公开(公告)号：US20230145773A1

公开(公告)日：2023-05-11

申请号：US17523692

申请日：2021-11-10

Applicant: QUALCOMM Incorporated

Inventor： Hung-Wen LIN ,  Sin-Shong WANG ,  Jen-Chun CHANG ,  Qiang DU ,  Jorge Luis ROSALES ,  Ajit Kumar VALLABHANENI

IPC: H05K7/20 ,  G06F1/20 ,  G06F1/16

CPC classification number: H05K7/2039 ,  G06F1/203 ,  G06F1/1681 ,  G06F2200/203

Abstract: An electronic device that includes a first device portion, a second device portion coupled to the first device portion; and a thermally conductive connector coupled to the first device portion and the second device portion, wherein the thermally conductive connector includes a graphite sheet. The first device portion includes a region that includes a component configured to generate heat.