公开(公告)号：US12237571B2

公开(公告)日：2025-02-25

申请号：US18155797

申请日：2023-01-18

Applicant: EAGLE TECHNOLOGY, LLC

Inventor： Robert M. Taylor ,  Christopher L. Rose ,  John Carro ,  Richard I. Harless ,  Miguel Ortega-Morales ,  Timothy L. Fetterman ,  David Lopez

IPC: H01Q1/28 ,  H01Q1/08 ,  H01Q1/10 ,  H01Q1/12 ,  H01Q15/16

Abstract: A space antenna may include an extendible boom movable between stored and deployed positions. An extendible hoop may surround the extendible boom and is movable between the stored and deployed positions. A front cord arrangement may be coupled to the extendible hoop and defines a curved shape in the deployed position, and a reflective layer may be carried thereby. A rear cord arrangement may be behind the front cord arrangement and coupled between the extendible hoop and the extendible boom. The rear cord arrangement may include a rear plurality of interconnected cords defining rear polygons. Tie cords may extend between the front cord arrangement and the rear cord arrangement. A top cord arrangement may be above the reflective layer and coupled between the hoop and the extendible boom.

公开(公告)号：US12212669B2

公开(公告)日：2025-01-28

申请号：US17179562

申请日：2021-02-19

Applicant: EAGLE TECHNOLOGY, LLC

Inventor： Victor G. Bucklew ,  Fraser R. Dalgleish ,  Cypryan T. Klish ,  James A. Nagel

IPC: H04L9/08 ,  G06N10/00 ,  H04B10/70

Abstract: A quantum communications system may include a transmitter node, a receiver node, and a quantum communications channel coupling the transmitter node and receiver node. The transmitter node may include a pulse transmitter and pulse divider downstream therefrom. The receiver node may include a pulse recombiner and a pulse receiver downstream therefrom.

公开(公告)号：US12205880B2

公开(公告)日：2025-01-21

申请号：US17655610

申请日：2022-03-21

Applicant: Eagle Technology, LLC

Inventor： Matt Bauer ,  Timothy Clingenpeel ,  Beatriz Jimenez

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/66

Abstract: An electronic device may include an IC, a grid array substrate, and a multi-level interposer coupled between the IC and the grid array substrate. The multi-level interposer may have dielectric layers, and a sequence of metal levels carried by respective dielectric layers, and an RF sloped via including a sloped metal signal layer extending from a first metal level, through a second metal level, and to a third metal level, and a respective sloped lateral metal ground layer adjacent each side of the sloped metal signal layer.

公开(公告)号：US20250003446A1

公开(公告)日：2025-01-02

申请号：US18342939

申请日：2023-06-28

Applicant: Eagle Technology, LLC

Inventor： Stephen JENKINS

IPC: F16C3/03

Abstract: A cable-driven telescopic boom with several boom segments repositionable between stowed positions and deployed positions. The boom includes multiple spaced apart and separate cables that engage pulleys connected to each boom segment. A drive system can be used to apply tension to the cables to reconfigure the boom from a stowed configuration to a deployed configuration.

公开(公告)号：US20240410746A1

公开(公告)日：2024-12-12

申请号：US18808219

申请日：2024-08-19

Applicant: Eagle Technology, LLC

Inventor： Gordon Chun Kong Wu ,  Nicholas Piekiel ,  Kenneth M. Patterson ,  Brian Hart ,  John Osborn ,  Peter Bickford ,  Mitchell Gibson

IPC: G01J1/04 ,  G01J1/02

Abstract: Metering structure includes a rigid strut configured to support an optical element. A rigid shield mounted on the strut has a shield length which is substantially coextensive with the elongated length of the rigid strut such that rigid shield substantially encloses the strut along the entire shield length. The rigid shield has a surface finish which is highly absorptive of electromagnetic radiation in the optical spectrum. One or more thermal insulating material layers comprise a multi-layer insulation (MLI) system disposed between the rigid strut and the rigid shield. Rigid and flexure brackets secure the rigid shield to the strut.

