公开(公告)号：US20160379937A1

公开(公告)日：2016-12-29

申请号：US15138441

申请日：2016-04-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： KyongSoon CHO ,  Myoungkyun KIL ,  Hansung RYU

IPC: H01L23/00 ,  H05K1/11 ,  H05K1/02 ,  H01L23/498

CPC classification number: H01L23/562 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/5383 ,  H01L23/5386 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/111 ,  H05K2201/09781 ,  H05K2201/2009 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A substrate strip is provided. The substrate strip includes a core layer including first and second substrate regions spaced apart from each other and a dummy region between the first and second substrate regions, a first interconnection layer disposed on top surfaces of the first and second substrate regions, a second interconnection layer disposed on bottom surfaces of the first and second substrate regions, and a warpage control member provided on any one of a top surface and a bottom surface of the dummy region. The warpage control member includes a metal.

Abstract translation: 提供衬底条。 衬底条包括芯层，该芯层包括彼此间隔开的第一和第二衬底区域以及在第一和第二衬底区域之间的虚设区域，设置在第一和第二衬底区域的顶表面上的第一互连层，第二互连层 设置在第一和第二基板区域的底表面上，以及翘曲控制构件，设置在虚拟区域的顶表面和底表面中的任一个上。 翘曲控制构件包括金属。