公开(公告)号：US20230037785A1

公开(公告)日：2023-02-09

申请号：US17699525

申请日：2022-03-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： KwanJai LEE ,  Jae-Min JUNG ,  Jeong-Kyu HA ,  Sang-Uk HAN

IPC: H01L23/498 ,  H01L23/00

Abstract: A chip-on-film package may include a film substrate including a chip region and an edge region, a semiconductor chip provided on the chip region and mounted on a top surface of the film substrate, the semiconductor chip including a chip pad adjacent to a bottom surface thereof, an input line and an output line provided on the edge region and disposed on the top surface of the film substrate, a connection terminal interposed between the film substrate and the semiconductor chip, and a redistribution pattern disposed between the semiconductor chip and the connection terminal.

公开(公告)号：US20240079312A1

公开(公告)日：2024-03-07

申请号：US18505613

申请日：2023-11-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： KwanJai LEE ,  Jae-Min JUNG ,  Jeong-Kyu HA ,  Sang-Uk HAN

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/4985 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/73 ,  H01L2224/73204

Abstract: A chip-on-film package may include a film substrate including a chip region and an edge region, a semiconductor chip provided on the chip region and mounted on a top surface of the film substrate, the semiconductor chip including a chip pad adjacent to a bottom surface thereof, an input line and an output line provided on the edge region and disposed on the top surface of the film substrate, a connection terminal interposed between the film substrate and the semiconductor chip, and a redistribution pattern disposed between the semiconductor chip and the connection terminal.

公开(公告)号：US20130293816A1

公开(公告)日：2013-11-07

申请号：US13769520

申请日：2013-02-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae-Min JUNG ,  Sang-Uk HAN ,  KwanJai LEE ,  KyongSoon CHO ,  Jeong-Kyu HA

IPC: H01L23/498 ,  H01L51/52

CPC classification number: H01L25/167 ,  H01L23/49827 ,  H01L23/4985 ,  H01L27/323 ,  H01L27/3276 ,  H01L27/3288 ,  H01L51/52 ,  H01L51/524 ,  H01L2251/5338 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Chip-on-film packages and device assemblies including the same may be provided. The device assembly includes a film package including a semiconductor chip, a panel substrate connected to one end of the film package, a display panel disposed on the panel substrate, and a controlling part connected to another end of the film package. The film package includes a film substrate, a first wire disposed on a top surface of the film substrate, and a second wire disposed on a bottom surface of the film substrate.

Abstract translation: 可以提供包括其的片上胶片包装和装置组件。 该装置组件包括：薄膜封装，其包括半导体芯片，连接到薄膜封装的一端的面板基板，设置在面板基板上的显示面板，以及连接到薄膜封装的另一端的控制部件。 薄膜封装包括薄膜基板，设置在薄膜基板的顶表面上的第一布线和设置在薄膜基板的底表面上的第二布线。