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公开(公告)号：US20240251496A1
公开(公告)日：2024-07-25
申请号：US18628152
申请日：2024-04-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dohyung Kim , Seongchul Hong , Insung Kim , Jinhong Park , Jungchul Lee
IPC: H05G2/00 , G03F7/00 , H01L21/268
CPC classification number: H05G2/008 , H01L21/268 , G03F7/70033
Abstract: Disclosed are semiconductor manufacturing apparatuses and operating methods thereof. The semiconductor manufacturing apparatus includes an oscillation unit that includes a first seed laser, a second seed laser, and a seed module, wherein the first seed laser oscillates a first pulse, and wherein the second seed laser oscillates a second pulse, and an extreme ultraviolet generation unit configured to use the first and second pulses to generate extreme ultraviolet light. The seed module includes a plurality of mirrors configured to allow the first and second pulses to travel along first and second paths, respectively, and a pulse control optical system including a first optical element, a second optical element, and a third optical element. The pulse control optical system is on the second path that does not overlap the first path. The third optical element includes a lens between the first optical element and the second optical element.
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公开(公告)号：US11778719B2
公开(公告)日：2023-10-03
申请号：US16927050
申请日：2020-07-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dohyung Kim , Seongchul Hong , Kyungsik Kang , Insung Kim , Motoshi Sakai , Seulgi Lee , Jungchul Lee
CPC classification number: H05G2/008 , G02B19/0047 , G02B26/0816 , G02B26/0875 , H01S3/0071 , H01S3/2316
Abstract: A laser beam delivery apparatus of an extreme ultra violet light source may include a high power seed module configured to generate a laser beam, a power amplifier configured to amplify the laser beam generated by the high power seed module, a beam transfer module configured to collect and move the laser beam amplified by the power amplifier, a final focusing assembly optical platform configured to adjust focus of the laser beam collected and moved by the beam transfer module, and a focusing unit configured to focus the laser beam with the focus adjusted by the final focusing assembly optical platform to a target droplet. The power amplifier may include a position adjuster configured to adjust a position of the laser beam. The position adjuster may include a refraction plate having a flat surface. The power amplifier may include a pointing adjuster, which may include a mirror.
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公开(公告)号：US11979973B2
公开(公告)日：2024-05-07
申请号：US17163945
申请日：2021-02-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dohyung Kim , Seongchul Hong , Insung Kim , Jinhong Park , Jungchul Lee
IPC: H05G2/00 , G03F7/00 , H01L21/268
CPC classification number: H05G2/008 , H01L21/268 , G03F7/70033
Abstract: Disclosed are semiconductor manufacturing apparatuses and operating methods thereof. The semiconductor manufacturing apparatus includes an oscillation unit that includes a first seed laser, a second seed laser, and a seed module, wherein the first seed laser oscillates a first pulse, and wherein the second seed laser oscillates a second pulse, and an extreme ultraviolet generation unit configured to use the first and second pulses to generate extreme ultraviolet light. The seed module includes a plurality of mirrors configured to allow the first and second pulses to travel along first and second paths, respectively, and a pulse control optical system including a first optical element, a second optical element, and a third optical element. The pulse control optical system is on the second path that does not overlap the first path. The third optical element includes a lens between the first optical element and the second optical element.
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公开(公告)号：US20210385932A1
公开(公告)日：2021-12-09
申请号：US17163945
申请日：2021-02-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dohyung Kim , Seongchul Hong , Insung Kim , Jinhong Park , Jungchul Lee
IPC: H05G2/00 , H01L21/268
Abstract: Disclosed are semiconductor manufacturing apparatuses and operating methods thereof. The semiconductor manufacturing apparatus includes an oscillation unit that includes a first seed laser, a second seed laser, and a seed module, wherein the first seed laser oscillates a first pulse, and wherein the second seed laser oscillates a second pulse, and an extreme ultraviolet generation unit configured to use the first and second pulses to generate extreme ultraviolet light. The seed module includes a plurality of mirrors configured to allow the first and second pulses to travel along first and second paths, respectively, and a pulse control optical system including a first optical element, a second optical element, and a third optical element. The pulse control optical system is on the second path that does not overlap the first path. The third optical element includes a lens between the first optical element and the second optical element.
