公开(公告)号：US20120282709A1

公开(公告)日：2012-11-08

申请号：US13496059

申请日：2009-09-14

申请人： Byung Chul Lee ,  Jin Sik Kim ,  Hyun Joon Shin ,  Sang Youp Lee ,  Ji Yoon Kang

发明人： Byung Chul Lee ,  Jin Sik Kim ,  Hyun Joon Shin ,  Sang Youp Lee ,  Ji Yoon Kang

IPC分类号： G01N21/64 ,  G01N21/76 ,  C07K1/26 ,  B82Y5/00 ,  B82Y20/00

CPC分类号： C12Q1/6869 ,  C12Q2525/107 ,  C12Q2537/161 ,  C12Q2565/631

摘要： Provided are a DNA sequence analysis method of high precision providing improved optical limits by detecting wavelengths of lights emitted from labels in the state where a DNA is electrically tethered and completely stretch, and a nanodevice chip for automating the method. Also provided are a DNA sequence analysis method capable of removing binding errors through complementarily binding between a plurality of peptide nucleic acids (PNAs) labeled with labels emitting lights of different wavelengths and a target DNA to be sequenced, and resolving the limit in optical spatial resolution.

摘要翻译： 提供了一种高精度的DNA序列分析方法，其通过检测在DNA被电连接并完全拉伸的状态下从标签发射的光的波长来提供改善的光学限制，以及用于使该方法自动化的纳米设备芯片。 还提供了一种DNA序列分析方法，其能够通过在发射不同波长的光的标记的标记的多个肽核酸（PNA）和待测序的靶DNA之间的互补结合来消除结合错误，并且解决光学空间分辨率的限制 。

公开(公告)号：US20120098859A1

公开(公告)日：2012-04-26

申请号：US12983639

申请日：2011-01-03

申请人： Hee-Ju LEE ,  Jae-Keun PARK ,  Jae-Woong SOH ,  Su-Jung YUK ,  Sang-Youp LEE ,  Sung-Yoon CHUNG

发明人： Hee-Ju LEE ,  Jae-Keun PARK ,  Jae-Woong SOH ,  Su-Jung YUK ,  Sang-Youp LEE ,  Sung-Yoon CHUNG

IPC分类号： G09G5/00

CPC分类号： G06K9/00671 ,  G06K9/6807

摘要： An apparatus and method for providing an augmented reality (AR) user interface. The method includes acquiring an image containing at least one object; recognizing the object from the acquired image; detecting AR information related to the recognized object; classifying the detected AR information into groups according to specific property information; generating a user interface that displays the groups of AR information separately.

摘要翻译： 一种用于提供增强现实（AR）用户界面的装置和方法。 该方法包括获取包含至少一个对象的图像; 从获取的图像识别对象; 检测与识别对象相关的AR信息; 根据具体属性信息将检测到的AR信息分组成组; 生成分别显示AR信息组的用户界面。

公开(公告)号：US20120012247A1

公开(公告)日：2012-01-19

申请号：US13137936

申请日：2011-09-21

申请人： Keungjin Sohn ,  Nobuyuki Ikeguchi ,  Joung-Gul Ryu ,  Ho-Sik Park ,  Sang-Youp Lee ,  Joon-Sik Shin ,  Jung-Hwan Park

发明人： Keungjin Sohn ,  Nobuyuki Ikeguchi ,  Joung-Gul Ryu ,  Ho-Sik Park ,  Sang-Youp Lee ,  Joon-Sik Shin ,  Jung-Hwan Park

IPC分类号： B32B38/04 ,  B32B37/10 ,  B32B37/14

CPC分类号： B32B37/185 ,  B29C65/02 ,  B29C66/001 ,  B29C66/1122 ,  B29C66/342 ,  B29C66/45 ,  B29C66/472 ,  B29C66/71 ,  B29C66/7212 ,  B29C66/723 ,  B29C66/72321 ,  B29C66/73111 ,  B29C66/73115 ,  B29C66/73116 ,  B29C66/73161 ,  B29C66/7392 ,  B29C66/742 ,  B29C66/82661 ,  B29C66/9141 ,  B29C66/91933 ,  B29C66/929 ,  B29K2067/00 ,  B29K2101/12 ,  B29K2105/0079 ,  B29K2105/06 ,  B29K2267/00 ,  B29K2277/00 ,  B29K2305/00 ,  B29K2305/02 ,  B29K2305/10 ,  B29K2305/12 ,  B29L2009/00 ,  B29L2009/003 ,  B29L2031/3425 ,  B32B3/266 ,  B32B5/022 ,  B32B5/024 ,  B32B5/147 ,  B32B5/26 ,  B32B7/02 ,  B32B15/08 ,  B32B15/14 ,  B32B15/18 ,  B32B15/20 ,  B32B27/08 ,  B32B27/12 ,  B32B27/18 ,  B32B27/20 ,  B32B27/28 ,  B32B27/36 ,  B32B27/40 ,  B32B38/0008 ,  B32B2255/02 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/02 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2262/10 ,  B32B2262/101 ,  B32B2305/08 ,  B32B2307/30 ,  B32B2307/538 ,  B32B2307/734 ,  B32B2310/14 ,  B32B2367/00 ,  B32B2457/08 ,  H01L2224/16227 ,  H01L2924/15311 ,  H05K1/0366 ,  H05K1/056 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/068 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T156/10 ,  Y10T156/1056 ,  Y10T428/24331 ,  Y10T428/31504 ,  Y10T428/31786 ,  B29K2309/08

