公开(公告)号：US06804883B1

公开(公告)日：2004-10-19

申请号：US09603060

申请日：2000-06-26

申请人： Kurt Weiblen ,  Anton Doering ,  Juergen Nieder ,  Frieder Haag

发明人： Kurt Weiblen ,  Anton Doering ,  Juergen Nieder ,  Frieder Haag

IPC分类号： H01R4300

CPC分类号： B81C1/00333 ,  B81B2201/0264 ,  B81C2203/0154 ,  G01L19/0084 ,  G01L19/147 ,  G01L19/148 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/4902 ,  Y10T29/49169 ,  Y10T29/49171 ,  Y10T29/49174 ,  Y10T29/49176 ,  H01L2924/00014

摘要： A method for producing a pressure sensor, in which a semiconductor pressure pick-up is mounted on a mounting section of a lead grid, in particular a leadframe. The semiconductor pressure pick-up is electrically connected to contact sections of the lead grid. The lead grid, together with the semiconductor pressure pick-up, is inserted into an injection molding die. A die part is brought into contact at the side of the semiconductor pressure pick-up facing away from the mounting section or at side of the mounting section facing away from the semiconductor pressure pick-up. The semiconductor pressure pick-up in the injection molding die is subsequently enclosed by a housing made of mold compound. In order to prevent the mounting section from giving way, it is proposed to clamp the mounting section of the lead grid in the injection molding die when producing the housing.

摘要翻译： 一种制造压力传感器的方法，其中半导体压力传感器安装在引线格栅的安装部分，特别是引线框架上。 半导体压力传感器电连接到引线栅格的接触部分。 引线格栅与半导体压力传感器一起插入注塑模具中。 模具部件在半导体压力拾取器的背离安装部分或背离半导体压力传感器的安装部分的一侧被接触。 注射模具中的半导体压力拾取器随后由由模具化合物制成的壳体封闭。 为了防止安装部分的脱落，提出在制造壳体时将引线格栅的安装部分夹紧在注塑模具中。

公开(公告)号：US06784782B2

公开(公告)日：2004-08-31

申请号：US09843258

申请日：2001-04-25

申请人： Osamu Inoue ,  Junichi Kato ,  Nobuya Matsutani ,  Hiroshi Fujii ,  Takeshi Takahashi

发明人： Osamu Inoue ,  Junichi Kato ,  Nobuya Matsutani ,  Hiroshi Fujii ,  Takeshi Takahashi

IPC分类号： H01F2724

CPC分类号： H01F41/127 ,  H01F1/24 ,  H01F1/26 ,  H01F1/28 ,  H01F17/04 ,  H01F27/027 ,  H01F27/292 ,  H01F41/0246 ,  Y10S156/922 ,  Y10T29/49002 ,  Y10T29/4902 ,  Y10T29/49021 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49158 ,  Y10T29/49172 ,  Y10T29/49176 ,  Y10T29/4922 ,  Y10T29/49261 ,  Y10T29/49277 ,  Y10T156/1082 ,  Y10T156/11 ,  Y10T428/11 ,  Y10T428/32

摘要： The present invention provides a composite magnetic body containing metallic magnetic powder and thermosetting resin and having a packing ratio of the metallic magnetic powder of 65 vol % to 90 vol % and an electrical resistivity of at least 104 &OHgr;·cm. When a coil is embedded in this composite magnetic body, a miniature magnetic element can be obtained that has a high inductance value and is excellent in DC bias characteristics.

公开(公告)号：US06775389B2

公开(公告)日：2004-08-10

申请号：US09927130

申请日：2001-08-10

申请人： William Vanbrooks Harrison ,  Lee F. Hartley ,  Philip A. Segel ,  Scott Crawford ,  C. Geoffrey E. Fernald

发明人： William Vanbrooks Harrison ,  Lee F. Hartley ,  Philip A. Segel ,  Scott Crawford ,  C. Geoffrey E. Fernald

IPC分类号： H04R2500

CPC分类号： H04R25/48 ,  A61N1/36036 ,  H04R25/456 ,  H04R2225/67 ,  Y10T29/49117 ,  Y10T29/49174 ,  Y10T29/49176 ,  Y10T29/49178

摘要： An In The Ear (ITE) microphone improves the acoustic response of a Behind The Ear (BTE) Implantable Cochlear Stimulation (ICS) system during telephone use. An acoustic seal provided by holding a telephone earpiece against the ear provides improved coupling of low frequency (up to about 1 KHz) sound waves, sufficient to overcome losses due to the near field acoustic characteristics common to telephones. In a preferred embodiment, the ITE microphone is connected to a removable ear hook of the BTE ICS system by a short bendable stalk.

