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公开(公告)号:US20240421047A1
公开(公告)日:2024-12-19
申请号:US18630326
申请日:2024-04-09
Inventor: Hiroshi ISHINO
IPC: H01L23/495 , H01L23/31
Abstract: A semiconductor module includes a first module and a second module. The first module and the second module are connected to each other by connecting terminals thereof. The first module and the second module are disposed to face each other in a thickness direction of the first module, and a direction of a current path in the first module is opposite to a direction of a current path in the second module.
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公开(公告)号:US20240412504A1
公开(公告)日:2024-12-12
申请号:US18435428
申请日:2024-02-07
Inventor: SAKON YAMAMOTO , TETSURO TAKIZAWA
Abstract: An imaging unit images a target object and generating an image including the target object. An element acquisition unit acquires a numerical value representing an intensity of an element of an environment around the vehicle. First and second image processors perform arithmetic processing on the image using first and second neural network models, respectively. A process selection unit selects one of the first and second image processors, which performs arithmetic processing on the image, based on a numerical value representing the intensity of the element as acquired.
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公开(公告)号:US20240401948A1
公开(公告)日:2024-12-05
申请号:US18659102
申请日:2024-05-09
Inventor: Keitaro ITO , Shota HARADA , Katsuaki GOTO , Yuuki INAGAKI , Hideaki NISHIKAWA , Takahiko YOSHIDA , Yusuke KAWAI
IPC: G01C19/5712
Abstract: An inertial sensor includes a resonator, a mounting board, and an actuator. The resonator has a first drive mode and a second drive mode. The mounting board has a plurality of electrode portions arranged at a distance from each other and surrounding the resonator. The actuator is configured to vibrate in a z-axis direction. The z-axis direction is a direction orthogonal to a planar direction of the mounting board. The actuator is further configured to vibrate the resonator in the z-axis direction to cause a resonance mode.
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公开(公告)号:US20240336278A1
公开(公告)日:2024-10-10
申请号:US18608253
申请日:2024-03-18
Inventor: Masataka HIRAI
CPC classification number: B60W60/001 , B60W50/14 , B60W2050/0083 , B60W2050/146 , B60W2540/215 , B60W2556/40
Abstract: A vehicle control system mounted on a vehicle includes an automated driving system configured to execute automated driving. The vehicle control system includes at least one processor and at least one memory storing computer program code. The at least one memory and the computer program code are configured, with the at least one processor, to cause the vehicle control system to carry out adjusting and acquiring. The adjusting is adjusting a behavior of the vehicle during execution of the automated driving. The behavior includes at least one of a traveling position in a width direction in a traveling lane, a vehicle speed, or an acceleration. The acquiring is acquiring behavior request information related to a behavior request for the behavior from an occupant of the vehicle. The adjusting includes adjusting the behavior determined by the automated driving system based on the behavior request information.
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公开(公告)号:US12111499B2
公开(公告)日:2024-10-08
申请号:US17861909
申请日:2022-07-11
Inventor: Hiroshi Ando , Kodai Takeda
CPC classification number: G02B6/34 , G02B27/0018
Abstract: A light guide member includes an incident portion, an emission portion, a reflection portion, and an inclined portion. An internal reflection angle inside the reflection portion and the emission portion is larger than an incident angle of an external light with respect to a first normal line that is a normal line of the emission portion. A first inclination angle that is an inclination angle of the incident portion with respect to the first normal line is smaller than the internal reflection angle. A height from the emission portion to a second side of the incident portion is larger than a distance between the emission portion and the reflection portion. A second inclination angle that is an inclination angle of the inclined portion with respect to the first normal line is smaller than the internal reflection angle.
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公开(公告)号:US12100638B2
公开(公告)日:2024-09-24
申请号:US17684550
申请日:2022-03-02
Inventor: Shohei Nagai
IPC: H01L23/367 , H01L23/00 , H01L23/36 , H01L23/373 , H01L23/427 , H01L25/07
CPC classification number: H01L23/3675 , H01L23/36 , H01L23/3738 , H01L23/4275 , H01L24/24 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/072 , H01L2224/24246 , H01L2224/32245 , H01L2224/48175 , H01L2224/73265 , H01L2924/1815 , H01L2924/182
Abstract: A semiconductor device includes a semiconductor chip, a heat sink, a resin package, heat transfer material and multiple spacers. The heat sink absorbs heat of the semiconductor chip. The resin package accommodates the semiconductor chip, and the resin package has a surface at which the heat sink is disposed. The heat transfer material has fluidity, and the heat transfer material is filled between the heat sink and the cooling plate. The spacers are dispersedly arranged in the heat transfer material, and the spacers are in contact with the heat sink and the cooling plate.
