SEMICONDUCTOR DEVICE
    91.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号:US20150162452A1

    公开(公告)日:2015-06-11

    申请号:US14558857

    申请日:2014-12-03

    Abstract: A semiconductor device includes an oxide semiconductor film, a gate electrode overlapping the oxide semiconductor film with a gate insulating film therebetween, a nitride insulating film in contact with the oxide semiconductor film, and a conductive film in contact with the oxide semiconductor film. The oxide semiconductor film includes a first region in contact with the gate insulating film and a second region in contact with the conductive film. The second region contains an impurity element. The impurity element concentration of the second region is different from that of the first region.

    Abstract translation: 半导体器件包括氧化物半导体膜,与氧化物半导体膜重叠的栅极与其间的栅极绝缘膜,与氧化物半导体膜接触的氮化物绝缘膜和与氧化物半导体膜接触的导电膜。 氧化物半导体膜包括与栅极绝缘膜接触的第一区域和与导电膜接触的第二区域。 第二区域含有杂质元素。 第二区域的杂质元素浓度不同于第一区域的杂质元素浓度。

    Capacitor and Semiconductor Device
    92.
    发明申请
    Capacitor and Semiconductor Device 审中-公开
    电容器和半导体器件

    公开(公告)号:US20150053973A1

    公开(公告)日:2015-02-26

    申请号:US14462994

    申请日:2014-08-19

    CPC classification number: H01L27/1255 H01L27/1225 H01L29/94

    Abstract: A semiconductor device has an insulating surface provided with a transistor and a capacitor. The transistor includes a gate electrode, an oxide semiconductor film overlapping with the gate electrode, a gate insulating film between the gate electrode and the oxide semiconductor film, and a first conductive film serving as a pair of electrodes in contact with the oxide semiconductor film. An oxide insulating film in contact with the oxide semiconductor film, a metal oxide film over the oxide insulating film, and a second conductive film serving as a pixel electrode which is in an opening in the metal oxide film and is in contact with the first conductive film are provided. The capacitor includes a film having conductivity over the gate insulating film, the second conductive film, and the metal oxide film provided between the film having conductivity and the second conductive film.

    Abstract translation: 半导体器件具有设置有晶体管和电容器的绝缘表面。 晶体管包括栅电极,与栅电极重叠的氧化物半导体膜,栅电极和氧化物半导体膜之间的栅极绝缘膜,以及用作与氧化物半导体膜接触的一对电极的第一导电膜。 与氧化物半导体膜接触的氧化物绝缘膜,氧化物绝缘膜上的金属氧化物膜,以及用作像素电极的第二导电膜,其在金属氧化物膜的开口中并与第一导电 提供电影。 电容器包括在栅极绝缘膜上具有导电性的膜,第二导电膜和设置在具有导电性的膜和第二导电膜之间的金属氧化物膜。

    Semiconductor Device and Manufacturing Method Thereof
    93.
    发明申请
    Semiconductor Device and Manufacturing Method Thereof 有权
    半导体器件及其制造方法

    公开(公告)号:US20140374908A1

    公开(公告)日:2014-12-25

    申请号:US14306862

    申请日:2014-06-17

    Abstract: To improve the reliability of a semiconductor device including a low-resistance material such as copper, aluminum, gold, or silver as a wiring. Provided is a semiconductor device including a pair of electrodes electrically connected to a semiconductor layer which has a stacked-layer structure including a first protective layer in contact with the semiconductor layer and a conductive layer containing the low-resistance material and being over and in contact with the first protective layer. The top surface of the conductive layer is covered with a second protective layer functioning as a mask for processing the conductive layer. The side surface of the conductive layer is covered with a third protective layer. With this structure, entry or diffusion of the constituent element of the pair of conductive layers containing the low-resistance material into the semiconductor layer is suppressed.

    Abstract translation: 为了提高包括诸如铜,铝,金或银的低电阻材料的半导体器件作为布线的可靠性。 提供一种半导体器件,其包括电连接到半导体层的一对电极,所述半导体层具有层叠结构,所述层叠结构包括与半导体层接触的第一保护层和包含低电阻材料的导电层并且接触 与第一保护层。 导电层的顶表面覆盖有用作处理导电层的掩模的第二保护层。 导电层的侧表面被第三保护层覆盖。 通过这种结构,抑制了含有低电阻材料的一对导电层的构成元素进入或扩散到半导体层中。

    Semiconductor device and method for manufacturing the same
    94.
    发明授权
    Semiconductor device and method for manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US08809154B2

    公开(公告)日:2014-08-19

    申请号:US13721972

    申请日:2012-12-20

    Abstract: A highly reliable semiconductor device in which a transistor including an oxide semiconductor film has stable electric characteristics is manufactured. In the semiconductor device which includes an inverted-staggered transistor having a bottom-gate structure and being provided over a substrate having an insulating surface, at least a first gate insulating film and a second gate insulating film are provided between a gate electrode layer and an oxide semiconductor film, and heat treatment is performed at a temperature of 450° C. or higher, preferably 650° C. or higher, and then the oxide semiconductor film is formed. By the heat treatment at a temperature of 450° C. or higher before the formation of the oxide semiconductor film, diffusion of hydrogen elements into the oxide semiconductor film, which causes degradation or variations in electric characteristics of the transistor, can be reduced, so that the transistor can have stable electric characteristics.

    Abstract translation: 制造其中包含氧化物半导体膜的晶体管具有稳定的电特性的高度可靠的半导体器件。 在包括具有底栅结构的反交错晶体管并且设置在具有绝缘表面的衬底上的半导体器件中,至少第一栅极绝缘膜和第二栅极绝缘膜设置在栅极电极层和第二栅极绝缘膜之间, 氧化物半导体膜,在450℃以上,优选650℃以上的温度进行热处理,然后形成氧化物半导体膜。 通过在形成氧化物半导体膜之前在450℃以上的温度下进行热处理,可以减少导致劣化或者晶体管的电特性的变化的氢元素向氧化物半导体膜的扩散,因此 晶体管可以具有稳定的电气特性。

    Semiconductor device
    95.
    发明授权

    公开(公告)号:US12136674B2

    公开(公告)日:2024-11-05

    申请号:US17433728

    申请日:2020-02-17

    Abstract: A semiconductor device with favorable electrical characteristics is provided. A semiconductor device with stable electrical characteristics is provided. A highly reliable display device is provided. The semiconductor device includes a first conductive layer, a first insulating layer, a semiconductor layer, and a pair of second conductive layers. The first insulating layer is in contact with a top surface of the first conductive layer. The semiconductor layer is in contact with a top surface of the first insulating layer. The pair of second conductive layers are in contact with a top surface of the semiconductor layer. The pair of second conductive layers are apart from each other in a region overlapping with the first conductive layer. The semiconductor layer contains indium and oxygen and has a composition falling within a range obtained by connecting first coordinates (1:0:0), second coordinates (2:1:0), third coordinates (14:7:1), fourth coordinates (7:2:2), fifth coordinates (14:4:21), sixth coordinates (2:0:3), and the first coordinates in this order with a straight line in a ternary diagram showing atomic ratios of indium to an element M and zinc. In addition, the element M is one or more of gallium, aluminum, yttrium, and tin.

Patent Agency Ranking