公开(公告)号：US06269281B1

公开(公告)日：2001-07-31

申请号：US09234498

申请日：1999-01-21

Applicant: Do-yun Hwang ,  Jin-heung Kim

Inventor： Do-yun Hwang ,  Jin-heung Kim

IPC: G06F1900

CPC classification number: H01L21/67276 ,  B24B7/228

Abstract: A back lapping in-line system for semiconductor device fabrication carries out a vinyl covering, a back side grinding, and a vinyl removing for grinding the back side of a wafer in-line with one single process. The back lapping in-line system has a server connected to a network line, a program therein for controlling the in-line processes, and an in-line facility connected to the server by a standard communication line, wherein parts of the in-line facility are assembled in order, and each part carries out its corresponding process according to information communicated to and from the server, and unloads the wafer after it passes through all of the corresponding processes successively. The in-line facility uses a single loading and unloading, and needs no storage space between parts.

Abstract translation: 用于半导体器件制造的背面研磨在线系统执行乙烯基覆盖物，背面研磨和乙烯基除去，用于研磨与单一工艺一起的晶片背面。 背面研磨在线系统具有连接到网络线的服务器，其中用于控制在线处理的程序，以及通过标准通信线路连接到服务器的在线设备，其中在线的部分 设备按顺序进行组装，并且每个部件根据与服务器通信的信息执行其对应的过程，并且在连续通过所有相应处理之后卸载晶​​片。 在线设备使用单个装载和卸载，并且不需要部件之间的存储空间。

公开(公告)号：US06193586B1

公开(公告)日：2001-02-27

申请号：US09228037

申请日：1998-12-24

Applicant: Bae-seung Park ,  Jin-heung Kim ,  Do-yun Hwang

Inventor： Bae-seung Park ,  Jin-heung Kim ,  Do-yun Hwang

IPC: B24B722

CPC classification number: B24B7/228 ,  B24B41/061 ,  B24B55/02

Abstract: A method and apparatus for grinding wafers without using an ultraviolet tape attached to the front face of the wafer reduces manufacturing costs, simplifies the grinding process and protects the semiconductor chips formed on the front face of the wafer from being damaged by static electricity. The grinding apparatus uses a grind chuck formed of a soft material having a high elastic modulus and a rising groove formed in the grind chuck. Deionized water is supplied onto the wafer from a first direction. Simultaneously, deionized water or air is supplied into the rising groove of the grind chuck from a second direction opposite to the first direction. The circumferential edge of the wafer overlaps the rising groove, such that the simultaneous supply of deionized water and/or air from the two directions protects the front surface of the wafer from being contaminated by silicon dust. The soft material of the grind chuck also protects the front surface of the wafer from being damaged by pressure from the grind unit.

Abstract translation: 用于研磨晶片而不使用附着在晶片正面的紫外线带的方法和装置降低了制造成本，简化了研磨工艺，并保护了晶片正面上形成的半导体芯片免受静电损伤。 研磨装置使用由具有高弹性模量的软质材料形成的研磨卡盘和形成在研磨卡盘中的上升槽。 去离子水从第一方向供应到晶片上。 同时，从与第一方向相反的第二方向将去离子水或空气供给到研磨卡盘的上升槽中。 晶片的圆周边缘与上升槽重叠，从而从两个方向同时供应去离子水和/或空气保护晶片的前表面免受硅粉污染。 研磨卡盘的软质材料还保护晶片的前表面免受来自研磨单元的压力的损坏。

公开(公告)号：US6039830A

公开(公告)日：2000-03-21

申请号：US114521

申请日：1998-07-13

Applicant: Bae-seung Park ,  Jin-heung Kim ,  Jung-hyun Cho

Inventor： Bae-seung Park ,  Jin-heung Kim ,  Jung-hyun Cho

IPC: H01L21/683 ,  B26D3/10 ,  B26F1/38 ,  B26F3/12 ,  H01L21/30 ,  H01L21/301 ,  H01L21/304 ,  H01L21/48 ,  H01L21/68 ,  B32B31/28 ,  B32B31/18

CPC classification number: H01L21/6835 ,  B26D3/10 ,  B26F1/3846 ,  B26F3/12 ,  Y10T156/108 ,  Y10T156/12 ,  Y10T156/1348 ,  Y10T83/145 ,  Y10T83/9292

Abstract: A semiconductor wafer tape laminating system includes a loading device for conveying a wafer or cassette to a predetermined location where a laminating process is performed. A laminating device attaches UV tape to the front surface of the wafer conveyed by the loading device. A precutting device having a knife cuts the UV tape around the wafer as spaced therefrom to leave an edge of the tape protruding beyond the peripheral edge of the wafer. A wire cutting device having a wire removes the edge of the UV tape left around the wafer by the precutting device. An ultra-violet illuminator irradiates the edge of the UV tape with ultra-violet rays, and an unloading device carries the wafer to a downstream processing station. When the edge of the UV tape is irradiated with ultra-violet rays, it loses its adhesive strength. Accordingly, the edge will not attach itself to the wafer or to a piece of processing equipment after it is removed by the wire cutting device.

Abstract translation: 半导体晶片带层压系统包括用于将晶片或盒传送到执行层压处理的预定位置的装载装置。 层压装置将UV带附着到由装载装置输送的晶片的前表面。 具有刀的预切割装置将晶片周围的UV带切割成间隔开，以使带的边缘突出超过晶片的周边边缘。 具有导线的线切割装置通过预切割装置去除留在晶片周围的UV带的边缘。 紫外线照射器用紫外线照射UV带的边缘，并且卸载装置将晶片运送到下游处理站。 当UV带的边缘被紫外线照射时，其失去粘合强度。 因此，边缘在通过线切割装置移除之后不会将其自身附着到晶片或一块加工设备上。

公开(公告)号：US06629876B1

公开(公告)日：2003-10-07

申请号：US09505960

申请日：2000-02-17

Applicant: Bae-seung Park ,  Jin-heung Kim ,  Do-yun Hwang

Inventor： Bae-seung Park ,  Jin-heung Kim ,  Do-yun Hwang

IPC: B24B100

CPC classification number: B24B7/228 ,  B24B41/061 ,  B24B55/02

Abstract: An apparatus for grinding wafers includes a grind chuck, formed of a soft material having a high elastic modulus, formed on a grind table. A grind unit grinds the wafer held by the grind chuck. Deionized water is supplied onto the wafer by a supply duct. A dam is formed on the grind table to surround the grind chuck, so that the wafer and the grind unit are submerged during grinding of the wafer. Also, an exhaust hole is formed through the grind table within an area surrounded by the dam, to exhaust the deionized water from the area surrounded by the dam.

Abstract translation: 用于研磨晶片的装置包括：由研磨台上形成的具有高弹性模量的软质材料形成的研磨卡盘。 研磨单元研磨由研磨卡盘保持的晶片。 去离子水通过供应管道供应到晶片上。 在研磨台上形成围绕研磨卡盘的坝，使得晶片和研磨单元在晶片研磨期间被浸没。 此外，在由坝围绕的区域内通过研磨台形成排气孔，以从由坝围绕的区域排出去离子水。