公开(公告)号：US20220241906A1

公开(公告)日：2022-08-04

申请号：US17545982

申请日：2021-12-08

Applicant: Samsung Display Co., Ltd.

Inventor： Kyu-Bum Kim ,  Jaeseok Park ,  Jungseob Lee ,  Kyongho Hong ,  Inho Lee ,  Bosuck Jeon

IPC: B23K37/04 ,  B23K26/02 ,  B23K26/362

Abstract: A laser processing apparatus includes a stage configured to transfer a target substrate and including an opening, an electrostatic chuck disposed on the stage and including a plurality of holes, and a laser irradiation unit disposed above the stage and spaced apart from the stage and configured to irradiate a laser beam on the target substrate. A surface of the electrostatic. chuck is in contact with the target substrate, the target substrate includes a plurality of etching regions to be etched by the laser beam and a non-etching region surrounding the plurality of etching regions of the target substrate, and the plurality of holes of the electrostatic chuck overlap the opening of the stage and the plurality of etching regions of the target substrate.

公开(公告)号：US12202078B2

公开(公告)日：2025-01-21

申请号：US17545982

申请日：2021-12-08

Applicant: Samsung Display Co., Ltd.

Inventor： Kyu-Bum Kim ,  Jaeseok Park ,  Jungseob Lee ,  Kyongho Hong ,  Inho Lee ,  Bosuck Jeon

IPC: B23K37/04 ,  B23K26/02 ,  B23K26/362

Abstract: A laser processing apparatus includes a stage configured to transfer a target substrate and including an opening, an electrostatic chuck disposed on the stage and including a plurality of holes, and a laser irradiation unit disposed above the stage and spaced apart from the stage and configured to irradiate a laser beam on the target substrate. A surface of the electrostatic chuck is in contact with the target substrate, the target substrate includes a plurality of etching regions to be etched by the laser beam and a non-etching region surrounding the plurality of etching regions of the target substrate, and the plurality of holes of the electrostatic chuck overlap the opening of the stage and the plurality of etching regions of the target substrate.

公开(公告)号：US09199355B2

公开(公告)日：2015-12-01

申请号：US13728671

申请日：2012-12-27

Applicant: Samsung Display Co., Ltd.

Inventor： Inho Lee ,  Hwankyeong Jeong ,  Jinwoo Kim ,  Goangyoung Park ,  Sanghoon Back ,  Eehyun An

IPC: B24B49/12 ,  B24B41/00 ,  B24B9/10

CPC classification number: B24B49/12 ,  B23Q3/15706 ,  B24B9/10 ,  B24B41/00 ,  Y10T483/174

Abstract: An apparatus for grinding a substrate includes a stage part configured to support a substrate thereon, a grinding part, a camera part, a replacing part and a control unit. The grinding part includes a grinding wheel configured to grind an edge of the substrate. The camera part is configured to take a picture of the grinding wheel, analyze the picture of the grinding wheel and generate information about the grinding wheel. The replacing part includes a spare grinding wheel and is configured provide the spare grinding wheel to the grinding part or pick up the grinding wheel from the grinding part. The control unit is configured to receive the grinding wheel information from the camera part and offset compensate a position of the grinding wheel on the basis of the grinding wheel information or communicate with the replacing part to replace the grinding wheel on the basis of the grinding wheel information.

Abstract translation: 用于研磨基板的装置包括：构造成在其上支撑基板的台部，研磨部，相机部，更换部和控制单元。 研磨部分包括构造成研磨基底的边缘的砂轮。 照相机部件被配置为拍摄砂轮的图片，分析砂轮的图片并产生关于砂轮的信息。 替换部件包括备用砂轮，并且被配置为将备用砂轮提供给研磨部件或从研磨部件拾取砂轮。 控制单元构造成从摄像机部件接收砂轮信息，并且基于砂轮信息补偿补偿砂轮的位置，或者与替换部件进行通信，以基于砂轮更换砂轮 信息。