摘要： A method of manufacturing an insulating sheet, the method including providing a reinforcement material having a thermoplastic resin layer stacked thereon; stacking the thermoplastic resin layer stacked on the reinforcement material over a core substrate; and hot pressing the reinforcement material and the thermoplastic resin layer onto the core substrate.

摘要翻译： 一种制造绝缘片的方法，该方法包括提供其上堆叠有热塑性树脂层的增强材料; 将堆叠在增强材料上的热塑性树脂层堆叠在芯基板上; 并将加强材料和热塑性树脂层热压到芯基板上。

公开(公告)号：US20090255714A1

公开(公告)日：2009-10-15

申请号：US12232894

申请日：2008-09-25

申请人： Keung-Jin Sohn ,  Joon-Sik Shin ,  Joung-Gul Ryu ,  Jung-Hwan Park ,  Ho-Sik Park ,  Sang-Youp Lee

发明人： Keung-Jin Sohn ,  Joon-Sik Shin ,  Joung-Gul Ryu ,  Jung-Hwan Park ,  Ho-Sik Park ,  Sang-Youp Lee

IPC分类号： B05D3/00 ,  B05D5/12 ,  H05K1/00

CPC分类号： H05K1/0366 ,  C08J5/046 ,  H05K2201/0116 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0293 ,  Y10T29/49126 ,  Y10T29/49156

摘要： A method of manufacturing an insulating sheet, a method of manufacturing a copper clad laminate, and a method of manufacturing a printed circuit board, as well as a printed circuit board manufactured using these methods are disclosed. The method of manufacturing an insulating sheet can include: forming a thermoplastic reinforcement material, which includes fibers secured by a thermoplastic polymer binder, and in which pores are formed; forming a thermoplastic resin layer such that the thermoplastic reinforcement material is impregnated with a thermoplastic resin; and hot pressing the thermoplastic reinforcement material and the thermoplastic resin layer. This method can be utilized to manufacture an insulating sheet, which has a low rate of moisture absorption and superb electrical properties, including a low dielectric constant (Dk) and low dielectric loss (Df), and in which the fibers can readily be impregnated with the resin.

摘要翻译： 公开了一种绝缘片的制造方法，覆铜层压板的制造方法以及印刷电路板的制造方法以及使用这些方法制造的印刷电路板。 制造绝缘片的方法可以包括：形成热塑性增强材料，其包括由热塑性聚合物粘合剂固定的纤维，并且其中形成有孔; 形成热塑性树脂层，使得热塑性增强材料用热塑性树脂浸渍; 并热压热塑性增强材料和热塑性树脂层。 该方法可以用于制造绝缘片，其具有低吸湿率和极好的电性能，包括低介电常数（Dk）和低介电损耗（Df），并且其中纤维可以容易地浸渍 树脂。

公开(公告)号：US20090026604A1

公开(公告)日：2009-01-29

申请号：US12216375

申请日：2008-07-02

申请人： Joon-Sik Shin ,  Nobuyuki Ikeguchi ,  Keungjin Sohn ,  Joung-Gul Ryu ,  Sang-Youp Lee ,  Jung-Hwan Park ,  Ho-Sik Park

发明人： Joon-Sik Shin ,  Nobuyuki Ikeguchi ,  Keungjin Sohn ,  Joung-Gul Ryu ,  Sang-Youp Lee ,  Jung-Hwan Park ,  Ho-Sik Park

IPC分类号： H01L21/58 ,  H01L23/14

CPC分类号： H01L23/145 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/183 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/068 ,  H05K2201/09127 ,  H05K2201/09536 ,  H05K2201/10674 ,  H01L2224/05599

摘要： A semiconductor plastic package and a method of fabricating the semiconductor plastic package are disclosed. A method of fabricating a semiconductor plastic package can include: providing a core board, which includes at least one pad, and which has a coefficient of thermal expansion of 9 ppm/° C. or lower; stacking a build-up insulation layer over the core board; forming an opening by removing a portion of the build-up insulation layer such that the pad is exposed to the exterior; and placing a semiconductor chip in the opening and electrically connecting the semiconductor chip with the pad. This method can be utilized to provide higher reliability in the connection between the semiconductor chip and the circuit board.