摘要翻译： 耳朵（ITE）麦克风在电话使用期间提高了耳后（BTE）植入式耳蜗刺激（ICS）系统的声学响应。 通过将电话听筒靠在耳朵上提供的声学密封提供了改善的低频（高达约1KHz）声波的耦合，足以克服由于电话共同的近场声学特性引起的损失。 在优选实施例中，ITE麦克风通过短的可弯曲的杆连接到BTE ICS系统的可移除耳挂。

公开(公告)号：US20040143965A1

公开(公告)日：2004-07-29

申请号：US10758792

申请日：2004-01-16

申请人： Sumitomo Wiring Systems, Ltd. ,  Japan Automatic Machine Co., Ltd.

发明人： Masaharu Ichikawa ,  Hatsuo Yamada ,  Kazuhiro Sato ,  Yuji Izumida ,  Masahiro Toyoda

IPC分类号： B23P023/00 ,  H01R043/00

CPC分类号： H01R43/005 ,  Y10T29/49169 ,  Y10T29/49174 ,  Y10T29/49176 ,  Y10T29/49181 ,  Y10T29/49183 ,  Y10T29/49185 ,  Y10T29/49208 ,  Y10T29/49218 ,  Y10T29/514 ,  Y10T29/53213

摘要： A waterproof seal feeding machine is provided to feed waterproof cylindrical seals to a fitting position on an axis of an electric wire to fit the seals onto outer peripheries of end portions of the electric wire. The waterproof seal feeding machine includes holders that open and close at the fitting position. The waterproof seal feeding machine further includes a seal cavity that receives the seal at the fitting position when the holders are closed. A passage forming member forms a feeding passage to feed the seal into the seal cavity with a posture to receive the electric wire. A lock brings the seal to a locked state in cooperation with the holders and releases the locked state after insertion of the electric wire.

摘要翻译： 提供一种防水密封进给机，用于将防水圆柱形密封件供给到电线轴线上的装配位置，以将密封件装配到电线端部的外周。 防水密封进给机包括在安装位置打开和关闭的支架。 防水密封进给机还包括密封腔，当保持器关闭时，密封腔在接合位置接收密封。 通道形成构件形成供给通道以将密封件以接收电线的姿态进入密封腔。 锁定器将锁定件与保持器协作使密封件处于锁定状态，并且在插入电线之后释放锁定状态。

公开(公告)号：US20040093719A1

公开(公告)日：2004-05-20

申请号：US10295382

申请日：2002-11-15

发明人： Qing Dai ,  Jennifer Qing Lu ,  Dennis Richard McKean ,  Eun Row ,  Li Zheng

IPC分类号： G11B005/187 ,  G11B005/54 ,  G11B021/24 ,  H04R031/00

CPC分类号： G11B5/6005 ,  G11B5/3106 ,  G11B5/3163 ,  G11B5/3169 ,  G11B5/3173 ,  Y10S438/976 ,  Y10T29/49023 ,  Y10T29/49041 ,  Y10T29/49048 ,  Y10T29/49052 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49172 ,  Y10T29/49176 ,  Y10T29/49192 ,  Y10T29/4922 ,  Y10T29/49224 ,  Y10T156/1082 ,  Y10T156/1153

摘要： A method is provided for planarization of structures which minimizes step heights, reduces process steps, improves cleanliness, and provides increased ease of debond. Structures are placed with working surfaces facing down onto an adhesive layer such that structures remain fixed during heating. A bi-layer encapsulating film is used to achieve planarization. A carrier is bi-laminated with a thermoplastic film layer followed by a chemically inert protective polymer film layer that can withstand etch and cleaning processes. The thermoplastic layer is laminated on top of the carrier; the polymer layer is laminated on top of the joined thermoplastic layer and carrier. The carrier with bi-layer film is then placed onto the backside of the structures to resist chemical attack from the front side during photostrip and enable planarization. When heat is applied, the bi-layer encapsulating film melts and pushes the polymer layer into the gaps between structures thereby achieving complete planarization.

