公开(公告)号：US20140328031A1

公开(公告)日：2014-11-06

申请号：US14262658

申请日：2014-04-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： KYOUNGSUK YANG ,  Jeong-Kyu HA ,  PaLan LEE ,  NARAE SHIN ,  Soyoung LIM ,  Jae-Min JUNG ,  KyongSoon CHO

IPC: H05K1/02 ,  H05K5/00

CPC classification number: H05K1/118 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/0949 ,  H05K2201/10128

Abstract: Provided is a display apparatus. The display apparatus includes a display panel, a flexible circuit film having a rear surface connected to the display panel, and a front surface opposite to the rear surface, the front surface having a chip mounted thereon, and a first lead bonding portion electrically connecting the chip to the display panel. The first lead bonding portion includes a first portion connected to the chip and overlying a portion of the flexible circuit film, a second portion passing through the flexible circuit film, and a third portion disposed between the flexible circuit film and the display panel on the rear surface of the flexible circuit film, where the third portion overlaps the first portion.

Abstract translation: 提供了一种显示装置。 显示装置包括显示面板，具有连接到显示面板的后表面的柔性电路薄膜和与背面相对的前表面，前表面具有安装在其上的芯片，以及第一引线接合部分， 芯片到显示面板。 第一引线接合部分包括连接到芯片并覆盖柔性电路膜的一部分的第一部分，穿过柔性电路膜的第二部分和设置在柔性电路膜和后面的显示面板之间的第三部分 柔性电路膜的表面，其中第三部分与第一部分重叠。

公开(公告)号：US20160379937A1

公开(公告)日：2016-12-29

申请号：US15138441

申请日：2016-04-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： KyongSoon CHO ,  Myoungkyun KIL ,  Hansung RYU

IPC: H01L23/00 ,  H05K1/11 ,  H05K1/02 ,  H01L23/498

CPC classification number: H01L23/562 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/5383 ,  H01L23/5386 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/111 ,  H05K2201/09781 ,  H05K2201/2009 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A substrate strip is provided. The substrate strip includes a core layer including first and second substrate regions spaced apart from each other and a dummy region between the first and second substrate regions, a first interconnection layer disposed on top surfaces of the first and second substrate regions, a second interconnection layer disposed on bottom surfaces of the first and second substrate regions, and a warpage control member provided on any one of a top surface and a bottom surface of the dummy region. The warpage control member includes a metal.

Abstract translation: 提供衬底条。 衬底条包括芯层，该芯层包括彼此间隔开的第一和第二衬底区域以及在第一和第二衬底区域之间的虚设区域，设置在第一和第二衬底区域的顶表面上的第一互连层，第二互连层 设置在第一和第二基板区域的底表面上，以及翘曲控制构件，设置在虚拟区域的顶表面和底表面中的任一个上。 翘曲控制构件包括金属。

公开(公告)号：US20190287951A1

公开(公告)日：2019-09-19

申请号：US16430428

申请日：2019-06-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： JICHUL KIM ,  Jae Choon KIM ,  HANSUNG RYU ,  KyongSoon CHO ,  YoungSang CHO ,  Yeo-Hoon YOON

IPC: H01L25/10 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00 ,  H01L21/48 ,  H01L23/538

Abstract: A semiconductor package is provided which includes a redistribution substrate, an interconnect substrate on the redistribution substrate, a metal layer on the semiconductor chip, a semiconductor chip on the redistribution substrate and in the hole of the interconnect substrate, and a mold layer in a gap between the semiconductor chip and the interconnect substrate. The interconnect substrate includes a hole penetrating thereinside. The interconnect substrate includes base layers and a conductive member extending through the base layers. A top surface of the interconnect substrate is positioned either above or below the level of the top surface of the metal layer.

公开(公告)号：US20140367659A1

公开(公告)日：2014-12-18

申请号：US14279170

申请日：2014-05-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： KyongSoon CHO ,  Jae-Min JUNG ,  Jeong-Kyu HA

IPC: H01L27/32

CPC classification number: H01L27/3276

Abstract: A display device includes a substantially planar semiconductor package. The semiconductor package drives unit display elements of the display device. The semiconductor package is not folded and has a flat structure. Thus, the occurrence of defects and/or errors in the display device may be reduced as compared to display devices including folded non-planar semiconductor packages. As a result, reliability of the display device may be improved.

Abstract translation: 显示装置包括基本上平面的半导体封装。 半导体封装驱动显示装置的单元显示元件。 半导体封装不折叠并且具有平坦的结构。 因此，与包括折叠的非平面半导体封装的显示装置相比，可以减少显示装置中的缺陷和/或误差的发生。 结果，可以提高显示装置的可靠性。

公开(公告)号：US20130293816A1

公开(公告)日：2013-11-07

申请号：US13769520

申请日：2013-02-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae-Min JUNG ,  Sang-Uk HAN ,  KwanJai LEE ,  KyongSoon CHO ,  Jeong-Kyu HA

IPC: H01L23/498 ,  H01L51/52

CPC classification number: H01L25/167 ,  H01L23/49827 ,  H01L23/4985 ,  H01L27/323 ,  H01L27/3276 ,  H01L27/3288 ,  H01L51/52 ,  H01L51/524 ,  H01L2251/5338 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Chip-on-film packages and device assemblies including the same may be provided. The device assembly includes a film package including a semiconductor chip, a panel substrate connected to one end of the film package, a display panel disposed on the panel substrate, and a controlling part connected to another end of the film package. The film package includes a film substrate, a first wire disposed on a top surface of the film substrate, and a second wire disposed on a bottom surface of the film substrate.

Abstract translation: 可以提供包括其的片上胶片包装和装置组件。 该装置组件包括：薄膜封装，其包括半导体芯片，连接到薄膜封装的一端的面板基板，设置在面板基板上的显示面板，以及连接到薄膜封装的另一端的控制部件。 薄膜封装包括薄膜基板，设置在薄膜基板的顶表面上的第一布线和设置在薄膜基板的底表面上的第二布线。