公开(公告)号：US20230145773A1

公开(公告)日：2023-05-11

申请号：US17523692

申请日：2021-11-10

Applicant: QUALCOMM Incorporated

Inventor： Hung-Wen LIN ,  Sin-Shong WANG ,  Jen-Chun CHANG ,  Qiang DU ,  Jorge Luis ROSALES ,  Ajit Kumar VALLABHANENI

IPC: H05K7/20 ,  G06F1/20 ,  G06F1/16

CPC classification number: H05K7/2039 ,  G06F1/203 ,  G06F1/1681 ,  G06F2200/203

Abstract: An electronic device that includes a first device portion, a second device portion coupled to the first device portion; and a thermally conductive connector coupled to the first device portion and the second device portion, wherein the thermally conductive connector includes a graphite sheet. The first device portion includes a region that includes a component configured to generate heat.

公开(公告)号：US20210118764A1

公开(公告)日：2021-04-22

申请号：US17066083

申请日：2020-10-08

Applicant: QUALCOMM Incorporated

Inventor： Hung-Wen LIN ,  Sin-Shong WANG ,  Jen-Chun CHANG ,  Ajit Kumar VALLABHANENI ,  Keith WANG

IPC: H01L23/367 ,  H01L23/552 ,  G06F1/20 ,  G06F1/16

Abstract: An assembly comprising a substrate, a first integrated device coupled to the substrate, a second integrated device coupled to the substrate, a frame coupled to the substrate such that the frame at least partially surrounds the first integrated device and the second integrated device, and a step heat sink coupled to the frame, such that the step heat sink is located over the first integrated device and the second integrated device. The assembly may further include a shield coupled to the frame such that the shield is located between the frame and the step heat sink. The shield may include a step shield. The assembly may further include a heat pipe coupled to the step heat sink.

公开(公告)号：US20230099295A1

公开(公告)日：2023-03-30

申请号：US17485140

申请日：2021-09-24

Applicant: QUALCOMM Incorporated

Inventor： Arjang SHAHRIARI ,  Ajay VADAKKEPATT ,  Ajit Kumar VALLABHANENI ,  Melika ROSHANDELL ,  Mahdi NABIL ,  Mehdi SAEIDI ,  Paul PENZES

IPC: G02B26/00 ,  G09G3/34 ,  H01L23/473

Abstract: A device that includes a first integrated device, a second integrated device configured to be electrically coupled to the first integrated device and an electrowetting device configured to be electrically coupled to the second integrated device. The electrowetting device is configured to redistribute heat across a back surface of the device by looping a liquid in the electrowetting device, along the back surface of the device.

公开(公告)号：US20210373628A1

公开(公告)日：2021-12-02

申请号：US17094035

申请日：2020-11-10

Applicant: QUALCOMM Incorporated

Inventor： Hung-Wen LIN ,  Sin-Shong WANG ,  Keith WANG ,  Ajit Kumar VALLABHANENI ,  Jen-Chun CHANG

IPC: G06F1/20 ,  H05K7/20

Abstract: An electronic device that includes a first device portion, a second device portion coupled to the first device portion, and a uni-directional thermally conductive connector coupled to the first device portion and the second device portion. The first device portion comprises a region that includes a component configured to generate heat. The uni-directional thermally conductive connector is configured to dissipate heat away from the first device portion and towards the second device portion. The uni-directional thermally conductive connector includes a thermally conductive material that primarily dissipates heat along a first direction of the thermally conductive material.