摘要翻译： 提供了一种使结构平坦化的方法，其最小化步骤高度，减少工艺步骤，改善清洁度，并提供增加的脱粘方便性。 将结构放置在工作表面朝下的粘合剂层上，使得结构在加热期间保持固定。 使用双层封装膜来实现平坦化。 载体用热塑性薄膜层，然后是化学惰性的保护性聚合物薄膜层进行双层叠，可以承受蚀刻和清洁过程。 热塑性层层压在载体的顶部上; 聚合物层层压在接合的热塑性层和载体的顶部上。 然后将具有双层膜的载体放置在结构的背面，以防止在光带期间从正面的化学侵蚀并且使得能够平坦化。 当施加热量时，双层包封膜熔化并将聚合物层推入结构之间的间隙，从而实现完全平坦化。

公开(公告)号：US20040055155A1

公开(公告)日：2004-03-25

申请号：US10645461

申请日：2003-08-20

发明人： Michael Manansala

IPC分类号： H05K003/34 ,  H05K013/00 ,  H01R043/00

CPC分类号： H01L24/85 ,  G06K9/0002 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/8592 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/30105 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49176 ,  Y10T29/49179 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/4554

摘要： System for providing an open-cavity semiconductor package. The system includes a method for wire bonding a finger sensor die to an external circuit. The finger sensor die includes a sensor array having one or more die contacts that are wire bonded to one or more external contacts of the external circuit so that a usable portion of the sensor array is maximized. The method comprises steps of forming a ball at a first end of a bonding wire, forming an electrically conductive connection between the ball and a selected external contact of the external circuit, extending the bonding wire to a selected die contact so as to form a wire loop having a low loop height, and forming an electrically conductive stitch connection between a second end of the bonding wire and the selected die contact.

摘要翻译： 用于提供开放式半导体封装的系统。 该系统包括用于将手指传感器芯片引线接合到外部电路的方法。 手指传感器芯片包括传感器阵列，该传感器阵列具有一个或多个管芯触头，引线接合到外部电路的一个或多个外部触点，使得传感器阵列的可用部分最大化。 该方法包括以下步骤：在接合线的第一端处形成球，在球与外部电路的选定的外部接触之间形成导电连接，将接合线延伸到选定的模接触部，以形成线 环路具有低回路高度，并且在接合线的第二端和所选择的管芯接触之间形成导电缝合连接。

公开(公告)号：US06661328B2

公开(公告)日：2003-12-09

申请号：US10198500

申请日：2002-07-17

申请人： Osamu Inoue ,  Junichi Kato ,  Nobuya Matsutani ,  Hiroshi Fujii ,  Takeshi Takahashi

发明人： Osamu Inoue ,  Junichi Kato ,  Nobuya Matsutani ,  Hiroshi Fujii ,  Takeshi Takahashi

IPC分类号： H01F2724

CPC分类号： H01F41/127 ,  H01F1/24 ,  H01F1/26 ,  H01F1/28 ,  H01F17/04 ,  H01F27/027 ,  H01F27/292 ,  H01F41/0246 ,  Y10S156/922 ,  Y10T29/49002 ,  Y10T29/4902 ,  Y10T29/49021 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49158 ,  Y10T29/49172 ,  Y10T29/49176 ,  Y10T29/4922 ,  Y10T29/49261 ,  Y10T29/49277 ,  Y10T156/1082 ,  Y10T156/11 ,  Y10T428/11 ,  Y10T428/32

摘要： The present invention provides a composite magnetic body containing metallic magnetic powder and thermosetting resin and having a packing ratio of the metallic magnetic powder of 65 vol % to 90 vol % and an electrical resistivity of at least 104 &OHgr;·cm. When a coil is embedded in this composite magnetic body, a miniature magnetic element can be obtained that has a high inductance value and is excellent in DC bias characteristics.

