公开(公告)号：US11091694B2

公开(公告)日：2021-08-17

申请号：US16579073

申请日：2019-09-23

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Jonghee Park ,  Kitae Kim ,  Jinseock Kim ,  Gyu-Po Kim ,  Hyun-Cheol Shin ,  Dae-Woo Lee ,  Sang-Hyuk Lee ,  Zheng Hong

IPC: C09K13/06 ,  C23F1/16 ,  C09G1/00 ,  H01L21/3213

Abstract: An etching composition includes an inorganic acid compound, a carboxylic acid compound, a sulfonic acid compound, a glycol compound, a nitrogen-containing dicarbonyl compound, a sulfate compound and water.

公开(公告)号：US08889032B2

公开(公告)日：2014-11-18

申请号：US13728463

申请日：2012-12-27

Applicant: Samsung Display Co., Ltd.

Inventor： Jong-Hyun Choung ,  In-Bae Kim ,  Seon-II Kim ,  Hong Sick Park ,  Jae Woo Jeong ,  Gyu-Po Kim ,  Won-Guk Seo ,  Hyun-Cheol Shin ,  Ki-Beom Lee ,  Sam-Young Cho ,  Seung-Yeon Han

IPC: C09K13/04 ,  H01L21/48 ,  C23F1/26 ,  C23F1/18

CPC classification number: C23F1/18 ,  C23F1/26 ,  H01L21/4814

Abstract: A metal wire etchant including persulfate, a sulfonate, a fluorine compound, an azole-based compound, an organic acid, a nitrate, and a chlorine compound, and a method of making the same.

Abstract translation: 包括过硫酸盐，磺酸盐，氟化合物，唑类化合物，有机酸，硝酸盐和氯化合物的金属线蚀刻剂及其制备方法。

公开(公告)号：US11407943B2

公开(公告)日：2022-08-09

申请号：US16575593

申请日：2019-09-19

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Jonghee Park ,  Kitae Kim ,  Jinseock Kim ,  Gyu-Po Kim ,  Hyun-Cheol Shin ,  Dae-Woo Lee ,  Sang-Hyuk Lee

IPC: C09K13/06 ,  C23F1/16

Abstract: An etching composition for a silver-containing thin film includes an inorganic acid compound, a carboxylic acid compound, a sulfonic acid compound, a glycol compound, a nitrogen-containing dicarbonyl compound, a metal-based oxidizer, and water.

公开(公告)号：US08921230B2

公开(公告)日：2014-12-30

申请号：US13964371

申请日：2013-08-12

Applicant: Samsung Display Co., Ltd.

Inventor： Hong-Sick Park ,  Young-Jun Kim ,  Young-Woo Park ,  Wang-Woo Lee ,  Won-Guk Seo ,  Sam-Young Cho ,  Seung-Yeon Han ,  Gyu-Po Kim ,  Hyun-Cheol Shin ,  Ki-Beom Lee

IPC: H01L21/00 ,  H01L21/67 ,  H01L21/28 ,  H01L27/12 ,  C23F1/18

CPC classification number: C23F1/18 ,  H01L21/67075 ,  H01L27/124 ,  H01L27/1259 ,  H01L29/4908 ,  H01L29/66969 ,  H01L29/78633 ,  H01L29/7869

Abstract: An etchant composition includes about 25 percent by weight to about 35 percent by weight of phosphoric acid, about 3 percent by weight to about 9 percent by weight of nitric acid, about 10 percent by weight to about 20 percent by weight of acetic acid, about 5 percent by weight to about 10 percent by weight of a nitrate, about 6 percent by weight to about 15 percent by weight of a sulfonic acid, about 1 percent by weight to about 5 percent by weight of an amine compound including a carboxyl group, about 0.1 percent by weight to about 1 percent by weight of a water-soluble amino acid, about 0.01 percent by weight to about 1 percent by weight of an azole compound, and water.

Abstract translation: 蚀刻剂组合物包括约25重量％至约35重量％的磷酸，约3重量％至约9重量％的硝酸，约10重量％至约20重量％的乙酸，约 5重量％至10重量％的硝酸盐，约6重量％至约15重量％的磺酸，约1重量％至约5重量％的包含羧基的胺化合物， 约0.1重量％至约1重量％的水溶性氨基酸，约0.01重量％至约1重量％的唑化合物和水。