公开(公告)号：US07916246B2

公开(公告)日：2011-03-29

申请号：US12720583

申请日：2010-03-09

Applicant: Dong-Ho Lee ,  Yong-Ho Yang

Inventor： Dong-Ho Lee ,  Yong-Ho Yang

IPC: G02F1/1335

CPC classification number: G02F1/133514 ,  G02F1/133555 ,  G02F2001/133519

Abstract: A color filtering member for improving the brightness of a display device is presented. The color filtering member includes colored regions (e.g., regions with RBG color filters) and black-and-white regions for transmitting white light. The black-and-white regions may be colorless gaps between adjacent colored regions. Multiple planarizing layers may be deposited on the colored regions and the black-and-white regions to form a surface that is sufficiently even. The color filtering member may include an intercepting region that extends between neighboring colored regions. The position of the intercepting region is not centered between the two colored regions that it separates. Rather, the intercepting region is shifted in the direction of rubbing (in the direction of liquid crystal alignment) to more effectively cover the regions where light leakage occurs. This color filtering member may be combined with an array member and a liquid crystal layer to form a display device.

Abstract translation: 提出了一种用于提高显示装置的亮度的滤色构件。 滤色构件包括着色区域（例如具有RBG滤色器的区域）和用于透射白光的黑白区域。 黑色和白色区域可以是相邻着色区域之间的无色间隙。 可以在着色区域和黑色和白色区域上沉积多个平坦化层以形成足够均匀的表面。 滤色构件可以包括在相邻的着色区域之间延伸的截取区域。 拦截区域的位置不在其分离的两个着色区域之间。 相反，截止区域沿着摩擦方向（在液晶取向方向）移动，以更有效地覆盖发生漏光的区域。 该滤色构件可以与阵列构件和液晶层组合以形成显示装置。

公开(公告)号：US07868438B2

公开(公告)日：2011-01-11

申请号：US12238894

申请日：2008-09-26

Applicant: Byung-Se So ,  Dong-Ho Lee ,  Hyun-Soon Jang

Inventor： Byung-Se So ,  Dong-Ho Lee ,  Hyun-Soon Jang

IPC: H01L23/02 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L24/49 ,  G11C5/00 ,  G11C5/06 ,  H01L23/50 ,  H01L24/48 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01055 ,  H01L2924/01075 ,  H01L2924/30105 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: Multi-chip package includes first through Nth semiconductor chips, each of which includes an input/output pad, an input/output driver coupled to the input/output pad, and an internal circuit. Each of the first through Nth semiconductor chips includes an internal pad for coupling the internal input/output driver and the internal circuit. The internal pads of the first through Nth semiconductor chips are coupled to each other such as via a common pad installed at a substrate. The input/output pad of the first semiconductor chip directly receives an input/output signal transmitted via a corresponding pin of the multi-chip package. The second through Nth semiconductor chips indirectly receive the input/output signal via the internal pads coupled to each other. The multi-chip package can improve signal compatibility by maintaining a parasitic load of a pin to at least the level of a single chip, when a signal is transmitted to the pin at high speed. Also, when a signal that is not necessarily transmitted at high speed is applied to a pin, semiconductor chips can be packaged according to the preexisting methods.

Abstract translation: 多芯片封装包括第一至第N个半导体芯片，每个半导体芯片包括输入/​​输出焊盘，耦合到输入/输出焊盘的输入/输出驱动器和内部电路。 第一至第N半导体芯片中的每一个包括用于耦合内部输入/输出驱动器和内部电路的内部焊盘。 第一至第N半导体芯片的内部焊盘彼此耦合，例如经由安装在基板上的公共焊盘。 第一半导体芯片的输入/输出焊盘直接接收通过多芯片封装的相应引脚传输的输入/输出信号。 第二至第N半导体芯片通过彼此耦合的内部焊盘间接接收输入/输出信号。 当信号以高速传输到引脚时，多芯片封装可以通过将引脚的寄生负载保持在至少单个芯片的电平来提高信号兼容性。 此外，当不需要高速传输的信号被施加到引脚时，可以根据预先存在的方法来封装半导体芯片。

公开(公告)号：US07768115B2

公开(公告)日：2010-08-03

申请号：US12267343

申请日：2008-11-07

Applicant: Jong-Joo Lee ,  Dong-Ho Lee

Inventor： Jong-Joo Lee ,  Dong-Ho Lee

IPC: H01L23/02

CPC classification number: H01L25/0657 ,  H01L23/13 ,  H01L23/66 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73257 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Provided are a stack chip and a stack chip package having the stack chip. Internal circuits of two semiconductor chips are electrically connected to each other through an input/output buffer connected to an external connection terminal. The semiconductor chip has chip pads, input/output buffers and internal circuits connected through circuit wirings. The semiconductor chip also has connection pads connected to the circuit wirings connecting the input/output buffers to the internal circuits. The semiconductor chips include a first chip and a second chip. The connection pads of the first chip are electrically connected to the connection pads of the second chip through electrical connection means. Input signals input through the external connection terminals are input to the internal circuits of the first chip or the second chip via the chip pads and the input/output buffers of the first chip, and the connection pads of the first chip and the second chip.

