公开(公告)号：US20200033066A1

公开(公告)日：2020-01-30

申请号：US16047275

申请日：2018-07-27

Applicant: QUALCOMM Incorporated

Inventor： Victor Adrian CHIRIAC ,  Jorge Luis ROSALES

IPC: F28D15/02 ,  F28D15/06

Abstract: Certain aspects of the present disclosure generally relate to techniques for cooling electronic devices using thermosiphons having one or more micro-pumps at least partially disposed therein. A provided thermosiphon generally includes a fluid; a first evaporator configured to evaporate the fluid, wherein the first evaporator has an inlet and an outlet; a first condenser configured to condense the fluid, wherein the first condenser has an inlet and an outlet; a first channel coupled between the outlet of the first evaporator and the inlet of the first condenser; a second channel coupled between the outlet of the first condenser and the inlet of the first evaporator; and a first micro-pump located in the second channel and operable to pump the fluid in the second channel from the first condenser to the first evaporator.

公开(公告)号：US20200271388A1

公开(公告)日：2020-08-27

申请号：US16281477

申请日：2019-02-21

Applicant: QUALCOMM Incorporated

Inventor： Sean Charles ANDREWS ,  Jorge Luis ROSALES ,  Victor Adrian CHIRIAC

IPC: F28D15/02 ,  H01L23/427 ,  F28F21/08

Abstract: Certain aspects of the present disclosure provide a heat-dissipating device with enhanced interfacial properties. One example heat-dissipating device generally includes a first heat spreader configured to be thermally coupled to a region configured to generate heat, a second heat spreader, an interposer thermally coupled to at least one of the first heat spreader or the second heat spreader, at least one interfacial layer comprising a graphene material disposed on at least one surface of the interposer, and a phase change material disposed between the at least one interfacial layer and at least one of the first heat spreader or the second heat spreader and thermally coupled to at least one of the first heat spreader or the second heat spreader.

公开(公告)号：US20190061970A1

公开(公告)日：2019-02-28

申请号：US15689994

申请日：2017-08-29

Applicant: QUALCOMM Incorporated

Inventor： Peng WANG ,  Jorge Luis ROSALES ,  Victor Adrian CHIRIAC

IPC: B64D41/00 ,  B64D27/24 ,  B64C39/02 ,  H02N11/00 ,  H01L35/00

Abstract: Some features pertain to a quad-rotor or other aerial drone having a thermoelectric generator (TEG) for harvesting waste heat from a processor of the drone. The TEG is positioned, in some examples, with its inner metal electrode coating adjacent the drone processor to function as the “hot” side of the TEG. The outer metal electrode coating of the TEG forms a portion of the outer surface of the housing of the drone to function as the “cold” side of the TEG. The inner and outer metal coatings of the TEG are coupled to a battery recharger so current generated by the TEG during operation of the drone can help recharge the drone battery to extend flight time. In some examples, an outer perimeter of the TEG extends into an airflow region near the drone rotors so propeller wash serves to cool the perimeter of the TEG.

公开(公告)号：US20230145773A1

公开(公告)日：2023-05-11

申请号：US17523692

申请日：2021-11-10

Applicant: QUALCOMM Incorporated

Inventor： Hung-Wen LIN ,  Sin-Shong WANG ,  Jen-Chun CHANG ,  Qiang DU ,  Jorge Luis ROSALES ,  Ajit Kumar VALLABHANENI

IPC: H05K7/20 ,  G06F1/20 ,  G06F1/16

CPC classification number: H05K7/2039 ,  G06F1/203 ,  G06F1/1681 ,  G06F2200/203

Abstract: An electronic device that includes a first device portion, a second device portion coupled to the first device portion; and a thermally conductive connector coupled to the first device portion and the second device portion, wherein the thermally conductive connector includes a graphite sheet. The first device portion includes a region that includes a component configured to generate heat.

公开(公告)号：US20190257589A1

公开(公告)日：2019-08-22

申请号：US16398001

申请日：2019-04-29

Applicant: QUALCOMM Incorporated

Inventor： Jorge Luis ROSALES ,  Le GAO ,  Don LE ,  Jon James ANDERSON

IPC: F28D15/02 ,  H05K7/20 ,  H01L23/427 ,  F04B17/00 ,  F04B49/06

Abstract: A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator. The heat dissipating device includes one or more piezo structures configured to move fluid inside the heat dissipating device.