Abstract:
Each of sense amplifiers is coupled to two bit lines with another bit line being interposed therebetween. Information stored in a memory cell is read out onto one of the two bit lines coupled to each of the sense ampliers, while a reference potential is read out onto the other bit line. Outside of the two bit lines, a reference potential is respectively read out onto other bit lines adjacent to the two bit lines. The information stored in the memory cell is read out onto the other bit line between the two bit lines.
Abstract:
An arrangement for providing a compensation of capacitance coupling between word lines and bit lines in a memory structure including twisted bit lines. Two dummy word lines maintained at a predetermined potential are formed at a twisted portion of a pair of bit lines. Dummy cells are provided at respective twisted portions of the dummy word lines and the bit lines. A plurality of word lines are formed in a direction intersecting with the bit lines and the word lines are divided into four word line groups according to positions of the twisted portions of the bit line pairs. When an arbitrary word line is selected, a potential of at least one dummy word line corresponding to the word line group to which the selected word line belongs is lowered. Consequently, the rise of the potential of the bit lines caused by the selection of the word line is compensated for by the lowering of the potential of at least one dummy word line, making it possible to decrease errors in reading. Particular cell layer arrangements simplify increase in integration density in the combination of dummy cell compensation with the twisted bit line balancing of capacitance coupling.
Abstract:
A dynamic RAM comprises an array of memory cells, each of the memory cells comprising a single access transistor and a charge storage region. The charge storage region comprises a first capacitor memory including a P.sup.+ region serving as an opposite electrode formed in the inner surface of a trench formed in a P type silicon substrate, a first capacitor dielectric film formed on the P.sup.+ region and a common electrode layer serving as a memory terminal formed on the first capacitor dielectric film, and a second memory capacitor including the common electrode layer, a second capacitor dielectric film formed on the common electrode layer and a cell plate electrode formed on the second capacitor dielectric film. The memory terminal and a drain region of the access transistor are connected in a self-aligning manner by an electrode having a sidewall shape which is in contact with an end of the memory terminal. Thus, a contact hole need not be formed in the first capacitor dielectric film, so that decrease of the electrical reliability of the first capacitor dielectric film can be prevented. The drain region of the access transistor may be formed by self-alignment with the contact portion of the common electrode layer.
Abstract:
A cut-off clock .phi..sub.5 generated by a cut-off clock generation circuit PG is supplied to a decode circuit DEC. The decode circuit DEC decodes the cut-off clock .phi..sub.5 to produce two types of cut-off clocks .phi..sub.5L and .phi..sub.5R. The two types of cut-off clocks .phi..sub.5L and .phi..sub.5R are supplied to a control clock generation circuit as shown in FIG. 3 or 11, which in turn produces control clocks .phi..sub.2L and .phi..sub.2R. The control clocks .phi..sub.2L and .phi..sub.2R are supplied to a shared sense amplifier of FIG. 1, to control on-off operations of transfer transistors 7.sub.L, 8.sub.L, 7.sub.R and 8.sub.R.
Abstract:
A semiconductor device is provided which can be efficiently subjected to a function test at a high speed by write/read operations for each plurality of bits. The semiconductor device according to the present invention comprises an encoder for encoding a 1-bit signal to a signal of a plurality of bits and a decoder receiving a signal of a plurality of bits for decoding the same to a 1-bit signal in response to the states thereof, so as to simultaneously write each bit of the plurality of bits from the encoder in each corresponding memory cell of a plurality of simultaneously selected memory cells in a writing test mode, and to simultaneously read information signals stored in the plurality of simultaneously selected memory cells in a reading test mode thereby to decode the signals to a 1-bit signal corresponding to the plurality of information signals.
Abstract:
Drains of first and second transistors are connected to a low level line of an internal circuitry such as a sense amplifier related to determination of a potential in a memory cell. The first transistor has its gate diode-connected to a sense drive line and its source grounded. The second transistor receives at its gate an internally generated signal, and its source is grounded. In the standby state, the potential of the sense drive line is set higher than low level of said word lines by the threshold voltage Vthn of the first transistor and used as dummy GND potential Vss′, and in the active state, the second transistor is rendered conductive so as to prevent floating of the sense drive line from the dummy GND potential Vss′.
Abstract:
Drains of first and second transistors are connected to a low level line of an internal circuitry such as a sense amplifier related to determination of a potential in a memory cell. The first transistor has its gate diode-connected to a sense drive line and its source grounded. The second transistor receives at its gate an internally generated signal, and its source is grounded. In the standby state, the potential of the sense drive line is set higher than low level of said word lines by the threshold voltage Vthn of the first transistor and used as dummy GND potential Vss′, and in the active state, the second transistor is rendered conductive so as to prevent floating of the sense drive line from the dummy GND potential Vss′.
Abstract:
In a semiconductor device and a method of manufacturing the same, an isolating and insulating film is provided at an end neighboring to a second impurity region with a groove extended to a semiconductor substrate. This removes a crystal defect existed at the end of the isolating and insulating film, and thus prevents leak of a current at this portion from a storage node. Consequently, provision of the groove at the edge portion of the isolating oxide film neighboring to the impurity region removes a crystal defect at this region, and thus eliminates a possibility of leak of a current.
Abstract:
Drains of first and second transistors are connected to a low level line of an internal circuitry such as a sense amplifier related to determination of a potential in a memory cell. The first transistor has its gate diode-connected to a sense drive line and its source grounded. The second transistor receives at its gate an internally generated signal, and its source is grounded. In the standby state, the potential of the sense drive line is set higher than low level of said word lines by the threshold voltage Vthn of the first transistor and used as dummy GND potential Vss', and in the active state, the second transistor is rendered conductive so as to prevent floating of the sense drive line from the dummy GND potential Vss'.
Abstract:
Drains of first and second transistors are connected to a low level line of an internal circuitry such as a sense amplifier related to determination of a potential in a memory cell. The first transistor has its gate diode-connected to a sense drive line and its source grounded. The second transistor receives at its gate an internally generated signal, and its source is grounded. In the standby state, the potential of the sense drive line is set higher than low level of said word lines by the threshold voltage Vthn of the first transistor and used as dummy GND potential Vss', and in the active state, the second transistor is rendered conductive so as to prevent floating of the sense drive line from the dummy GND potential Vss'.