公开(公告)号：US12202078B2

公开(公告)日：2025-01-21

申请号：US17545982

申请日：2021-12-08

Applicant: Samsung Display Co., Ltd.

Inventor： Kyu-Bum Kim ,  Jaeseok Park ,  Jungseob Lee ,  Kyongho Hong ,  Inho Lee ,  Bosuck Jeon

IPC: B23K37/04 ,  B23K26/02 ,  B23K26/362

Abstract: A laser processing apparatus includes a stage configured to transfer a target substrate and including an opening, an electrostatic chuck disposed on the stage and including a plurality of holes, and a laser irradiation unit disposed above the stage and spaced apart from the stage and configured to irradiate a laser beam on the target substrate. A surface of the electrostatic chuck is in contact with the target substrate, the target substrate includes a plurality of etching regions to be etched by the laser beam and a non-etching region surrounding the plurality of etching regions of the target substrate, and the plurality of holes of the electrostatic chuck overlap the opening of the stage and the plurality of etching regions of the target substrate.

公开(公告)号：US20220241906A1

公开(公告)日：2022-08-04

申请号：US17545982

申请日：2021-12-08

Applicant: Samsung Display Co., Ltd.

Inventor： Kyu-Bum Kim ,  Jaeseok Park ,  Jungseob Lee ,  Kyongho Hong ,  Inho Lee ,  Bosuck Jeon

IPC: B23K37/04 ,  B23K26/02 ,  B23K26/362

Abstract: A laser processing apparatus includes a stage configured to transfer a target substrate and including an opening, an electrostatic chuck disposed on the stage and including a plurality of holes, and a laser irradiation unit disposed above the stage and spaced apart from the stage and configured to irradiate a laser beam on the target substrate. A surface of the electrostatic. chuck is in contact with the target substrate, the target substrate includes a plurality of etching regions to be etched by the laser beam and a non-etching region surrounding the plurality of etching regions of the target substrate, and the plurality of holes of the electrostatic chuck overlap the opening of the stage and the plurality of etching regions of the target substrate.

公开(公告)号：US20220140294A1

公开(公告)日：2022-05-05

申请号：US17386488

申请日：2021-07-27

Applicant: Samsung Display Co, Ltd.

Inventor： Kyongho Hong ,  Donghyeon Kim ,  Byunghun Sung ,  Jungseob Lee ,  Jinwon Chang

IPC: H01L51/56 ,  H01L21/683

Abstract: The apparatus for manufacturing a display apparatus includes: a carrier; a support arranged to be spaced apart from the carrier; a driver connected to the support to linearly move the support; and an elastic portion arranged between the driver and the support to provide an elastic force to the support, wherein the support includes: a first surface on which a substrate is to be mounted; and a second surface projecting upward from the first surface to selectively contact the carrier.

公开(公告)号：US20230363245A1

公开(公告)日：2023-11-09

申请号：US18142479

申请日：2023-05-02

Applicant: Samsung Display Co., Ltd.

Inventor： Youngsun Cho ,  Jaemin Hong ,  Myungkyu Kim ,  Jangwoo Kim ,  Jongsung Park ,  Sangshin Lee ,  Jungseob Lee ,  Kyunghoon Chung ,  Eunjoung Jung ,  Kyongho Hong

IPC: H10K71/16 ,  H10K59/12 ,  C23C14/04 ,  C23C14/24

CPC classification number: H10K71/166 ,  H10K59/1201 ,  C23C14/042 ,  C23C14/24

Abstract: An apparatus for manufacturing a display device includes: a mask assembly tilted with respect to a plane parallel to the ground; a deposition source facing the mask assembly; and a carrier facing the mask assembly and configured to support a display substrate. The mask assembly includes: a mask frame having a flat surface; and a mask sheet having an end on the flat surface of the mask frame and coupled to the mask frame.

公开(公告)号：US12178110B2

公开(公告)日：2024-12-24

申请号：US17386488

申请日：2021-07-27

Applicant: Samsung Display Co., Ltd.

Inventor： Kyongho Hong ,  Donghyeon Kim ,  Byunghun Sung ,  Jungseob Lee ,  Jinwon Chang

IPC: H10K71/00 ,  H01L21/683

Abstract: The apparatus for manufacturing a display apparatus includes: a carrier; a support arranged to be spaced apart from the carrier; a driver connected to the support to linearly move the support; and an elastic portion arranged between the driver and the support to provide an elastic force to the support, wherein the support includes: a first surface on which a substrate is to be mounted; and a second surface projecting upward from the first surface to selectively contact the carrier.