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45 条记录 (耗时 0.02 秒)

    Electro-optical circuit board
    12.
    发明授权
    Electro-optical circuit board 有权
    电光电路板

    公开(公告)号：US07295725B1

    公开(公告)日：2007-11-13

    申请号：US11706879

    申请日：2007-02-13

    申请人： Cherng-Shiun Wu ,  Hsien-Huan Chiu ,  Shin-Ge Lee ,  Ying-Chih Chen

    发明人： Cherng-Shiun Wu ,  Hsien-Huan Chiu ,  Shin-Ge Lee ,  Ying-Chih Chen

    IPC分类号： G02B6/12 ,  G02B6/26 ,  G02B6/42 ,  G02B6/10 ,  G02F1/035 ,  G02F1/295

    CPC分类号： G02B6/4214 ,  G02B6/12 ,  G02B6/13 ,  H05K1/0274 ,  H05K3/4641 ,  H05K2203/061

    摘要： An electro-optical circuit board is provided, which includes an electrical wiring board and an optical wiring board. The optical wiring board includes a first metal substrate, an optical guiding layer formed on the first metal substrate, and a metal supporting structure formed around the optical guiding layer, wherein the optical guiding layer includes an optical waveguide and a clad wrapping the optical waveguide. When the electrical wiring board is joined with the optical wiring board through a laminating process, the metal supporting structure absorbs the pressure applied to the electro-optical circuit board.

    摘要翻译： 提供一种电光电路板，其包括电布线板和光布线板。 光配线板包括第一金属基板，形成在第一金属基板上的光引导层和形成在光导层周围的金属支撑结构，其中，光导层包括光波导和包围光波导的包层。 当电接线板通过层压工艺与光布线板接合时，金属支撑结构吸收施加到电光电路板的压力。

    Over-passivation process of forming polymer layer over IC chip
    16.
    发明申请
    Over-passivation process of forming polymer layer over IC chip 失效
    在IC芯片上形成聚合物层的过钝化工艺

    公开(公告)号：US20050250255A1

    公开(公告)日：2005-11-10

    申请号：US11183658

    申请日：2005-07-18

    申请人： Ying-Chih Chen

    发明人： Ying-Chih Chen

    IPC分类号： H01L21/00 ,  H01L21/312 ,  H01L23/29 ,  H01L23/31 ,  H01L23/525

    CPC分类号： H01L21/02118 ,  H01L21/02337 ,  H01L21/312 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/525 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

    摘要： A method for forming a semiconductor chip or wafer includes following steps. A semiconductor substrate is provided, and then a polymer layer is deposited over the semiconductor substrate, wherein the polymer layer comprises polyimide. The polymer layer with a temperature profile having a peak temperature between 200 and 320 degrees Celsius. Alternatively, the temperature profile may comprises a period of time with a temperature higher than 320 degree Celsius, wherein the period of time is shorter than 45 minutes.

    摘要翻译： 用于形成半导体芯片或晶片的方法包括以下步骤。 提供半导体衬底，然后在半导体衬底上沉积聚合物层，其中聚合物层包括聚酰亚胺。 具有温度分布的聚合物层具有在200和320摄氏度之间的峰值温度。 或者，温度分布可以包括温度高于320摄氏度的时间段，其中时间段短于45分钟。

    Rotary buckle structure
    17.
    发明授权
    Rotary buckle structure 失效
    旋转扣结构

    公开(公告)号：US06739022B1

    公开(公告)日：2004-05-25

    申请号：US10292760

    申请日：2002-11-13

    申请人： Ying-Chih Chen

    发明人： Ying-Chih Chen

    IPC分类号： F16B4504

    CPC分类号： F16B45/04 ,  F16B21/00 ,  F16G15/08 ,  F16G17/00 ,  Y10T24/45272 ,  Y10T24/45288 ,  Y10T24/45382 ,  Y10T24/4755

    摘要： The present invention relates to a rotary buckle structure which includes a buckle member and a rotary member. The bottom of the buckle member and rotary member are respectively coupled by way of a downwardly tapered conical body, and conical hole, and which have the same concentric axis. A length of surface of external circumference is longer than the length of the inner circumference of the conical hole. This arrangement improves the traditional buckle and effectively reduces the wearing to prevent the entire buckle set from loosening or falling off, and thus extends the life of use.

    摘要翻译： 旋转带扣结构技术领域本发明涉及一种旋转带扣结构，其包括带扣构件和旋转构件。 带扣构件和旋转构件的底部分别通过向下锥形的锥形体和锥形孔联接，并且具有相同的同心轴线。 外周长的表面长度大于圆锥孔内周长。 这种布置改善了传统的扣环，有效地减少了磨损，防止整个扣环松动或脱落，从而延长了使用寿命。