摘要翻译： 公开了一种半导体塑料封装及其制造方法。 制造半导体塑料封装的方法可以包括：提供包括至少一个焊盘并且具有9ppm /℃或更低的热膨胀系数的芯板; 在芯板上堆叠堆积绝缘层; 通过去除所述积层绝缘层的一部分使得所述垫暴露于外部而形成开口; 并将半导体芯片放置在开口中并将半导体芯片与焊盘电连接。 该方法可以用于在半导体芯片和电路板之间的连接中提供更高的可靠性。

公开(公告)号：US20060018553A1

公开(公告)日：2006-01-26

申请号：US11135474

申请日：2005-05-24

申请人： Sang-Youp Lee

发明人： Sang-Youp Lee

IPC分类号： G06K9/36

CPC分类号： H04N19/198 ,  H04N19/126 ,  H04N19/134 ,  H04N19/15 ,  H04N19/152 ,  H04N19/172 ,  H04N19/196 ,  H04N19/61 ,  H04N19/80

摘要： Provided are an apparatus and a method for controlling a bit rate. The apparatus and method comprise a buffer for storing information as to a bit rate of a frame immediately preceding a frame to be compressed; a bit rate controller for generating a target bit rate and an expected bit rate of the frame to be compressed based on the bit rate of the immediately-preceding frame and calculating a target quantization level to be applied to the frame to be compressed based on the target bit rate, the expected bit rate and a quantization level applied to the immediately-preceding frame; and a quantizer for performing a quantization process based on the target quantization level.

摘要翻译： 提供了一种用于控制比特率的装置和方法。 该装置和方法包括一个缓冲器，用于存储关于要被压缩的帧之前的帧的比特率的信息; 比特率控制器，用于基于前一帧的比特率产生要压缩的目标比特率和预期比特率，并且基于该比特率计算要应用于要压缩的帧的目标量化级别 目标比特率，预期比特率和应用于紧前一帧的量化级别; 以及用于基于目标量化级执行量化处理的量化器。

公开(公告)号：US08397378B2

公开(公告)日：2013-03-19

申请号：US12232894

申请日：2008-09-25

申请人： Keung-Jin Sohn ,  Joon-Sik Shin ,  Joung-Gul Ryu ,  Jung-Hwan Park ,  Ho-Sik Park ,  Sang-Youp Lee

发明人： Keung-Jin Sohn ,  Joon-Sik Shin ,  Joung-Gul Ryu ,  Jung-Hwan Park ,  Ho-Sik Park ,  Sang-Youp Lee

IPC分类号： H05K1/03 ,  H05K3/00 ,  H05K3/02

CPC分类号： H05K1/0366 ,  C08J5/046 ,  H05K2201/0116 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0293 ,  Y10T29/49126 ,  Y10T29/49156

摘要： A method of manufacturing an insulating sheet, a method of manufacturing a copper clad laminate, and a method of manufacturing a printed circuit board, as well as a printed circuit board manufactured using these methods are disclosed. The method of manufacturing an insulating sheet can include: forming a thermoplastic reinforcement material, which includes fibers secured by a thermoplastic polymer binder, and in which pores are formed; forming a thermoplastic resin layer such that the thermoplastic reinforcement material is impregnated with a thermoplastic resin; and hot pressing the thermoplastic reinforcement material and the thermoplastic resin layer. This method can be utilized to manufacture an insulating sheet, which has a low rate of moisture absorption and superb electrical properties, including a low dielectric constant (Dk) and low dielectric loss (Df), and in which the fibers can readily be impregnated with the resin.

公开(公告)号：US07893527B2

公开(公告)日：2011-02-22

申请号：US12216375

申请日：2008-07-02

申请人： Joon-Sik Shin ,  Nobuyuki Ikeguchi ,  Keungjin Sohn ,  Joung-Gul Ryu ,  Sang-Youp Lee ,  Jung-Hwan Park ,  Ho-Sik Park

发明人： Joon-Sik Shin ,  Nobuyuki Ikeguchi ,  Keungjin Sohn ,  Joung-Gul Ryu ,  Sang-Youp Lee ,  Jung-Hwan Park ,  Ho-Sik Park

IPC分类号： H01L23/04

CPC分类号： H01L23/145 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/183 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/068 ,  H05K2201/09127 ,  H05K2201/09536 ,  H05K2201/10674 ,  H01L2224/05599

摘要： A semiconductor plastic package and a method of fabricating the semiconductor plastic package are disclosed. A method of fabricating a semiconductor plastic package can include: providing a core board, which includes at least one pad, and which has a coefficient of thermal expansion of 9 ppm/° C. or lower; stacking a build-up insulation layer over the core board; forming an opening by removing a portion of the build-up insulation layer such that the pad is exposed to the exterior; and placing a semiconductor chip in the opening and electrically connecting the semiconductor chip with the pad. This method can be utilized to provide higher reliability in the connection between the semiconductor chip and the circuit board.

