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1.
公开(公告)号:US20240328512A1
公开(公告)日:2024-10-03
申请号:US18192429
申请日:2023-03-29
Applicant: Intel Corporation
Inventor: Craig Yost , Paul Jonathan Diglio , Ruben Eduardo Nunez Blanco
CPC classification number: F16J15/06 , H05K7/20009
Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed that reduce leakage of a cooling fluid used to cool an electronic component. An example disclosed herein includes a seal assembly comprising a socket to receive an electronic component, the electronic component including a semiconductor die and a substrate to support the die, a first seal to be forced against the electronic component, the first seal to surround the die, and a second seal to be forced against the electronic component, the second seal to surround the first seal.
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2.
公开(公告)号:US12066257B2
公开(公告)日:2024-08-20
申请号:US17660838
申请日:2022-04-27
Applicant: EAGLE TECHNOLOGY, LLC
Inventor: Voi Nguyen , Jason Thompson , Charles Weirick
CPC classification number: F28F11/00 , H05K7/20009
Abstract: A sealing retainer may be coupled between a chassis and an electronic module. The sealing retainer includes a retainer body to be coupled to the chassis and a first cooling gas passageway that may be aligned with a chassis cooling gas passageway. A gas seal body has a second cooling gas passageway aligned with the first cooling gas passageway and coupled to the retainer body and movable between a retracted position that permits insertion and removal of the electronic module and an extended position that seals against the electronic module.
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公开(公告)号:US11735496B2
公开(公告)日:2023-08-22
申请号:US17154970
申请日:2021-01-21
Applicant: Frore Systems Inc.
Inventor: Suryaprakash Ganti , Seshagiri Rao Madhavapeddy
IPC: H05K7/20 , H01L23/46 , F04B43/04 , H01L23/473 , H10N30/20 , F04B17/00 , F04B39/06 , F04B43/09 , F04B45/04 , F04B45/047 , F04B53/10 , F04D33/00 , F25B21/02 , H01L23/42 , H01L23/427 , H01L23/433 , H04M1/02 , H10N30/80 , B06B1/06 , F04B43/08
CPC classification number: H01L23/4735 , B06B1/06 , F04B17/003 , F04B39/06 , F04B43/046 , F04B43/095 , F04B45/043 , F04B45/047 , F04B53/1077 , F04D33/00 , F25B21/02 , H01L23/42 , H01L23/427 , H01L23/433 , H01L23/4336 , H01L23/46 , H01L23/473 , H04M1/0202 , H05K7/20 , H05K7/20009 , H05K7/2039 , H05K7/20272 , H05K7/20281 , H10N30/20 , H10N30/204 , H10N30/2047 , H10N30/80 , F04B43/08 , F25B2321/023 , F25B2321/025 , F25B2321/0212 , F25B2321/0252
Abstract: An active cooling system and method for using the active cooling system are described. The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The second side of the cooling element is proximal to the heat-generating structure. The cooling element is configured to direct the fluid using a vibrational motion from the first side of the cooling element to the second side such that the fluid moves in a direction that is incident on a surface of the heat-generating structure at a substantially perpendicular angle and then is deflected to move along the surface of the heat-generating structure to extract heat from the heat-generating structure.
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公开(公告)号:US11706898B2
公开(公告)日:2023-07-18
申请号:US17954543
申请日:2022-09-28
Applicant: CHATSWORTH PRODUCTS, INC.
Inventor: William Krietzman
CPC classification number: H05K7/20009 , F24F7/04 , H05K7/20736
Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.
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公开(公告)号:US11705382B2
公开(公告)日:2023-07-18
申请号:US17179263
申请日:2021-02-18
Applicant: Frore Systems Inc.
Inventor: Suryaprakash Ganti , Seshagiri Rao Madhavapeddy
IPC: H01L23/433 , H01L23/473 , F04B53/10 , F04B43/04 , F04B45/047 , B06B1/06 , H01L23/427 , H05K7/20 , F25B21/02 , F04D33/00 , H04M1/02 , F04B43/09 , H01L23/46 , H01L23/42 , F04B17/00 , F04B45/04 , F04B39/06 , H10N30/00 , H10N30/20 , H10N30/80 , H10N35/80 , F04B43/08
CPC classification number: H01L23/4735 , B06B1/06 , F04B17/003 , F04B39/06 , F04B43/046 , F04B43/095 , F04B45/043 , F04B45/047 , F04B53/1077 , F04D33/00 , F25B21/02 , H01L23/42 , H01L23/427 , H01L23/433 , H01L23/4336 , H01L23/46 , H01L23/473 , H04M1/0202 , H05K7/20 , H05K7/20009 , H05K7/2039 , H05K7/20272 , H05K7/20281 , H10N30/00 , H10N30/20 , H10N30/204 , H10N30/2047 , H10N30/80 , H10N35/80 , F04B43/08 , F25B2321/023 , F25B2321/025 , F25B2321/0212 , F25B2321/0252
Abstract: A cooling system and method for using the cooling system are described. The cooling system includes a plurality of individual piezoelectric cooling elements spatially arranged in an array extending in at least two dimensions, a communications interface and driving circuitry. The communications interface is associated with the individual piezoelectric cooling elements such that selected individual piezoelectric cooling elements within the array can be activated based at least in part on heat energy generated in the vicinity of the selected individual piezoelectric cooling elements. The driving circuitry is associated with the individual piezoelectric cooling elements and is configured to drive the selected individual piezoelectric cooling elements.
