Method for producing a pressure sensor
    91.
    发明授权
    Method for producing a pressure sensor 有权
    压力传感器的制造方法

    公开(公告)号:US06804883B1

    公开(公告)日:2004-10-19

    申请号:US09603060

    申请日:2000-06-26

    IPC分类号: H01R4300

    摘要: A method for producing a pressure sensor, in which a semiconductor pressure pick-up is mounted on a mounting section of a lead grid, in particular a leadframe. The semiconductor pressure pick-up is electrically connected to contact sections of the lead grid. The lead grid, together with the semiconductor pressure pick-up, is inserted into an injection molding die. A die part is brought into contact at the side of the semiconductor pressure pick-up facing away from the mounting section or at side of the mounting section facing away from the semiconductor pressure pick-up. The semiconductor pressure pick-up in the injection molding die is subsequently enclosed by a housing made of mold compound. In order to prevent the mounting section from giving way, it is proposed to clamp the mounting section of the lead grid in the injection molding die when producing the housing.

    摘要翻译: 一种制造压力传感器的方法,其中半导体压力传感器安装在引线格栅的安装部分,特别是引线框架上。 半导体压力传感器电连接到引线栅格的接触部分。 引线格栅与半导体压力传感器一起插入注塑模具中。 模具部件在半导体压力拾取器的背离安装部分或背离半导体压力传感器的安装部分的一侧被接触。 注射模具中的半导体压力拾取器随后由由模具化合物制成的壳体封闭。 为了防止安装部分的脱落,提出在制造壳体时将引线格栅的安装部分夹紧在注塑模具中。

    Planarization process for thin film surfaces
    95.
    发明申请
    Planarization process for thin film surfaces 失效
    薄膜表面平面化处理

    公开(公告)号:US20040093719A1

    公开(公告)日:2004-05-20

    申请号:US10295382

    申请日:2002-11-15

    摘要: A method is provided for planarization of structures which minimizes step heights, reduces process steps, improves cleanliness, and provides increased ease of debond. Structures are placed with working surfaces facing down onto an adhesive layer such that structures remain fixed during heating. A bi-layer encapsulating film is used to achieve planarization. A carrier is bi-laminated with a thermoplastic film layer followed by a chemically inert protective polymer film layer that can withstand etch and cleaning processes. The thermoplastic layer is laminated on top of the carrier; the polymer layer is laminated on top of the joined thermoplastic layer and carrier. The carrier with bi-layer film is then placed onto the backside of the structures to resist chemical attack from the front side during photostrip and enable planarization. When heat is applied, the bi-layer encapsulating film melts and pushes the polymer layer into the gaps between structures thereby achieving complete planarization.

    摘要翻译: 提供了一种使结构平坦化的方法,其最小化步骤高度,减少工艺步骤,改善清洁度,并提供增加的脱粘方便性。 将结构放置在工作表面朝下的粘合剂层上,使得结构在加热期间保持固定。 使用双层封装膜来实现平坦化。 载体用热塑性薄膜层,然后是化学惰性的保护性聚合物薄膜层进行双层叠,可以承受蚀刻和清洁过程。 热塑性层层压在载体的顶部上; 聚合物层层压在接合的热塑性层和载体的顶部上。 然后将具有双层膜的载体放置在结构的背面,以防止在光带期间从正面的化学侵蚀并且使得能够平坦化。 当施加热量时,双层包封膜熔化并将聚合物层推入结构之间的间隙,从而实现完全平坦化。

    Non lead frame clamping for matrix leadless leadframe package molding
    100.
    发明授权
    Non lead frame clamping for matrix leadless leadframe package molding 有权
    用于矩阵无引线框封装成型的非引线框夹

    公开(公告)号:US06564447B1

    公开(公告)日:2003-05-20

    申请号:US09714368

    申请日:2000-11-15

    申请人: Kang Aik Seng

    发明人: Kang Aik Seng

    IPC分类号: H01R4300

    摘要: A mold for taped lead frame assemblies is provided. The mold has a mold cavity large enough to hold an entire lead frame assembly. A taped lead frame assembly is placed completely in the mold cavity. A cover is used to cover the mold cavity. The cover is spaced apart from the taped lead frame assembly. A riser may be used to provide the spacing between the cover and the taped lead frame assembly, so that the cover does not contact the taped lead frame assembly. An encapsulation material is placed in the mold cavity and then hardened. The encapsulated taped lead frame assembly is then removed from the mold and singulated.

    摘要翻译: 提供了一种用于胶带引线框架组件的模具。 模具具有足够大以容纳整个引线框架组件的模腔。 带状引线框架组件完全放置在模腔中。 盖用于覆盖模腔。 盖子与带状引线框架组件间隔开。 可以使用提升器来提供盖和带状引线框架组件之间的间隔,使得盖不接触带状引线框架组件。 将包封材料放置在模腔中,然后硬化。 然后将封装的胶带引线框架组件从模具中取出并分离。