Abstract:
A method of operating a plasma processing device includes outputting a first RF power having a first frequency and a first duty ratio, and outputting a second RF power having a second frequency higher than the first frequency and a second duty ratio smaller than the first duty ratio. The outputting of the first RF power and the outputting of the second RF power are synchronized with each other.
Abstract:
A parallax barrier panel includes a first and second substrate and a fluidic layer disposed therebetween. The first substrate includes first electrode parts, a water-repellent layer and a partition wall. Each of the first electrode parts includes a main electrode and a first notch electrode and a second notch electrode. The main electrode extends in a first direction on a first base substrate. The first and second notch electrodes are adjacent to respective ends of the main electrode. The first and second notch electrodes extend along the main electrode in the first direction. The second substrate includes a second electrode part and a second base substrate, the second electrode part being disposed on the second base substrate. The second base substrate is disposed opposite to the first base substrate. The fluidic layer controls a light transmittance according to a voltage difference between the first and second electrode parts.
Abstract:
A semiconductor wafer tape laminating system includes a loading device for conveying a wafer or cassette to a predetermined location where a laminating process is performed. A laminating device attaches UV tape to the front surface of the wafer conveyed by the loading device. A precutting device having a knife cuts the UV tape around the wafer as spaced therefrom to leave an edge of the tape protruding beyond the peripheral edge of the wafer. A wire cutting device having a wire removes the edge of the UV tape left around the wafer by the precutting device. An ultra-violet illuminator irradiates the edge of the UV tape with ultra-violet rays, and an unloading device carries the wafer to a downstream processing station. When the edge of the UV tape is irradiated with ultra-violet rays, it loses its adhesive strength. Accordingly, the edge will not attach itself to the wafer or to a piece of processing equipment after it is removed by the wire cutting device.
Abstract:
A 3D image display apparatus includes a light modulator configured to modulate an image light, a difference map generator configured to obtain an absolute value of a difference between a variation value of a left 2D image and a variation value of a right 2D image, an image processor configured to generate 3D image display position information using the absolute value, a light modulator controller configured to partially activate the light modulator in response to the 3D image display position information, an image generator for generating an interlaced image using the left and right 2D images, and an image display device for displaying the interlaced image. The activated area of the light modulator corresponds to an area of the displayed interlaced image, so that the light modulator modulates light provided from the displayed interlaced image, and does not modulate light provided from a remainder of the image.
Abstract:
Disclosed is a dynamic load balancing system. The dynamic load balancing system includes a resource management master managing bare servers that do not execute services and having a hierarchical structure and a service master dynamically allocating the bare servers to a load balancing server or a service execution server or dynamically releasing the pre-allocated load balancing server or service execution server by the bare servers, in consideration of monitoring information on a state or performance of a server and service requirements to be provided.
Abstract:
A card-type information recording medium having an embedded antenna for NFC communication is provided. The card-type information recording medium includes: a PCB that has a loop antenna pattern and a routing pattern formed on the top surface and the bottom surface thereof through the use of an etching process; an NFC communication unit and a USIM card unit that are horizontally mounted on the top of the PCB; and a molding material that is formed on the top of the PCB to cover the NFC communication unit and the USIM card unit. Accordingly, it is possible to perform functions of NFC and RFID read/tag by only mounting a USIM device thereon without adding any module or any constituent having an antenna function to a mobile terminal.
Abstract:
An image sensor includes an array of image sensor cells, on a substrate, and a peripheral circuit region extending adjacent the array of image sensor cells. The array of image sensor cells includes a plurality of lens elements and a plurality of color filters extending adjacent the plurality of lens elements. A plurality of photodiodes is provided in the substrate. The plurality of photodiodes are aligned to corresponding ones of the plurality of lens elements. An interconnection structure is also provided, which extends between the plurality of photodiodes and the plurality of color filters. The interconnection structure has an array of cavities therein that are aligned to corresponding ones of the plurality of photodiodes and are filled with a light guide material. The peripheral circuit region includes a metal interconnect pattern and an electrically conductive pad on the metal interconnect pattern. An electrically insulating layer extends on the electrically conductive pad. The electrically insulating layer is formed of the light guide material.
Abstract:
The present invention provides a photosensitive resin composition for a pad protective layer that includes (A) an alkali soluble resin, (B) a reactive unsaturated compound, (C) a photoinitiator, and (D) a solvent. The (A) alkali soluble resin includes a copolymer including about 5 to about 50 wt % of a unit having the Chemical Formula 1, about 1 to about 25 wt % of a unit having the Chemical Formula 2, and about 45 to about 90 wt % of a unit having the Chemical Formula 3, and a method of making an image sensor using the photosensitive resin composition.
Abstract:
An image sensing device having a protection pattern formed on microlenses is provided. The device includes a plurality of photodiodes provided in a semiconductor substrate. An insulating layer having a substantially flat top surface is disposed on the photodiodes. A plurality of microlenses are provided on the insulating layer and disposed over the photodiodes. The microlenses are covered with a protection pattern. The protection pattern can be formed of an oxide-based photosensitive polymer layer or a nitride-based photosensitive polymer layer, as examples. The protection pattern can have a substantially flat top surface.
Abstract:
Disclosed is a dynamic load balancing system. The dynamic load balancing system includes a resource management master managing bare servers that do not execute services and having a hierarchical structure and a service master dynamically allocating the bare servers to a load balancing server or a service execution server or dynamically releasing the pre-allocated load balancing server or service execution server by the bare servers, in consideration of monitoring information on a state or performance of a server and service requirements to be provided.