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公开(公告)号:US11661965B2
公开(公告)日:2023-05-30
申请号:US17068943
申请日:2020-10-13
Applicant: Nokia Shanghai Bell Co., Ltd.
Inventor: Asaad Elsaadani , William Wilber
CPC classification number: F16B33/004 , F16B23/00 , H05K5/03 , H05K7/20009
Abstract: A device includes a head having a material having a plurality of pores, wherein at least some of the pores from the plurality of pores each have a size that is smaller than a water molecule and larger than an air molecule such that the air molecules can pass through the pores and the water molecules are prevented from passing through the pores; and an elongated body extending from the head and having a thread on an outer surface thereof and having a conduit extending longitudinally through the elongated body to the head. The device is configured to fasten a first surface to a second surface using the thread of the elongated body.
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公开(公告)号:US20190200484A1
公开(公告)日:2019-06-27
申请号:US16019573
申请日:2018-06-27
Applicant: Acer Incorporated
Inventor: Hung-Chi Chen , Hsueh-Chih Peng , Shun-Bin Chen , Huei-Ting Chuang , Pao-Min Huang
CPC classification number: H05K7/20409 , G06F1/166 , G06F1/203 , G06F1/206 , H05K5/0234 , H05K7/20009
Abstract: An electronic device includes a body and a shape memory element. The body includes an opening at a bottom surface of the electronic device. The shape memory element is twistably disposed in the opening, extended along an axis, and includes a first end which is fixed on the body, and a second end relative to the first end. When the temperature of the shape memory element is below a predetermined temperature range, the shape memory element is in a first shape and the second end is positioned inside the opening. When the temperature of the shape memory element is greater than the predetermined temperature range, the shape memory element is twisted to deform into a second shape, and the second end protrudes out of the opening.
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公开(公告)号:US10038391B2
公开(公告)日:2018-07-31
申请号:US15630118
申请日:2017-06-22
Applicant: SUNGROW POWER SUPPLY CO., LTD.
Inventor: Wei Zhao , You Lu , Tan Shen , Xiaodong Mei
CPC classification number: H02M7/003 , H02J1/102 , H02M7/42 , H05K7/1427 , H05K7/20009 , H05K7/2059 , H05K7/20909
Abstract: A central-string inverter device is provided, including a container and multiple string inverters installed in the container. The multiple string inverters are arranged in two rows located respectively on two opposite sides of the container. An intermediate duct is formed between the two rows of string inverters. An air outlet is arranged on each of side walls of the two opposite sides of the container. An air inlet is arranged on each of side walls of the other two opposite sides of the container or on a bottom wall of the container. Pulling structures corresponding to the multiple string inverters are arranged on the side walls of the two opposite sides of the container. Each string inverter is installed or removed through the pulling structure.
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公开(公告)号:US10021808B1
公开(公告)日:2018-07-10
申请号:US15593245
申请日:2017-05-11
Applicant: Apple Inc.
Inventor: Eric N. Nyland , Michael Benjamin Wittenberg , Timothy Y. Lee
CPC classification number: H05K7/20009 , H04M1/0202 , H04M2250/22 , H05K5/0213 , H05K5/0217
Abstract: A vent assembly in an electronic device is described. The vent assembly may regulate air into and out of the electronic device. The vent assembly may include multiple layers of material bonded together, with each layer having a flap (or flaps) that combines with another flap to form a valve. The vent assembly may include a first layer bonded with a second layer. The first layer includes a first flap, and the second layer includes a second flap that combines with the first flap to form a first valve that regulates air out of the electronic device. The vent assembly can include a third layer. Then, the second layer includes a third flap, and the third layer includes a fourth flap that combines with the third flap to form a second valve that regulates air into the electronic device. In some instances, each valve may permit airflow in one direction.
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公开(公告)号:US10021775B1
公开(公告)日:2018-07-10
申请号:US15627399
申请日:2017-06-19
Applicant: ASIA VITAL COMPONENTS CO., LTD.
Inventor: Meng Shen
CPC classification number: H05K1/0203 , F04D25/0613 , G06F1/20 , G06F1/203 , G06F1/206 , G06F2200/20 , G06F2200/201 , H05K3/0064 , H05K7/20 , H05K7/20009 , H05K7/20136 , H05K7/20145 , H05K7/20172 , H05K7/20545 , H05K7/20554 , H05K2203/063
Abstract: A circuit board and fan frame connection structure includes a fan frame, a circuit board and an adhesive member having multiple through holes. The fan frame includes a bottom board, a bearing cup disposed at the center of the bottom board and multiple perforations formed through the bottom board. The bottom board has an upper surface and a lower surface. The circuit board is adhered to the lower surface of the bottom board via the adhesive member. The electronic components arranged on the circuit board pass through the aligned through holes and perforations.
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