Laser processing apparatus
    6.
    发明授权

    公开(公告)号:US12202078B2

    公开(公告)日:2025-01-21

    申请号:US17545982

    申请日:2021-12-08

    Abstract: A laser processing apparatus includes a stage configured to transfer a target substrate and including an opening, an electrostatic chuck disposed on the stage and including a plurality of holes, and a laser irradiation unit disposed above the stage and spaced apart from the stage and configured to irradiate a laser beam on the target substrate. A surface of the electrostatic chuck is in contact with the target substrate, the target substrate includes a plurality of etching regions to be etched by the laser beam and a non-etching region surrounding the plurality of etching regions of the target substrate, and the plurality of holes of the electrostatic chuck overlap the opening of the stage and the plurality of etching regions of the target substrate.

    Stage for cutting substrate and substrate cutting device

    公开(公告)号:US11565354B2

    公开(公告)日:2023-01-31

    申请号:US16248505

    申请日:2019-01-15

    Abstract: A stage for cutting a substrate includes: a body member; a plurality of first discharging members, each including a first suction portion in the body member and a first partition wall portion connected to the first suction portion and protruding from a top surface of the body member, each of the first discharging members defining a first space connected to an outside; a plurality of second discharging members, each including a second suction portion in the body member and a second partition wall portion connected to the second suction portion and protruding from the top surface of the body member, each of the second discharging members defining a second space connected to the outside; a plurality of connecting pipes each connected to the first partition wall portion and the second partition wall portion; and a plurality of supply pipes connected to the connecting pipes.

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