公开(公告)号：US12152931B2

公开(公告)日：2024-11-26

申请号：US17825673

申请日：2022-05-26

Applicant: Eagle Technology, LLC

Inventor： Gordon Chun Kong Wu ,  Nicholas Piekiel ,  Kenneth M. Patterson ,  Brian Hart ,  John Osborn ,  Peter Bickford ,  Mitchell Gibson

IPC: G01J1/04 ,  G01J1/02

Abstract: Metering structure includes a rigid strut configured to support an optical element. A rigid shield mounted on the strut has a shield length which is substantially coextensive with the elongated length of the rigid strut such that rigid shield substantially encloses the strut along the entire shield length. The rigid shield has a surface finish which is highly absorptive of electromagnetic radiation in the optical spectrum. One or more thermal insulating material layers comprise a multi-layer insulation (MLI) system disposed between the rigid strut and the rigid shield. Rigid and flexure brackets secure the rigid shield to the strut.

公开(公告)号：US20240355089A1

公开(公告)日：2024-10-24

申请号：US18322758

申请日：2023-05-24

Applicant: EAGLE TECHNOLOGY, LLC

Inventor： Mark D. RAHMES ,  Glenn BOUDREAUX ,  William W. WATKINS ,  Morteza AKBARI ,  MICHAEL C. GARRETT ,  Chad LAU

IPC: G06V10/75 ,  G06N10/60 ,  G06V10/762

CPC classification number: G06V10/76 ,  G06N10/60 ,  G06V10/762

Abstract: An object detection device may include a variational autoencoder (VAE) configured to encode image data to generate a latent vector, and decode the latent vector to generate new image data. The object detection device may also include a quantum computing circuit configured to perform quantum subset summing, and a processor. The processor may be configured to generate a game theory reward matrix for a plurality of different deep learning models, cooperate with the quantum computing circuit to perform quantum subset summing of the game theory reward matrix, select a deep learning model from the plurality thereof based upon the quantum subset summing of the game theory reward matrix, and process the new image data using the selected deep learning model for object detection.

公开(公告)号：US20240302562A1

公开(公告)日：2024-09-12

申请号：US18180385

申请日：2023-03-08

Applicant: Eagle Technology, LLC

Inventor： VICTOR G. BUCKLEW ,  JOSEPH DODD ,  DONNA M. KOCAK ,  JAMES DRAKES

IPC: G01V9/00

CPC classification number: G01V9/00

Abstract: An outer space-based debris detection system may include a network of satellites. A first satellite may be configured to propagate a first series of solitary plasma waves through an outer space detection area having a debris body therein. The debris body propagates second plasma waves therefrom. A second satellite associated with the detection area may be configured to receive the first series of solitary plasma waves from the first satellite after interaction with the second plasma waves from the debris body to thereby detect the debris body.

公开(公告)号：US12070898B2

公开(公告)日：2024-08-27

申请号：US17096074

申请日：2020-11-12

Applicant: EAGLE TECHNOLOGY, LLC

Inventor： Christopher A. Corey ,  Randall K. Morse ,  Peter A. Wasilousky ,  Arthur C. Paolella ,  Carrigan L. Braun ,  Catheryn D. Logan

IPC: B29C64/135 ,  B23K26/06 ,  B23K26/082 ,  B29C64/153 ,  B29C64/255 ,  B29C64/268 ,  B29C64/286 ,  B29C64/393 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02

CPC classification number: B29C64/135 ,  B23K26/0643 ,  B23K26/082 ,  B29C64/153 ,  B29C64/255 ,  B29C64/268 ,  B29C64/286 ,  B29C64/393 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02

Abstract: An additive manufacturing device may include a laser source configured to generate a laser beam, a build material holder configured to hold an additive build material, a controllable deflector having a first scan rate, an AOD having a second scan rate faster than the first scan rate, and a controller. The controller may be configured to control the controllable deflector and the AOD to scan the laser beam relative to the build material holder to additively manufacture a workpiece in successive layers from the additive build material.

公开(公告)号：US20240260169A1

公开(公告)日：2024-08-01

申请号：US18630436

申请日：2024-04-09

Applicant: EAGLE TECHNOLOGY, LLC

Inventor： JASON THOMPSON

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0209 ,  H05K7/20336 ,  H05K2201/064 ,  H05K2201/066

Abstract: An electronic assembly may include a chassis, and electronic modules mounted within the chassis. Each electronic module may include a printed circuit substrate, heat-generating electronic components mounted on the printed circuit substrate, and a heat sink body mounted to the printed circuit substrate and having a plurality of heat pipe receiving passageways extending between opposing side edges and overlying corresponding heat-generating components. A respective elongate, passive, heat pipe may extend within each heat pipe receiving passageway and be removably fastened to at least one end to the heat sink body for enhanced conductive heat transport.