摘要翻译： 本发明提供一种含有金属磁性粉末和热固性树脂并且金属磁性粉末的填充率为65体积％至90体积％，电阻率至少为10 4Ω·cm的复合磁体。 当将该线圈埋入该复合磁体中时，可以获得具有高电感值且DC偏置特性优异的微型磁性元件。

公开(公告)号：US20030104655A1

公开(公告)日：2003-06-05

申请号：US10262062

申请日：2002-10-02

发明人： Tadashi Yamaguchi

IPC分类号： H01L021/56 ,  H01L021/60

CPC分类号： H01L23/4951 ,  H01L23/3107 ,  H01L23/49555 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1815 ,  Y10T29/49174 ,  Y10T29/49176 ,  Y10T29/49194 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention provides a resin-sealed semiconductor IC package of a large integration size having a size substantially equal to that of its component semiconductor IC chip. The resin-sealed semiconductor IC package comprises a semiconductor IC chip, a plurality of leads arranged on the semiconductor IC chip and having end portions bent so as to extend perpendicularly to the major surface of the semiconductor IC chip, a resin molding sealing the semiconductor IC chip and the leads therein so that the tips of the end portions of the leads are exposed on one surface thereof, and conductive elements connected respectively to the exposed tips of the leads.

摘要翻译： 本发明提供一种尺寸基本上等于其组件半导体IC芯片的大尺寸集成尺寸的树脂密封半导体IC封装。 树脂密封半导体IC封装包括：半导体IC芯片，设置在半导体IC芯片上的多个引线，其端部弯曲成垂直于半导体IC芯片的主表面;树脂模制件，密封半导体IC 芯片和其中的引线，使得引线的端部的末端在其一个表面上暴露，并且导电元件分别连接到引线的暴露的尖端。

公开(公告)号：US06567291B2

公开(公告)日：2003-05-20

申请号：US10177020

申请日：2002-06-24

申请人： Hiroshi Iwasaki ,  Osami Suzuki

发明人： Hiroshi Iwasaki ,  Osami Suzuki

IPC分类号： B42D1510

CPC分类号： G06K19/07745 ,  G06K19/077 ,  H01L2924/0002 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49172 ,  Y10T29/49176 ,  H01L2924/00

摘要： A method of manufacturing a small, thin card-type storage device is capable of easily manufacturing a frame for the storage device from a variety of resin materials without molding a very thin recessed bottom of the supporter. The method prepares a card-type support frame member from resin and a sheet material, cuts the sheet material into the size of the support frame member, to form a support sheet, bonds the support sheet to a bottom surface of the support frame member, to form a frame, and fits a memory module to be fixed in an opening of the support frame member in the frame, thereby completing the card-type storage device.

公开(公告)号：US06564447B1

公开(公告)日：2003-05-20

申请号：US09714368

申请日：2000-11-15

申请人： Kang Aik Seng

发明人： Kang Aik Seng

IPC分类号： H01R4300

CPC分类号： H01L21/67126 ,  H01L21/565 ,  H01L24/13 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T29/49121 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49176 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A mold for taped lead frame assemblies is provided. The mold has a mold cavity large enough to hold an entire lead frame assembly. A taped lead frame assembly is placed completely in the mold cavity. A cover is used to cover the mold cavity. The cover is spaced apart from the taped lead frame assembly. A riser may be used to provide the spacing between the cover and the taped lead frame assembly, so that the cover does not contact the taped lead frame assembly. An encapsulation material is placed in the mold cavity and then hardened. The encapsulated taped lead frame assembly is then removed from the mold and singulated.

摘要翻译： 提供了一种用于胶带引线框架组件的模具。 模具具有足够大以容纳整个引线框架组件的模腔。 带状引线框架组件完全放置在模腔中。 盖用于覆盖模腔。 盖子与带状引线框架组件间隔开。 可以使用提升器来提供盖和带状引线框架组件之间的间隔，使得盖不接触带状引线框架组件。 将包封材料放置在模腔中，然后硬化。 然后将封装的胶带引线框架组件从模具中取出并分离。