摘要翻译： 公开了一种半导体塑料封装及其制造方法。 制造半导体塑料封装的方法可以包括：提供包括至少一个焊盘并且具有9ppm /℃或更低的热膨胀系数的芯板; 在芯板上堆叠堆积绝缘层; 通过去除所述积层绝缘层的一部分使得所述垫暴露于外部而形成开口; 并将半导体芯片放置在开口中并将半导体芯片与焊盘电连接。 该方法可以用于在半导体芯片和电路板之间的连接中提供更高的可靠性。

公开(公告)号：US20100330747A1

公开(公告)日：2010-12-30

申请号：US12923081

申请日：2010-08-31

申请人： Joon-Sik Shin ,  Nobuyuki Ikeguchi ,  Keungjin Sohn ,  Joung-Gul Ryu ,  Sang-Youp Lee ,  Jung-Hwan Park ,  Ho-Sik Park

发明人： Joon-Sik Shin ,  Nobuyuki Ikeguchi ,  Keungjin Sohn ,  Joung-Gul Ryu ,  Sang-Youp Lee ,  Jung-Hwan Park ,  Ho-Sik Park

IPC分类号： H01L21/58

CPC分类号： H01L23/145 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/183 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/068 ,  H05K2201/09127 ,  H05K2201/09536 ,  H05K2201/10674 ,  H01L2224/05599

摘要： A method of fabricating a semiconductor plastic package can include: providing a core board, which includes at least one pad, and which has a coefficient of thermal expansion of 9 ppm/° C. or lower; stacking a build-up insulation layer over the core board; forming an opening by removing a portion of the build-up insulation layer such that the pad is exposed to the exterior; and placing a semiconductor chip in the opening and electrically connecting the semiconductor chip with the pad. This method can be utilized to provide higher reliability in the connection between the semiconductor chip and the circuit board.

摘要翻译： 制造半导体塑料封装的方法可以包括：提供包括至少一个焊盘并且具有9ppm /℃或更低的热膨胀系数的芯板; 在芯板上堆叠堆积绝缘层; 通过去除所述积层绝缘层的一部分使得所述垫暴露于外部而形成开口; 并将半导体芯片放置在开口中并将半导体芯片与焊盘电连接。 该方法可以用于在半导体芯片和电路板之间的连接中提供更高的可靠性。

公开(公告)号：US20090084595A1

公开(公告)日：2009-04-02

申请号：US12010645

申请日：2008-01-28

申请人： Jung-Hwan Park ,  Keungjin Sohn ,  Joon-Sik Shin ,  Sang-Youp Lee ,  Ho-Sik Park ,  Joung-Gul Ryu

发明人： Jung-Hwan Park ,  Keungjin Sohn ,  Joon-Sik Shin ,  Sang-Youp Lee ,  Ho-Sik Park ,  Joung-Gul Ryu

IPC分类号： H05K1/11 ,  H05K3/10

CPC分类号： H05K3/4614 ,  H05K1/113 ,  H05K3/108 ,  H05K3/205 ,  H05K3/243 ,  H05K3/281 ,  H05K3/4647 ,  H05K3/4658 ,  H05K2203/0152 ,  H05K2203/066 ,  H05K2203/0733 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method of manufacturing a printed circuit board includes stacking a solder resist layer on one side of a carrier; forming a first circuit pattern, which includes a first electrode pad, on the solder resist layer; forming a conductive post on the first electrode pad; stacking and pressing the carrier onto an insulation layer stacked in an inner substrate, such that the conductive post faces the insulation layer; and removing the carrier. As the conductive posts are pressed into the insulation layers to implement interlayer connections, certain drilling processes for forming via holes may be omitted, so that the degree of freedom can be increased in designing the circuits, and the circuits can be made to have greater densities. As the circuit patterns are buried in the insulation layers, the board can be made thinner, and the attachment areas can be increased, to allow greater adhesion.

摘要翻译： 制造印刷电路板的方法包括在载体的一侧上堆叠阻焊层; 在阻焊层上形成包括第一电极焊盘的第一电路图案; 在所述第一电极焊盘上形成导电柱; 将载体堆叠并压制在层叠在内基板中的绝缘层上，使得导电柱面向绝缘层; 并移除载体。 由于导电柱被压入绝缘层以实现层间连接，因此可以省略用于形成通孔的某些钻孔工艺，从而可以在设计电路时增加自由度，并且可以使电路具有更大的密度 。 由于电路图案被埋在绝缘层中，所以可以使板更薄，并且可以增加附接区域，以允许更大的附着力。