. Hamel , Christopher J. Stringer , Christiaan A. Ligtenberg , David H. Narajowski , Kristopher P. Laurent , Mahmoud R. Amini , Michael E. Leclerc
CPC classification number: H01R13/6205 , H01F7/0263 , H01R11/30 , H01R13/03 , H01R13/2407 , H01R35/04 , H01R39/643
Abstract: Connector inserts and connector receptacles that have a small form factor, readily mate when brought into proximity to each other, and disconnect when subjected to a non-axial force.
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