Abstract translation: 提供了具有堆叠芯片的堆叠芯片和堆叠芯片封装。 两个半导体芯片的内部电路通过连接到外部连接端子的输入/输出缓冲器彼此电连接。 半导体芯片具有芯片焊盘，输入/输出缓冲器和通过电路布线连接的内部电路。 半导体芯片还具有连接到将输入/输出缓冲器连接到内部电路的电路布线的连接焊盘。 半导体芯片包括第一芯片和第二芯片。 第一芯片的连接焊盘通过电连接装置电连接到第二芯片的连接焊盘。 通过外部连接端子输入的输入信号经由芯片焊盘和第一芯片的输入/输出缓冲器以及第一芯片和第二芯片的连接焊盘输入到第一芯片或第二芯片的内部电路。

公开(公告)号：US07697089B2

公开(公告)日：2010-04-13

申请号：US10552088

申请日：2004-03-16

Applicant: Jong-Soo Yoon ,  Dong-Ho Lee

Inventor： Jong-Soo Yoon ,  Dong-Ho Lee

IPC: G02F1/133 ,  G02F1/13357 ,  F21V8/00

CPC classification number: G09G3/3413 ,  G02F1/133555 ,  G02F2001/133342 ,  G02F2001/133622 ,  G02F2001/133626 ,  G02F2201/40 ,  G09G3/3406 ,  G09G3/342 ,  G09G3/3648 ,  G09G2300/023 ,  G09G2300/0456 ,  G09G2310/0235 ,  G09G2310/024

Abstract: In an LCD apparatus (400) having simplified structure and improved luminance, a light supplying unit (100) supplies an LCD panel (280) with red light during a time corresponding to one-third of a frame, green light during the time and blue light during the time. A light reflective-transmissive unit is disposed between the light supplying unit (100) and the LCD panel assembly (200) to transmit the red light, the green light and the blue light and to reflect an external light from exterior of the LCD panel assembly (200). The LCD apparatus displays an image by means of white light as well as red light, green light and blue light, thereby improving luminance and simplifying structure.

Abstract translation: 在具有简化的结构和改善的亮度的LCD装置（400）中，光供给单元（100）在对应于帧的三分之一的时间期间向LCD面板（280）供应红光，在时间期间为绿色光，蓝色 光在时间。 光反射透射单元设置在光供给单元（100）和LCD面板组件（200）之间以透射红光，绿光和蓝光，并且从LCD面板组件的外部反射外部光 （200）。 LCD装置通过白光以及红光，绿光和蓝光显示图像，从而提高亮度并简化结构。

公开(公告)号：US20090186780A1

公开(公告)日：2009-07-23

申请号：US12349299

申请日：2009-01-06

Applicant: June-Young Lee ,  Dong-Ho Lee ,  Nam Huh

Inventor： June-Young Lee ,  Dong-Ho Lee ,  Nam Huh

IPC: C40B60/12

CPC classification number: G01N21/6454 ,  B01J2219/00527 ,  B01J2219/00585 ,  B01J2219/00596 ,  B01J2219/00605 ,  B01J2219/00617 ,  B01J2219/00653 ,  B01J2219/00704 ,  B01J2219/00722

Abstract: A biochip for qualitatively analyzing a biological sample using probes includes a probe cell array comprising a plurality of probe cells capable of coupling with biomolecules of a biological sample, an optical sensor for detecting optical signals from probe cells selectively coupling with the biomolecules of the biological sample and converting the optical signals to digital electrical signals, and a memory cell array for storing the digital electrical signals.

Abstract translation: 用于使用探针定性分析生物样品的生物芯片包括探针单元阵列，其包括能够与生物样品的生物分子偶联的多个探针细胞，用于检测来自与生物样品的生物分子选择性偶联的探针细胞的光学信号的光学传感器 并将光信号转换为数字电信号，以及用于存储数字电信号的存储单元阵列。

公开(公告)号：US07542112B2

公开(公告)日：2009-06-02

申请号：US10799396

申请日：2004-03-12

Applicant: Young-Joon Rhee ,  Dong-Ho Lee ,  Chung-Hyo Lee

Inventor： Young-Joon Rhee ,  Dong-Ho Lee ,  Chung-Hyo Lee

IPC: G02F1/13351

CPC classification number: G02F1/1362 ,  G02F2001/136222

Abstract: Thin film transistors are formed on a lower substrate, and red, green, blue and transparent color filters are formed thereon. An organic insulating layer is formed on the color filters, and pixel electrodes are formed thereon. A black matrix and a common electrode are formed on an upper substrate facing the lower substrate.