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Patent Agency Ranking
公开(公告)号：US12185450B2
公开(公告)日：2024-12-31
申请号：US18628152
申请日：2024-04-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dohyung Kim , Seongchul Hong , Insung Kim , Jinhong Park , Jungchul Lee
IPC: H05G2/00 , G03F7/00 , H01L21/268
Abstract: Disclosed are semiconductor manufacturing apparatuses and operating methods thereof. The semiconductor manufacturing apparatus includes an oscillation unit that includes a first seed laser, a second seed laser, and a seed module, wherein the first seed laser oscillates a first pulse, and wherein the second seed laser oscillates a second pulse, and an extreme ultraviolet generation unit configured to use the first and second pulses to generate extreme ultraviolet light. The seed module includes a plurality of mirrors configured to allow the first and second pulses to travel along first and second paths, respectively, and a pulse control optical system including a first optical element, a second optical element, and a third optical element. The pulse control optical system is on the second path that does not overlap the first path. The third optical element includes a lens between the first optical element and the second optical element.
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6.发明公开公开(公告)号：US20240176230A1
公开(公告)日：2024-05-30
申请号：US18462796
申请日：2023-09-07
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hachul Shin , Dohyung Kim , Jooon Park , Sanghwan Lee , Seongchul Hong
IPC: G03F1/70
CPC classification number: G03F1/70
Abstract: There is provided an extreme ultraviolet (EUV) overlay correcting method capable of effectively correcting an overlay error in an EUV exposure process and a method of manufacturing a semiconductor device including the same. The EUV overlay correcting method includes forming a first photoresist (PR) pattern on a wafer by performing an EUV exposure process using a reticle, inspecting an EUV overlay for the first PR pattern and obtaining a first overlay for a first overlay parameter in which an overlay three-dimensionally increases away from a center to opposing sides of the first PR pattern in a first direction perpendicular to a scan direction, calculating deformation data of the reticle based on the first overlay, applying a voltage to a clamp electrode of a reticle stage to create the reticle into a deformed reticle, and forming a second PR pattern on the wafer by performing an EUV exposure process using the deformed reticle.
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公开(公告)号：US11828952B2
公开(公告)日：2023-11-28
申请号：US17218891
申请日：2021-03-31
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dohyung Kim , Seongchul Hong , Kyungsik Kang , Kyungbin Park , Motoshi Sakai , Seungkoo Lee , Jungchul Lee
CPC classification number: G02B27/1073 , G02B27/106 , G02B27/108 , G02B27/141 , G03F7/70191 , H01S3/0071 , H01S3/2308 , H01S3/2383 , H05G2/008 , H01S3/2232
Abstract: A light source capable of operating third and fourth reflection mirrors included in a beam splitting device in conjunction with movements of first and second reflection mirrors included in a beam transfer device and an optical assembly, respectively. The third and fourth reflection mirrors are disposed on optical paths of a pre-pulse and a main pulse emitted from first and second pulse generators, respectively. The light source operates the third and fourth reflection mirrors to offset an excessive compensation of the main pulse caused in a process of compensating for an optical path error of the pre-pulse. The light source may be included in an extreme ultraviolet light source system.
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公开(公告)号：US20220066225A1
公开(公告)日：2022-03-03
申请号：US17218891
申请日：2021-03-31
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dohyung Kim , Seongchul Hong , Kyungsik Kang , Kyungbin Park , Motoshi Sakai , Seungkoo Lee , Jungchul Lee
Abstract: A light source capable of operating third and fourth reflection mirrors included in a beam splitting device in conjunction with movements of first and second reflection mirrors included in a beam transfer device and an optical assembly, respectively. The third and fourth reflection mirrors are disposed on optical paths of a pre-pulse and a main pulse emitted from first and second pulse generators, respectively. The light source operates the third and fourth reflection mirrors to offset an excessive compensation of the main pulse caused in a process of compensating for an optical path error of the pre-pulse. The light source may be included in an extreme ultraviolet light source system.
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公开(公告)号：US10754254B1
公开(公告)日：2020-08-25
申请号：US16678274
申请日：2019-11-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Keunhee Bai , Jinhong Park , Jinseok Heo , Heeyoung Go , Seongchul Hong
Abstract: An extreme ultraviolet (EUV) exposure apparatus includes a chamber, an EUV source in the chamber and configured to generate an EUV beam, an optical system above the EUV source and configured to provide the EUV beam to a substrate, a substrate stage in the chamber and configured to receive the substrate, a reticle stage in the chamber and configured to hold a reticle that is configured to project the EUV beam onto the substrate, and a plasma source configured to provide plasma to the reticle to electrically neutralize the reticle charged by the EUV beam.
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