Memory device performing temperature compensation and operating method thereof

    公开(公告)号:US12002518B2

    公开(公告)日:2024-06-04

    申请号:US17710283

    申请日:2022-03-31

    CPC classification number: G11C16/24 G11C16/0483 G11C16/26

    Abstract: A memory device is provided. The memory device includes: a memory cell array including a plurality of memory cells; a page buffer circuit connected to the memory cell array through a plurality of bit lines and including a page buffer connected to each of the plurality of bit lines, the page buffer including at least one first latch for storing data based on a voltage level of a first sensing node; and a control circuit configured to adjust a level of a voltage signal provided to the page buffer circuit. The page buffer includes a trip control transistor arranged between the at least one first latch and the first sensing node, and wherein the control circuit is further configured to, based on a read operation being performed on the memory cell array, control a trip control voltage to be provided to a gate of the trip control transistor. A level of the trip control voltage varies according to a temperature of the memory device.

    MEMORY DEVICE PERFORMING TEMPERATURE COMPENSATION AND OPERATING METHOD THEREOF

    公开(公告)号:US20230055963A1

    公开(公告)日:2023-02-23

    申请号:US17710283

    申请日:2022-03-31

    Abstract: A memory device is provided. The memory device includes: a memory cell array including a plurality of memory cells; a page buffer circuit connected to the memory cell array through a plurality of bit lines and including a page buffer connected to each of the plurality of bit lines, the page buffer including at least one first latch for storing data based on a voltage level of a first sensing node; and a control circuit configured to adjust a level of a voltage signal provided to the page buffer circuit. The page buffer includes a trip control transistor arranged between the at least one first latch and the first sensing node, and wherein the control circuit is further configured to, based on a read operation being performed on the memory cell array, control a trip control voltage to be provided to a gate of the trip control transistor. A level of the trip control voltage varies according to a temperature of the memory device.

    Memory device including vertical channel structure

    公开(公告)号:US12300329B2

    公开(公告)日:2025-05-13

    申请号:US17881039

    申请日:2022-08-04

    Abstract: Provided is a memory device with a vertical channel structure. The memory device includes a memory cell array including a plurality of memory cells and a plurality of string selection lines, a negative charge pump configured to generate a bias voltage of a negative level, to be applied to at least one of the plurality of string selection lines, and a control logic circuit configured to apply, for a first period, a prepulse voltage to at least one unselected string selection line among the plurality of string selection lines excluding a selected string selection line to which a memory cell selected from among the plurality of memory cells is connected and thereafter apply the bias voltage to the at least one unselected string selection line so as to perform a read operation on the selected memory cell.

    Methods of testing nonvolatile memory devices

    公开(公告)号:US11600350B2

    公开(公告)日:2023-03-07

    申请号:US17509678

    申请日:2021-10-25

    Abstract: In a method of testing a nonvolatile memory device including a first semiconductor layer in which and a second semiconductor layer is formed prior to the first semiconductor layer, circuit elements including a page buffer circuit are provided in the second semiconductor layer, an on state of nonvolatile memory cells which are not connected to the page buffer circuit is mimicked by providing a conducting path between an internal node of a bit-line connection circuit connected between a sensing node and a bit-line node of the page buffer circuit and a voltage terminal to receive a first voltage, a sensing and latching operation with the on state being mimicked is performed in the page buffer circuit and a determination is made as to whether the page buffer circuit operates normally is made based on a result of the sensing and latching operation.

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