公开(公告)号：US20200086423A1

公开(公告)日：2020-03-19

申请号：US16384458

申请日：2019-04-15

Applicant: SAMSUNG DISPLAY CO., LTD

Inventor： Jinwon Baek ,  Seokjoo Lee ,  Sangsun Han ,  Kyongho Hong

IPC: B23K26/082 ,  G02B26/10 ,  G02B19/00 ,  G02B13/00 ,  B23K26/06 ,  B23K26/70

Abstract: A laser processing apparatus includes: a laser light source configured to emit a laser beam; an optical scanner located along a path of the laser beam and configured to adjust the path of the laser beam; a lens unit located along the path of the laser beam, the lens unit being configured to condense the laser beam; a first adapter located between the lens unit and the optical scanner and coupled to the lens unit; and a second adapter located between the first adapter and the optical scanner, the second adapter being coupled to the first adapter and the optical scanner.

公开(公告)号：US11819941B2

公开(公告)日：2023-11-21

申请号：US16384458

申请日：2019-04-15

Applicant: SAMSUNG DISPLAY CO., LTD

Inventor： Jinwon Baek ,  Seokjoo Lee ,  Sangsun Han ,  Kyongho Hong

IPC: B23K26/06 ,  G02B13/00 ,  G02B19/00 ,  B23K26/082 ,  G02B26/10 ,  B23K26/70

CPC classification number: B23K26/0821 ,  B23K26/0648 ,  B23K26/0665 ,  B23K26/702 ,  G02B13/0005 ,  G02B19/0009 ,  G02B19/0047 ,  G02B26/105

Abstract: A laser processing apparatus includes: a laser light source configured to emit a laser beam; an optical scanner located along a path of the laser beam and configured to adjust the path of the laser beam; a lens unit located along the path of the laser beam, the lens unit being configured to condense the laser beam; a first adapter located between the lens unit and the optical scanner and coupled to the lens unit; and a second adapter located between the first adapter and the optical scanner, the second adapter being coupled to the first adapter and the optical scanner.

公开(公告)号：US11565354B2

公开(公告)日：2023-01-31

申请号：US16248505

申请日：2019-01-15

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Kyongho Hong ,  Jinwon Baek ,  Jeongho Yi ,  Jinpyung Lee

IPC: B23K37/04 ,  B25B11/00 ,  B23K26/38 ,  B23Q11/00 ,  B23Q1/01 ,  H01L21/67 ,  H01L21/683 ,  B23K101/40

Abstract: A stage for cutting a substrate includes: a body member; a plurality of first discharging members, each including a first suction portion in the body member and a first partition wall portion connected to the first suction portion and protruding from a top surface of the body member, each of the first discharging members defining a first space connected to an outside; a plurality of second discharging members, each including a second suction portion in the body member and a second partition wall portion connected to the second suction portion and protruding from the top surface of the body member, each of the second discharging members defining a second space connected to the outside; a plurality of connecting pipes each connected to the first partition wall portion and the second partition wall portion; and a plurality of supply pipes connected to the connecting pipes.

公开(公告)号：US11565351B2

公开(公告)日：2023-01-31

申请号：US16375582

申请日：2019-04-04

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Toshinaru Suzuki ,  Dokyun Kwon ,  Jaebum Pahk ,  Jinwon Baek ,  Jeongho Yi ,  Jinpyung Lee ,  Kyongho Hong

IPC: B23K26/36 ,  B23K26/38 ,  H01L21/687 ,  B23K26/70

Abstract: A substrate processing apparatus includes the following: a support frame, first stage, a suction part, and a plurality of island-type second stages. The support frame is disposed on the first stage. The height of the support frame is lower than the height of the first stage. A plurality of island-type second stages are disposed on the support frame on the same plane as the first stage. The suction part is disposed on the support frame.