Abstract translation: 薄膜晶体管形成在下基板上，并且在其上形成红，绿，蓝和透明滤色器。 在滤色片上形成有机绝缘层，在其上形成像素电极。 在面向下基板的上基板上形成黑矩阵和公共电极。

公开(公告)号：US20090109642A1

公开(公告)日：2009-04-30

申请号：US12249047

申请日：2008-10-10

Applicant: Hyun-Soo Chung ,  Dong-Ho Lee ,  Seong-Deok Hwang ,  Sun-Won Kang ,  Ki-Hyuk Kim

Inventor： Hyun-Soo Chung ,  Dong-Ho Lee ,  Seong-Deok Hwang ,  Sun-Won Kang ,  Ki-Hyuk Kim

IPC: H05K7/00

CPC classification number: H05K1/0271 ,  H01L23/498 ,  H01L25/0652 ,  H01L2224/16 ,  H01L2924/12044 ,  H05K1/181 ,  H05K2201/0133 ,  H05K2201/10674 ,  H05K2203/1572

Abstract: Semiconductor devices and electronic devices using the same. The semiconductor module may include a first semiconductor chip, and a module substrate having a top surface on which the first semiconductor chip is mounted and a second surface opposite the top surface, wherein the module substrate includes a first buffer layer to relieve stress occurring due to a difference of thermal expansions between the first semiconductor chip and the module substrate.

Abstract translation: 半导体器件和使用其的电子器件。 半导体模块可以包括第一半导体芯片和具有安装有第一半导体芯片的顶表面的模块衬底和与顶表面相对的第二表面，其中模块衬底包括第一缓冲层，以缓解由于 第一半导体芯片和模块基板之间的热膨胀差异。

公开(公告)号：US20090075414A1

公开(公告)日：2009-03-19

申请号：US12194459

申请日：2008-08-19

Applicant: June-Young Lee ,  Dong-Ho Lee ,  Hyeong-Jun Kim

Inventor： June-Young Lee ,  Dong-Ho Lee ,  Hyeong-Jun Kim

IPC: H01L21/50

CPC classification number: C40B80/00 ,  B01J19/0046 ,  B01J2219/00432 ,  B01J2219/00441 ,  B01J2219/00443 ,  B01J2219/00531 ,  B01J2219/0056 ,  B01J2219/00585 ,  B01J2219/00596 ,  B01J2219/00605 ,  B01J2219/00612 ,  B01J2219/00617 ,  B01J2219/00621 ,  B01J2219/00637 ,  B01J2219/00659 ,  B01J2219/00662 ,  B01J2219/00693

Abstract: A method of fabricating a biochip and a biochip fabricated by the method are provided. The method can include providing a substrate including a plurality of first areas separated from each other by a second area, forming a plurality of activation patterns on each of the first areas, coupling a plurality of probes to each of the activation patterns, and cutting the substrate along the second area to form a plurality of chips.

Abstract translation: 提供了一种通过该方法制造生物芯片和生物芯片的方法。 该方法可以包括提供包括通过第二区域彼此分离的多个第一区域的衬底，在每个第一区域上形成多个激活图案，将多个探针耦合到每个激活模式，并切割 基板沿着第二区域形成多个芯片。

公开(公告)号：US07481342B2

公开(公告)日：2009-01-27

申请号：US11117208

申请日：2005-04-28

Applicant: Dong-Ho Lee

Inventor： Dong-Ho Lee

IPC: B62D43/00

CPC classification number: B62D43/04

Abstract: A spare tire carrier fixing holder includes a bolt penetrating a vehicle body member. A holder is equipped at the upper end with a nut screwed to the bolt while the lower end of the holder is formed with a hook onto which a carrier is engaged. A guide ring is formed within the holder to guide the bolt to minimize the eccentricity between the bolt and nut.

Abstract translation: 备用轮胎载体固定保持器包括穿过车身构件的螺栓。 在上端装有一个固定器，螺母与螺栓螺合，同时保持架的下端形成一个钩子，托架与托架接合。 引导环形成在保持器内以引导螺栓以使螺栓和螺母之间的偏心度最小化。

公开(公告)号：US20090018035A1

公开(公告)日：2009-01-15

申请号：US12217169

申请日：2008-07-02

Applicant: June-Young Lee ,  Dong-Ho Lee

Inventor： June-Young Lee ,  Dong-Ho Lee

IPC: C40B60/00 ,  B65B7/00

CPC classification number: C40B60/12 ,  B01L3/508 ,  B01L2200/16 ,  B01L2200/18 ,  B01L2300/047 ,  B01L2300/0636

Abstract: A package having an improved yield is provided. The package includes a support on which a plurality of biochips are disposed, and a cover bonded to the support and defining a reaction space for each of the plurality of biochips together with the support, the cover including at least one inlet/outlet.

Abstract translation: 提供了具有提高的产量的包装。 该包装包括一个支撑件，多个生物芯片设置在该支架上，盖子与该支撑件结合并且与该支撑件一起为多个生物芯片中的每一个形成反应空间，该盖子包括至少一个入口/出口。