公开(公告)号：US20210373628A1

公开(公告)日：2021-12-02

申请号：US17094035

申请日：2020-11-10

Applicant: QUALCOMM Incorporated

Inventor： Hung-Wen LIN ,  Sin-Shong WANG ,  Keith WANG ,  Ajit Kumar VALLABHANENI ,  Jen-Chun CHANG

IPC: G06F1/20 ,  H05K7/20

Abstract: An electronic device that includes a first device portion, a second device portion coupled to the first device portion, and a uni-directional thermally conductive connector coupled to the first device portion and the second device portion. The first device portion comprises a region that includes a component configured to generate heat. The uni-directional thermally conductive connector is configured to dissipate heat away from the first device portion and towards the second device portion. The uni-directional thermally conductive connector includes a thermally conductive material that primarily dissipates heat along a first direction of the thermally conductive material.

公开(公告)号：US20210118764A1

公开(公告)日：2021-04-22

申请号：US17066083

申请日：2020-10-08

Applicant: QUALCOMM Incorporated

Inventor： Hung-Wen LIN ,  Sin-Shong WANG ,  Jen-Chun CHANG ,  Ajit Kumar VALLABHANENI ,  Keith WANG

IPC: H01L23/367 ,  H01L23/552 ,  G06F1/20 ,  G06F1/16

Abstract: An assembly comprising a substrate, a first integrated device coupled to the substrate, a second integrated device coupled to the substrate, a frame coupled to the substrate such that the frame at least partially surrounds the first integrated device and the second integrated device, and a step heat sink coupled to the frame, such that the step heat sink is located over the first integrated device and the second integrated device. The assembly may further include a shield coupled to the frame such that the shield is located between the frame and the step heat sink. The shield may include a step shield. The assembly may further include a heat pipe coupled to the step heat sink.

公开(公告)号：US20230145773A1

公开(公告)日：2023-05-11

申请号：US17523692

申请日：2021-11-10

Applicant: QUALCOMM Incorporated

Inventor： Hung-Wen LIN ,  Sin-Shong WANG ,  Jen-Chun CHANG ,  Qiang DU ,  Jorge Luis ROSALES ,  Ajit Kumar VALLABHANENI

IPC: H05K7/20 ,  G06F1/20 ,  G06F1/16

CPC classification number: H05K7/2039 ,  G06F1/203 ,  G06F1/1681 ,  G06F2200/203

Abstract: An electronic device that includes a first device portion, a second device portion coupled to the first device portion; and a thermally conductive connector coupled to the first device portion and the second device portion, wherein the thermally conductive connector includes a graphite sheet. The first device portion includes a region that includes a component configured to generate heat.