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公开(公告)号:US12074113B2
公开(公告)日:2024-08-27
申请号:US17679603
申请日:2022-02-24
Inventor: Shohei Nagai
IPC: H01L23/367 , H01L23/538 , H01L25/07 , H01L25/16 , H01L25/18
CPC classification number: H01L23/5389 , H01L23/367 , H01L25/072 , H01L25/16 , H01L25/18
Abstract: A semiconductor device includes: a substrate main body having a first surface and a second surface; an electric component arranged in the substrate main body; a first terminal and a second terminal arranged on the first surface or the second surface, respectively; a first internal conductor pattern arranged in a first circuit layer arranged between the electric component and the first surface, and electrically connected to the first terminal and the electric component; and a second internal conductor pattern arranged in a second circuit layer arranged between the electric component and the second surface, and electrically connected to the second terminal and the electric component. The first internal conductor pattern and the second internal conductor pattern are at least partially opposed to each other inside the substrate main body.
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公开(公告)号:US20240282849A1
公开(公告)日:2024-08-22
申请号:US18421356
申请日:2024-01-24
Inventor: Takaya SHIMONO , Yohei IWAHASHI
IPC: H01L29/78 , H01L27/06 , H01L29/06 , H01L29/66 , H01L29/861
CPC classification number: H01L29/7803 , H01L27/0629 , H01L29/0696 , H01L29/6609 , H01L29/66712 , H01L29/7813 , H01L29/861
Abstract: A semiconductor device includes an element region having a gate switching element, and a temperature sensing region having a temperature sensing diode. The gate switching element in the element region includes gate trenches, gate electrodes and an interlayer insulating layer covering an upper surface of each of the gate electrodes in the gate trenches. The temperature sensing diode in the temperature sensing region includes an anode region, a cathode region, first dummy trenches provided in the anode region, a first insulating layer provided in each of the first dummy trenches, second dummy trenches provided in the cathode region, and a second insulating layer provided in each of the second dummy trenches.
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公开(公告)号:US20240210549A1
公开(公告)日:2024-06-27
申请号:US18456056
申请日:2023-08-25
Applicant: DENSO CORPORATION , MIRISE Technologies Corporation
Inventor: Tatsuya ENAMI , Yoshie KOBAYASHI , Yukou MURASE
IPC: G01S13/32 , G01S7/35 , G01S13/36 , G01S13/931
CPC classification number: G01S13/325 , G01S7/354 , G01S13/36 , G01S13/931
Abstract: A radar device includes a transmitting antenna unit, a modulator, a receiving antenna unit, a receiver, and a processor. The transmitting antenna unit includes transmitting antennas. The modulator generates transmission signals respectively provided to the transmitting antennas by executing phase-shift keying through diverging the common signal into diverged signals having the number being equal to the number of the transmitting antennas and rotating respective phases of the diverged signals. The receiving antenna unit includes at least one receiving antenna. The receiver generates a received code of at least one received signal. The received code is acquired by encoding an appearance pattern of a peak of at least one received signal on a Doppler frequency axis. The processor generates information related to an object, according to the received code generated by the receiver. The modulator executes the phase-shift keying by using a linear block code as an assigned code.
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130.
公开(公告)号:US20240183073A1
公开(公告)日:2024-06-06
申请号:US18482216
申请日:2023-10-06
Inventor: Soma SAKAKIBARA , Takahiro KANDA
IPC: C30B29/36 , C01B32/963 , C30B25/16
CPC classification number: C30B29/36 , C01B32/963 , C30B25/165
Abstract: A method of producing a silicon carbide single crystal includes: arranging a seed crystal in a heating container that defines a reaction chamber; and growing a silicon carbide single crystal on a surface of the seed crystal by supplying a supply gas containing a silicon carbide raw material gas while heating the reaction chamber. In the growing of the silicon carbide single crystal, the silicon carbide single crystal is grown by controlling a total pressure of the supply gas, which is an internal pressure of the heating container, to 40 kPa or more while controlling a flow rate of the silicon carbide raw material gas to a target value.
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