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    DISPLAY APPARATUS
    2.
    发明申请
    DISPLAY APPARATUS 有权
    显示设备

    公开(公告)号：US20140328031A1

    公开(公告)日：2014-11-06

    申请号：US14262658

    申请日：2014-04-25

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： KYOUNGSUK YANG ,  Jeong-Kyu HA ,  PaLan LEE ,  NARAE SHIN ,  Soyoung LIM ,  Jae-Min JUNG ,  KyongSoon CHO

    IPC: H05K1/02 ,  H05K5/00

    CPC classification number: H05K1/118 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/0949 ,  H05K2201/10128

    Abstract: Provided is a display apparatus. The display apparatus includes a display panel, a flexible circuit film having a rear surface connected to the display panel, and a front surface opposite to the rear surface, the front surface having a chip mounted thereon, and a first lead bonding portion electrically connecting the chip to the display panel. The first lead bonding portion includes a first portion connected to the chip and overlying a portion of the flexible circuit film, a second portion passing through the flexible circuit film, and a third portion disposed between the flexible circuit film and the display panel on the rear surface of the flexible circuit film, where the third portion overlaps the first portion.

    Abstract translation: 提供了一种显示装置。 显示装置包括显示面板，具有连接到显示面板的后表面的柔性电路薄膜和与背面相对的前表面，前表面具有安装在其上的芯片，以及第一引线接合部分， 芯片到显示面板。 第一引线接合部分包括连接到芯片并覆盖柔性电路膜的一部分的第一部分，穿过柔性电路膜的第二部分和设置在柔性电路膜和后面的显示面板之间的第三部分 柔性电路膜的表面，其中第三部分与第一部分重叠。

    CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
    3.
    发明申请
    CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME 有权

    公开(公告)号：US20210398870A1

    公开(公告)日：2021-12-23

    申请号：US17462269

    申请日：2021-08-31

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Seung-Tae HWANG ,  Jae-Choon KIM ,  Kyung-Suk OH ,  Woon-Bae KIM ,  Jae-Min JUNG

    IPC: H01L23/31 ,  H01L23/498 ,  H05K1/14

    Abstract: A chip on film package includes: a flexible base film having a first surface and a second surface opposite to each other, and having a chip mounting region on the first surface; a plurality of wirings extending in a first direction toward the chip mounting region; a semiconductor chip mounted in the chip mounting region on the first surface of the base film and electrically connected to the wirings; a pair of first heat dissipation members on the first surface of the base film and spaced apart from the semiconductor chip, and extending in a second direction perpendicular to the first direction; and a second heat dissipation member on the first surface of the base film and covering the semiconductor chip and the pair of first heat dissipation members.

    DISPLAY DEVICE INCLUDING PLASTICALLY DEFORMABLE METAL PATTERN
    4.
    发明申请
    DISPLAY DEVICE INCLUDING PLASTICALLY DEFORMABLE METAL PATTERN 有权

    公开(公告)号：US20250167189A1

    公开(公告)日：2025-05-22

    申请号：US18888923

    申请日：2024-09-18

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jae-Min JUNG ,  Seung Hyun Cho

    IPC: H01L33/62

    Abstract: A display device including: a thin film substrate; a display substrate connected to a first side of the thin film substrate; a light emitting element layer on an upper surface of the display substrate; a circuit board connected to a second side of the thin film substrate opposite the first side of the thin film substrate in a first horizontal direction; a metal pattern on the thin film substrate, wherein the metal pattern does not overlap a first portion of the thin film substrate connected to the display substrate and does not overlap a second portion of the thin film substrate connected to the circuit board in a vertical direction, wherein the metal pattern includes a metal, and wherein the metal pattern is electrically insulated from the thin film substrate; and a pattern region, wherein the metal pattern is around the pattern region.

    CHIP-ON-FILM PACKAGE
    5.
    发明申请
    CHIP-ON-FILM PACKAGE 有权

    公开(公告)号：US20230037785A1

    公开(公告)日：2023-02-09

    申请号：US17699525

    申请日：2022-03-21

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： KwanJai LEE ,  Jae-Min JUNG ,  Jeong-Kyu HA ,  Sang-Uk HAN

    IPC: H01L23/498 ,  H01L23/00

    Abstract: A chip-on-film package may include a film substrate including a chip region and an edge region, a semiconductor chip provided on the chip region and mounted on a top surface of the film substrate, the semiconductor chip including a chip pad adjacent to a bottom surface thereof, an input line and an output line provided on the edge region and disposed on the top surface of the film substrate, a connection terminal interposed between the film substrate and the semiconductor chip, and a redistribution pattern disposed between the semiconductor chip and the connection terminal.

    FILM PACKAGE AND PACKAGE MODULE INCLUDING THE SAME
    6.
    发明申请
    FILM PACKAGE AND PACKAGE MODULE INCLUDING THE SAME 审中-公开

    公开(公告)号：US20200211973A1

    公开(公告)日：2020-07-02

    申请号：US16814528

    申请日：2020-03-10

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jae-Min JUNG ,  JiAh MIN

    IPC: H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/367 ,  H01L23/552 ,  H01L23/00

    Abstract: A film package includes a film substrate, a first semiconductor chip on a first surface of the film substrate, a second semiconductor chip on the first surface of the film substrate, and a first conductive film on the first surface of the film substrate. The first conductive film covers the first semiconductor chip and the second semiconductor chip and includes a slit(s) or a notch(es). The slit(s) or notch(es) is/are disposed in a bridge region between the first semiconductor chip and the second semiconductor chip, in a plan view of the package.

    CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
    8.
    发明公开
    CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME 审中-公开

    公开(公告)号：US20240096904A1

    公开(公告)日：2024-03-21

    申请号：US18459766

    申请日：2023-09-01

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jae-Min JUNG ,  Seung Hyun CHO

    IPC: H01L27/12

    CPC classification number: H01L27/124

    Abstract: A chip-on-film package includes: a lower base film including a first surface and a second surface, which are opposite to each other; an upper base film including a third surface and a fourth surface, which are opposite to each other, and is disposed on the lower base film; a first semiconductor chip mounted on the second surface of the lower base film; a second semiconductor chip mounted on the third surface of the upper base film; and an interposer film interposed between the lower and upper base films, wherein the second and third surfaces face each other.

    SEMICONDUCTOR DEVICE
    10.
    发明申请
    SEMICONDUCTOR DEVICE 有权

    公开(公告)号：US20220165652A1

    公开(公告)日：2022-05-26

    申请号：US17391164

    申请日：2021-08-02

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Sang-Uk HAN ,  Duck Gyu KIM ,  Min Ki KIM ,  Jae-Min JUNG ,  Jeong-Kyu HA

    IPC: H01L23/498 ,  H01L23/58

    Abstract: A semiconductor device includes: a substrate including a semiconductor chip region, a guard ring region adjacent to the semiconductor chip region, and an edge region adjacent to the guard ring region; a first interlayer insulating layer disposed on the substrate; a wiring structure disposed inside the first interlayer insulating layer and in the guard ring region, wherein the wiring structure includes a first wiring layer and a second wiring layer disposed above the first wiring layer; and a trench configured to expose at least a part of the first interlayer insulating, layer in the edge region, wherein the trench includes a first bottom surface and a second bottom surface formed at a level different from that of the first bottom surface, wherein the first bottom surface is formed between the wiring structure and the second bottom surface, and the second bottom surface is formed adjacent to the first bottom surface.

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